Hi Justin

I agree with Rick, this is an ENIG skip-plating defect.  I suggest you 
reject the defective parts to the PCB supplier and 100% visually inspect 
all affected lots to screen out the problem. 

In practice, this type of defect can occur randomly (usually due to 
handling-related contamination) or systematically (usually due to 
soldermask residue on pads before ENIG). If multiple defects are found the 
supplier should make an 8-D CAR including the manufacturing and QA issues 
- why didn't their FQC find this?

It may be possible to rework defective assembled units by hand soldering 
since the copper pads should be solderable by any alloy used for ENIG.

Regards, 

C.B. Katzko  嘉仕高
Research + Development
Meadville Group
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mobile    +86 13817362590

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rick chen <[log in to unmask]> 
发件人:  TGAsia <[log in to unmask]>
2008/09/03 08:50
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Re: [TGA] Found abnormity on the solder pad






Hi Justin,
 
I think it was skip plating problem of ENIG,you can refer to IPC-4552.
 
BR
Rick

From: TGAsia [mailto:[log in to unmask]] On Behalf Of justin
Sent: Tuesday, September 02, 2008 5:50 PM
To: [log in to unmask]
Subject: Re: [TGA] Found abnormity on the solder pad
 
Hi All,
 
We have found some abnormities on the solder pad as attached photos shown. 
Would you please help to advise they are OK or not? Can we track to any 
standards because I no found any warranties from IPC-A-600G and 
IPC-A-610D?
 
Thanks and best regards,
Justin Wu
Utilux South China Ltd
Phone: +86-755-2850 7521
Fax:     +86-755-2850 0927
E-mail Address: [log in to unmask]
www.utiluxchina.com