Hi Victor,
>I have found interconnection failures in BGA, the failure will be:  Fracture
in the bulb >solder, IMC region or nickel plating.
We are in full agreement--please note that IMC region is not within the IMC,
however. Because thise region is very thin, FMA needs to be done very
carefully--it makes a big difference whether the failure is interfacial
[resulting from poor wetting or weak metallization layer attachments] or in
the solder (even directly next to the IMC but with solder on both fracture
surfaces) [resulting from thermal expansion difference].

Werner Engelmaier

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