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October 2000

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Subject:
paste area for case on a to 263 5 lead part
From:
"Flick, Leo" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Oct 2000 11:39:54 -0400
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hi

our production is questioning the size of the land for solder paste for a
to263 5 lead part. they fear that there will be too much paste in that area.
the pad for the case is .410 x .425 and we specified the same size clearance
for the solder paste. their suggestion is to use two smaller rectangles
instead of one large square surface.

any suggestions or comments ?
thank you

Leo Flick or Dave Kissinger
DRS Communications Company
1200 E.  Mermaid Lane, Wyndmoor, PA 19038
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