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Date: | Thu, 17 Jan 2008 13:38:21 -0600 |
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Hi Werner - Yep, we do have that information. The solderability of the
SnCu IMC's (e.g. Cu3Sn and Cu6Sn5) is documented in the book The
Mechanics of Solder Alloy Wetting & Spreading, Yost, Hosking, Frear, ISBN
0-442-01752-9 (data from NIST and Rockwell) using both wetting balance and
SERA analysis techniques. Just my opinion, but I believe much of the
data/discussions/conclusions in those data sets is applicable to the Au/Sn
IMC phase.
Dave
Werner Engelmaier /* <[log in to unmask]>
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Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic
Hi All,
We know that Cu6Sn5 is non-solderable after oxidation. However, I do not
know
whether we really KNOW that it is solderable prior to that, and we know
even
less about the solderability of AuSn4, Ag3Sn, or for that matter Sn3Ni4.
Werner
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