Hi Technetters,

I've got a situation here where boards coated with Immersion Silver were partly assembled before the Holidays and the assembly was completed this week. So, the boards were left in the factory, uncontrolled environment, for over two weeks. The circuitry on the side that was assembled first exhibits oxidation. The oxidations does not allow the In-Circuit test probes to have good contact with the test pads, hence causing lots of false opens. 

Any recommendations regarding how to remove Immersion Silver oxidation from assembled boards? The Immersion Silver Chemistry supplier is located overseas and because of the time difference I can not get an immediate answer. I heard about a more pointy test probes that may be able to penetrate the oxidation but the factory does not accept this solution. 

Can any one help?

Thanks in advance.

Sherif,
 

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------