I agree with Rick, this is an ENIG skip-plating
defect. I suggest you reject the defective parts to the PCB supplier
and 100% visually inspect all affected lots to screen out the problem.
In practice, this type of defect can
occur randomly (usually due to handling-related contamination) or systematically
(usually due to soldermask residue on pads before ENIG). If multiple defects
are found the supplier should make an 8-D CAR including the manufacturing
and QA issues - why didn't their FQC find this?
It may be possible to rework defective
assembled units by hand soldering since the copper pads should be solderable
by any alloy used for ENIG.
Regards,
C.B. Katzko 嘉仕高
Research + Development
Meadville Group
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I think it was skip plating
problem of ENIG,you can refer to IPC-4552.
BR
Rick
From: TGAsia [mailto:[log in to unmask]]
On Behalf Of justin
Sent: Tuesday, September 02, 2008 5:50 PM
To:[log in to unmask]
Subject: Re: [TGA] Found abnormity on the solder pad
Hi All,
We have found some abnormities
on the solder pad as attached photos shown. Would you please help to advise
they are OK or not? Can we track to any standards because I no found any
warranties from IPC-A-600G and IPC-A-610D?
Thanks and best regards,
Justin Wu
Utilux South China Ltd
Phone: +86-755-2850 7521
Fax: +86-755-2850
0927
E-mail Address: [log in to unmask] www.utiluxchina.com