Hi technetters:
I have a problem with solder bridges in
the PBGA after the reflow oven so I checked
the basic process .
PCB : WITH 6 BGA TOP SIDE
PCB FINISHED : ENIG
SOLDER HEIGHT : 6.5 mils
STENCIL THIKNESS : 6.0 MILS
STENCIL CLEANNING : OK
HUMIDITY INSIDE THE DEK : 35 %
PRINTING PROCESS : OK
TEMPERATURE : 25ºC
PROFILE : PEAK TEMPERATURE 212
ºC
REFLOW
TIME : 60 SEC .
And the printing process looks well , also I
checked the placement in the X ray before reflow oven an
looks well and after the reflow oven appear the
solder shorts in just one PBGA the other 5
PBGA not defect found .
Any and all
suggestions appreciated.
Regards
.
Let´s stay in touch
Arturo Medellín
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