TECHNET Archives

January 2020

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Jerry Dengler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jerry Dengler <[log in to unmask]>
Date:
Fri, 10 Jan 2020 07:53:07 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (40 lines)
TechNetters,

 

We reviewed documentation from a flexible PCB manufacturer and saw that
they recommend baking of the flex boards prior to assembly even if they
are brand new boards in a Moisture Barrier Bag.

 

Why wouldn't these be handled like any other moisture sensitive
component?

 

How many of you that work with flexible PCBs are baking them even if
they come out of a MBB with A HIC card that shows no real moisture?

 

Thank You,

 

Jerry Dengler

Production Manager

Pergamon Corporation

380 Crooked Lane, Unit# 3

King of Prussia, PA  19406-2567

U.S.A.

(610) 239-0721 Phone

 

ATOM RSS1 RSS2