hi
our production is
questioning the size of the land for solder paste for a to263 5 lead part. they fear that there will be
too much paste in that area. the pad for the case is .410 x .425 and we
specified the same size clearance for the solder paste. their suggestion is
to use two smaller rectangles instead of one large square
surface.
any suggestions or comments
?
thank
you
Leo Flick or Dave
Kissinger