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September 2006

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Subject:
From:
"Gary M. Koven" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Fri, 15 Sep 2006 09:54:12 -0400
Content-Type:
text/plain
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text/plain (54 lines)
Gentlemen,

I was wondering if any of you have been asked to convert your HASL/HAL
non-BGA boards to ENIG for RoHS/process reasons in Asia, and if so, did
product cost increase?

I am making three assumptions against the change:

1. Cost - ENIG boards cost more than HASL/HAL boards. (BGA boards require
ENIG because HASL/HAL cannot produce sufficient flatness to solder the BGA
balls reliably)

2. Shelf life of HASL/HAL boards is longer than shelf life of ENIG boards.

3. Not all assemblers have gone full RoHS yet, particularly in the USA, and
are continuing to deliver reliable product with lead based solder.

I am also making three assumptions in favor of the change:

4. In Asia, the cost difference between ENIG and HASL/HAL may be approaching
zero.

5. In Asia, JIT may have trumped shelf life.

6. In Asia, most assemblers may have gone full RoHS.

My company designs low and medium volume Class 2 product.  Some are
assembled in the USA and some are assembled in Asia.

Therefore I have recommended we continue with HASL/HAL for boards without
BGAs, and ENIG for boards with BGAs.  However, as a concession to RoHS, I'm
revising my boilerplate HASL drawing notes to allow HAL along with HASL.

Please correct any mis-statements I may have made in my assumptions about
the current genesis of globality with respect to these issues in the USA and
Asia.

TIA and Best Regards,

===========================
Gary M. Koven, C.I.D.
Dynazign, Inc.
Charlotte, NC, USA
Veteran of the Marsh School

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