Hello, Can anyone help to answer the following questions about Surface Insulation Test: 1) I found that all SIR test results showed dramastically decrease in resistance reading after placing the test coupons into the chamber. However, i found some test results showed increase in resistance gradually after a period of time the coupons in chamber, may be after 24 hours or 2 days. While some test results showed continuously decrease in resistance. Can anyone answer this? 2) I have been advised that we must take afford to prevent condensation inside chamber during testing, why? 3) I had experienced that the flux used for wire bonding would degrade the test result, so sometimes, i would not use flux for bonding when it is solder finish. However, if it is bare copper, problem would happen, can anyone advise some method for this? Thanks Leecp