Good morning All. One of our CMs is experiencing either non-wetting and/or dewetting on the end cap(s) of some 0402 capacitors provided by 2 different manufacturers. One Cap manufacturer plates using Sn90Pb10 and the other plates using SN95Pb5. The smt CM is using Kester Hydromark 531 WS, Sn63Pb37 paste. The profile is obviously a SnPb type profile. Samples of each caps were sent to an outside lab for a solderability test and both failed a Dip and Look Solderability test per J-STD-002B - see attachments. However, both Cap providers informed us that their samples passed their Dip and Look solderability test. Question -- Subsequent smt runs using the same paste type and profile but with "pure tin" plated capacitors showed no evidence of either wetting or de-wetting, which begs the question, what is different about these Caps that cause the wetting/dewetting issues. Plating????? Look forward to anyone's comments, experience, etc... People either think it is capacitor issue or a smt process issue. thanks -Joe --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------