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January 2003

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Subject:
From:
Sherif Refaat <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Jan 2003 10:35:21 -0500
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Hi Technetters,

I've got a situation here where boards coated with Immersion Silver were partly assembled before the Holidays and the assembly was completed this week. So, the boards were left in the factory, uncontrolled environment, for over two weeks. The circuitry on the side that was assembled first exhibits oxidation. The oxidations does not allow the In-Circuit test probes to have good contact with the test pads, hence causing lots of false opens. 

Any recommendations regarding how to remove Immersion Silver oxidation from assembled boards? The Immersion Silver Chemistry supplier is located overseas and because of the time difference I can not get an immediate answer. I heard about a more pointy test probes that may be able to penetrate the oxidation but the factory does not accept this solution. 

Can any one help?

Thanks in advance.

Sherif,
 

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