Hello,
Can anyone help to answer the following questions
about Surface Insulation Test:
1) I found that all SIR test results showed dramastically
decrease in resistance reading after placing the test coupons into the
chamber. However, i found some test results showed increase in resistance
gradually after a period of time the coupons in chamber, may be after 24 hours
or 2 days. While some test results showed continuously decrease in
resistance. Can anyone answer this?
2) I have been advised that we must take afford to prevent
condensation inside chamber during testing, why?
3) I had experienced that the flux used for wire bonding would
degrade the test result, so sometimes, i would not use flux for bonding when it
is solder finish. However, if it is bare copper, problem would happen, can
anyone advise some method for this?
Thanks
Leecp