Bev,
One of the reasons there isn't a specification for gold plating thickness on component leads is because solder assembly engineers would like it to be zero and the packagers doing internal wire bonding would like it to be a couple of hundred microinches thick. Most packages I've come across have 150 +/- 50 micro inches of gold
Regards,
George
George M. Wenger (908)-546-4531
Reliability Engineer
RF Power Amplifier Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059
[log in to unmask]
-----Original Message-----
From: Dave Hillman [mailto:[log in to unmask]]
Sent: Wednesday, August 06, 2003 1:40 PM
To: [log in to unmask]
Subject: Re: [TN] Gold thickness
Hi Bev - if you find a specification that defines the gold plating
thickness let me know - I have also searched but have come up empty. Some
of the component fabricators can not even tell you if a component will have
gold or tin/lead as their manufacturing locations are setup for one or the
other but not both finishes. Sometimes an internal specification can add
some predictability but not always. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
Bev Christian
<[log in to unmask] To: [log in to unmask]
ET> cc:
Sent by: TechNet Subject: [TN] Gold thickness
<TechNet@listserv
.ipc.org>
08/06/2003 10:23
AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to Bev
Christian
TechNetters,
I have checked the archives and can find no answer to this question. Is
there a standard (JEDEC, IEC, etc.) for gold thickness ON COMPONENT leads?
I am NOT asking about boards. Thanks.
regards,
Bev Christian
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