Hi technetters: I have a problem with solder bridges in the PBGA after the reflow oven so I checked the basic process . PCB : WITH 6 BGA TOP SIDE PCB FINISHED : ENIG SOLDER HEIGHT : 6.5 mils STENCIL THIKNESS : 6.0 MILS STENCIL CLEANNING : OK HUMIDITY INSIDE THE DEK : 35 % PRINTING PROCESS : OK TEMPERATURE : 25ºC PROFILE : PEAK TEMPERATURE 212 ºC REFLOW TIME : 60 SEC . And the printing process looks well , also I checked the placement in the X ray before reflow oven an looks well and after the reflow oven appear the solder shorts in just one PBGA the other 5 PBGA not defect found . Any and all suggestions appreciated. Regards . Let´s stay in touch Arturo Medellín --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------