Regards,
George
George M. Wenger (908)-546-4531
Reliability Engineer
RF
Power Amplifier Group
Andrew
Corporation, 40 Technology Drive, Warren, NJ 07059
[log in to unmask]
-----Original Message-----
From: Macko, Joe @ IEC [mailto:[log in to unmask]]
Sent: Monday, August 11, 2003 10:38 AM
To: [log in to unmask]
Subject: Re: [TN] Cleaning of BGA sites after component removalIoan,
We have cleaned hundred's of BGA site with no problems using the standard cleaning tool designed by AIR-VAC . The tool is like a solder sucker which does not contact the board. The BGA sites are cleaned immediately after component removal using an AIR-VAC DRS24 rework station.
We have also tried solder wick but as you have found out, it will damage the solder mask and or pads.
joe
-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: Friday, August 08, 2003 8:45 AM
To: [log in to unmask]
Subject: [TN] Cleaning of BGA sites after component removal
Hi Technos,
I don't know why, but lately we get more BGA rework contracts. Some
customers come with batches of 40 boards, which I find huge for rework lots.And we noticed that it takes a lot of time and solder wick to clean the
pads. Not to mention the scratched solder mask and the pads coming out of
the substrate.What other cleaning methods or tools are there?
Many thanks,
Ioan---------------------------------------------------
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