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July 1997

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                           Subject:                         Time:   1:08 PM
                           FAB:                             Date:   7/25/97

Hi:

I am looking for photoresist can survive the direct plating process (PH=1~2
and =10~11 during operation steps) or E-less plating process.  In the other
words, Is it possible to selectively plate copper by using direct plating or
e-less plating.(I know this approach sounds un-usual)

Thanks for suggestion.


Bill Chou
Fujitsu Computer Packaging Technologies,Inc.
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(408)943-7721
fax: (408)943-7790

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