Hi Justin



I agree with Rick, this is an ENIG skip-plating defect.  I suggest you 

reject the defective parts to the PCB supplier and 100% visually inspect 

all affected lots to screen out the problem. 



In practice, this type of defect can occur randomly (usually due to 

handling-related contamination) or systematically (usually due to 

soldermask residue on pads before ENIG). If multiple defects are found the 

supplier should make an 8-D CAR including the manufacturing and QA issues 

- why didn't their FQC find this?



It may be possible to rework defective assembled units by hand soldering 

since the copper pads should be solderable by any alloy used for ENIG.



Regards, 



C.B. Katzko  嘉仕高

Research + Development

Meadville Group

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mobile    +86 13817362590



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rick chen <[log in to unmask]> 

发件人:  TGAsia <[log in to unmask]>

2008/09/03 08:50

请答复 给

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主题

Re: [TGA] Found abnormity on the solder pad













Hi Justin,

 

I think it was skip plating problem of ENIG,you can refer to IPC-4552.

 

BR

Rick



From: TGAsia [mailto:[log in to unmask]] On Behalf Of justin

Sent: Tuesday, September 02, 2008 5:50 PM

To: [log in to unmask]

Subject: Re: [TGA] Found abnormity on the solder pad

 

Hi All,

 

We have found some abnormities on the solder pad as attached photos shown. 

Would you please help to advise they are OK or not? Can we track to any 

standards because I no found any warranties from IPC-A-600G and 

IPC-A-610D?

 

Thanks and best regards,

Justin Wu

Utilux South China Ltd

Phone: +86-755-2850 7521

Fax:     +86-755-2850 0927

E-mail Address: [log in to unmask]

www.utiluxchina.com