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August 2003

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From:
"Wenger, George M." <[log in to unmask]>
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Date:
Mon, 11 Aug 2003 11:08:10 -0500
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Ioan,
 
I haven't had to clean up BGA sites on boards but I've examined lots of BGA sites that were cleaned up and can tell you that a soldering iron and solder-wick can work but it is too dependent on who is doing the site clean up.  Most times operators are "too heavy handed" and suck away all of the what I refer to as "Fresh Solderable Tin-Lead" and leave behind copper-tin (or nickel-tin in the case of ENIG boards) intermetallic which oxidizes because it is now at the surface.  The oxidized intermetallic is extremely difficult to solder.
 
Joe is correct, using a solder sucking mechanism does a nice repeatable job of cleaning up pads.  It removes most of the solder but leaves behind enough "Fresh solderable Tin-Lead" to insure the pads are solderable when you attach a new BGA.
 

Regards, 
George 

George M. Wenger (908)-546-4531 
Reliability Engineer 
RF Power Amplifier Group 
Andrew Corporation,  40 Technology Drive, Warren, NJ 07059 
[log in to unmask] 

-----Original Message-----
From: Macko, Joe @ IEC [mailto:[log in to unmask]]
Sent: Monday, August 11, 2003 10:38 AM
To: [log in to unmask]
Subject: Re: [TN] Cleaning of BGA sites after component removal



Ioan, 

We have cleaned hundred's of BGA site with no problems using the standard cleaning tool designed by AIR-VAC .  The tool is like a solder sucker which does not contact the board.  The BGA sites are cleaned immediately after component removal using an AIR-VAC DRS24 rework station.  

We have also tried solder wick but as you have found out, it will damage the solder mask and or pads. 

joe 

-----Original Message----- 
From: Tempea, Ioan [ mailto:[log in to unmask]] 
Sent: Friday, August 08, 2003 8:45 AM 
To: [log in to unmask] 
Subject: [TN] Cleaning of BGA sites after component removal 


Hi Technos, 

I don't know why, but lately we get more BGA rework contracts. Some 
customers come with batches of 40 boards, which I find huge for rework lots. 

And we noticed that it takes a lot of time and solder wick to clean the 
pads. Not to mention the scratched solder mask and the pads coming out of
the substrate. 

What other cleaning methods or tools are there? 

Many thanks, 
Ioan 

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