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Date: | Sun, 15 Dec 96 09:43:15 cst |
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Good Morning TechNet!
Your method of conducting a solderability test should not change just
because you are not using a tin/lead finish! I suggest using one of
the tests in ANSIJ-STD-003. With the emergence of the new alternative
finishes (e.g. gold, silver, palladium) the specifications are still
playing catch-up but the basic test methods are still applicable. You
may need to change a dwell time because of dissolution rates (e.g.
palladium) or may want to use a different flux because of your process
(e.g. OSP type finishes) - work with your pwb vendor to have an
acceptable test procedure both groups can use. I only have one
reference in my pile of papers that discusses the relationship of
solderability and E nickel but it's pretty good. Try:
"Factors Influencing Solderability Of Electroless Ni-P Deposits", Jing
Fang, Plating & Surface Finishing, pages 44-47, July 1992.
Good Luck
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: solderability test for ENIG PCB finish
Author: [log in to unmask] at ccmgw1
Date: 12/13/96 10:44 PM
Dear Technetters,
What is a quick, easy & effective way of assessing
solderability/ wettability of a PCB with electroless nickel/immersion gold
(ENIG) finish? How does phosphorus content in the Ni deposits affect
solderability? Will a lower %P content in Ni be more prone to
passivation/oxidation & thus affecting solderability??
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