Bad pull force? Inge ----- Original Message ----- From: "Werner Engelmaier" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, September 05, 2006 3:50 PM Subject: Re: [TN] Pad pull force In a message dated 9/5/06 0:45:08, [log in to unmask] writes: > Is there a standard that defines a minimum pull force requirement after > the > component has been soldered. > A: No, there is no such standard. A properly wetted solder joint is > stronger than the attachment of the soldering pads to the PCB/component resin matrix. > The issue is, to get a better joint we had introduced extra solder to the > component (confirms to IPC-610D). > A: Why do you think that more solder will give you a "better joint"? What does better mean? > Do we have a minimum pull force value which can be adopted so > that we can give assurance to customer that there will be no issue with > joints. > A: Solder joint issues come from either low quality—meaning inadequate metalurgical bond due to insufficient wetting; or from creep-fatigue which is not very dependent on solder joint volume. So, you are reallly asking the wrong question. Werner --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------