Subject: Time: 1:08 PM FAB: Date: 7/25/97 Hi: I am looking for photoresist can survive the direct plating process (PH=1~2 and =10~11 during operation steps) or E-less plating process. In the other words, Is it possible to selectively plate copper by using direct plating or e-less plating.(I know this approach sounds un-usual) Thanks for suggestion. Bill Chou Fujitsu Computer Packaging Technologies,Inc. [log in to unmask] (408)943-7721 fax: (408)943-7790 *************************************************************************** * TechNet mail list is provided as a service by IPC using SmartList v3.05 * *************************************************************************** * To subscribe/unsubscribe send a message <to: [log in to unmask]> * * with <subject: subscribe/unsubscribe> and no text in the body. * *************************************************************************** * If you are having a problem with the IPC TechNet forum please contact * * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] * ***************************************************************************