Hi Werner - Yep, we do have that information. The solderability of the SnCu IMC's (e.g. Cu3Sn and Cu6Sn5) is documented in the book The Mechanics of Solder Alloy Wetting & Spreading, Yost, Hosking, Frear, ISBN 0-442-01752-9 (data from NIST and Rockwell) using both wetting balance and SERA analysis techniques. Just my opinion, but I believe much of the data/discussions/conclusions in those data sets is applicable to the Au/Sn IMC phase. Dave Werner Engelmaier /* <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 01/17/2008 09:36 AM Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to [log in to unmask] To [log in to unmask] cc Subject Re: [TN] SV: [TN] SV: [TN] Solderability of Tin-Gold Intermetallic Hi All, We know that Cu6Sn5 is non-solderable after oxidation. However, I do not know whether we really KNOW that it is solderable prior to that, and we know even less about the solderability of AuSn4, Ag3Sn, or for that matter Sn3Ni4. Werner ************** Start the year off right. Easy ways to stay in shape. http://body.aol.com/fitness/winter-exercise?NCID=aolcmp00300000002489 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------