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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 23 Nov 1999 00:00:06 +0800 |
Content-Type: | multipart/alternative |
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Hello,
Can anyone help to answer the following questions about Surface Insulation Test:
1) I found that all SIR test results showed dramastically decrease in resistance reading after placing the test coupons into the chamber. However, i found some test results showed increase in resistance gradually after a period of time the coupons in chamber, may be after 24 hours or 2 days. While some test results showed continuously decrease in resistance. Can anyone answer this?
2) I have been advised that we must take afford to prevent condensation inside chamber during testing, why?
3) I had experienced that the flux used for wire bonding would degrade the test result, so sometimes, i would not use flux for bonding when it is solder finish. However, if it is bare copper, problem would happen, can anyone advise some method for this?
Thanks
Leecp
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