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Date: | Wed, 11 Dec 96 17:16:15 cst |
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Hi Alex-
I don't use any given set of rules but more a rule of thumb. The more
layers the PWA contains the easier it is to not drop the components
off the backside/bottom side. My thermal characterization runs have
shown that the board inner layers absorb the reflow heat thus keeping
the PWA surface from heating up over the 183C mark - i.e. the more
inner layers easier to keep parts in place. The PWA thickness has an
effect too but not nearly as influential as the number of inner
layers. Have fun.
Dave Hillman
Rockwell Collins
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Subject: # of Layers?
Author: [log in to unmask] at ccmgw1
Date: 12/10/96 5:50 PM
Dave/ Rockwell Collins
Can you elaborate more on the response you gave concerning "SMT
components on both sides of PCB"
<< some assemblies are hard to do both sides due to design issues (# of
layers)>>
What is the rules you use as far the # of layer is concerned?
Thank you Dave
Alex Basauri
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