Hi technetters:

 I have a  problem with solder bridges in the PBGA  after  the reflow oven  so  I checked   the basic  process .
PCB :  WITH 6 BGA TOP SIDE 
PCB FINISHED : ENIG 
SOLDER HEIGHT  : 6.5 mils 
STENCIL THIKNESS : 6.0  MILS 
STENCIL CLEANNING :  OK 
HUMIDITY INSIDE  THE DEK :  35 % 
 PRINTING  PROCESS : OK 
TEMPERATURE  : 25ºC 
PROFILE :  PEAK TEMPERATURE  212 ºC
                  REFLOW TIME : 60 SEC . 

And  the printing process looks well , also I checked  the placement  in the X ray  before reflow oven an looks well  and  after the reflow oven    appear the solder shorts in just one PBGA   the other  5 PBGA   not defect found . 

Any and all suggestions appreciated.

 Regards .

Let´s stay in touch 
 
 Arturo Medellín



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