Sender: |
|
X-To: |
|
Date: |
Wed, 6 Sep 2006 23:05:14 +0200 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
8bit |
Content-Type: |
text/plain; format=flowed; charset="UTF-8"; reply-type=original |
From: |
|
Parts/Attachments: |
|
|
Bad pull force?
Inge
----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 05, 2006 3:50 PM
Subject: Re: [TN] Pad pull force
In a message dated 9/5/06 0:45:08, [log in to unmask] writes:
> Is there a standard that defines a minimum pull force requirement after
> the
> component has been soldered.
> A: No, there is no such standard. A properly wetted solder joint is
> stronger
than the attachment of the soldering pads to the PCB/component resin matrix.
> The issue is, to get a better joint we had introduced extra solder to the
> component (confirms to IPC-610D).
> A: Why do you think that more solder will give you a "better joint"? What
does better mean?
> Do we have a minimum pull force value which can be adopted so
> that we can give assurance to customer that there will be no issue with
> joints.
> A: Solder joint issues come from either low quality—meaning inadequate
metalurgical bond due to insufficient wetting; or from creep-fatigue which
is not
very dependent on solder joint volume. So, you are reallly asking the wrong
question.
Werner
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|