Here is the agenda I have drafted for the call tomorrow.   Sorry that two 
speaker efforts have fallen through for tomorrow, but we need to follow up 
on Expo/Apex, and we can discuss the industry input to the iNEMI roadmap 
for 2006 from their product emulator groups.  I will try to post that 
input to the EPUG site by tomorrow mid morning.   Just as food for 
thought, here are two recent Japanese announcements that we can discuss, 
also.  I have more on the Casio presentation and will post it by tomorrow, 
also. 

5.      DNP - Dai Nippon Printing (Major printing company in Japan) 2/8
Has started the industry first volume production of the embedded passive 
multi-layer boards produced by Bt2 technology. 
Dai Nippon to Make PC Boards Embedded with Passive Devices
Tokyo, Jan. 17 (Jiji Press)--Dai Nippon Printing Co. said Tuesday that it 
will begin in April mass-producing printed circuit boards embedded with 
passive devices, such as capacitors and resistors.
The first domestic mass production of parts-embedded PC boards is in 
response to the need for smaller digital devices, such as mobile phones, 
notebook computers and digital still cameras.
The new product, for instance, can reduce the size of a fingerprint 
identification module by 20 pct, the company said.
The company will initially produce 20 million units a month at its Kuki 
plant in Saitama Prefecture, north of Tokyo. It is targeting sales of one 
billion yen for fiscal 2006 starting in April.



9.      Casio (Major electronics company in Japan) 2/8
Will organize a new technical consortium ?EWLP (Embedded Wafer Level 
Package)? with CMK to expand the applications.