hi our production is questioning the size of the land for solder paste for a to263 5 lead part. they fear that there will be too much paste in that area. the pad for the case is .410 x .425 and we specified the same size clearance for the solder paste. their suggestion is to use two smaller rectangles instead of one large square surface. any suggestions or comments ? thank you Leo Flick or Dave Kissinger DRS Communications Company 1200 E. Mermaid Lane, Wyndmoor, PA 19038 [log in to unmask] <mailto:[log in to unmask]> [log in to unmask] <mailto:[log in to unmask]>