TECHNET Archives

August 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
Subject:
From:
TPE Engineering TechNet <[log in to unmask]>
Date:
Wed, 18 Aug 1999 11:19:03 -0700
Content-Type:
text/plain
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, TPE Engineering TechNet <[log in to unmask]>
Parts/Attachments:
text/plain (27 lines)
I agree with Patricia whole heartedly. However, due to the
complexity of todays product, with lines and spaces going
down to 3/3 and less, it may also be time to take a look at
the requirements placed on our laminate and other material
suppliers. Small dents and epoxy spots (acceptable to IPC
requirements) on copper clad laminate which may not have
been an issue in the past on 10 mil lines and spaces, are
definately an issue with todays 3 mil and less technologies.

Ron Hayashi
1-858-695-2222
[log in to unmask]

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2