We build a mixed technology board here with bottom side SMT (SOTs, small
chips, all laid out not to solder, ie..90 out from each other) and get very
poor yield from wave  (chip + lamda) solder.  We print the adhesive on, P&P,
cure, stuff, wave then TOUCH UP.  My question is: what about printing paste,
dispensing glue (or vice versa), P&P, reflow/cure, stuff, then wave?  Will
having an existing joint make life easier on wave skips, or will the wave
disturb the skipped joints to the point of needing touch up?

Haven't tried it yet because our dispenser is down,
Mike Sewell

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