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Date: | Tue, 24 Jul 2007 10:13:25 -0700 |
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Good morning All.
One of our CMs is experiencing either non-wetting and/or dewetting on
the end cap(s) of some 0402 capacitors provided by 2 different
manufacturers. One Cap manufacturer plates using Sn90Pb10 and the other
plates using SN95Pb5. The smt CM is using Kester Hydromark 531 WS,
Sn63Pb37 paste. The profile is obviously a SnPb type profile.
Samples of each caps were sent to an outside lab for a solderability
test and both failed a Dip and Look Solderability test per J-STD-002B -
see attachments. However, both Cap providers informed us that their
samples passed their Dip and Look solderability test.
Question -- Subsequent smt runs using the same paste type and profile
but with "pure tin" plated capacitors showed no evidence of either
wetting or de-wetting, which begs the question, what is different about
these Caps that cause the wetting/dewetting issues. Plating?????
Look forward to anyone's comments, experience, etc... People either
think it is capacitor issue or a smt process issue. thanks
-Joe
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