Here is the agenda I have drafted for
the call tomorrow. Sorry that two speaker efforts have fallen through
for tomorrow, but we need to follow up on Expo/Apex, and we can discuss
the industry input to the iNEMI roadmap for 2006 from their product emulator
groups. I will try to post that input to the EPUG site by tomorrow
mid morning. Just as food for thought, here are two recent Japanese
announcements that we can discuss, also. I have more on the Casio
presentation and will post it by tomorrow, also.
5. DNP
- Dai Nippon Printing (Major printing company in Japan) 2/8
Has started the industry first
volume production of the embedded passive multi-layer boards produced by
Bt2 technology.
Dai Nippon to Make PC Boards Embedded with
Passive Devices
Tokyo, Jan. 17 (Jiji Press)--Dai
Nippon Printing Co. said Tuesday that it will begin in April mass-producing
printed circuit boards embedded with passive devices, such as capacitors
and resistors.
The first domestic mass production
of parts-embedded PC boards is in response to the need for smaller digital
devices, such as mobile phones, notebook computers and digital still cameras.
The new product, for instance, can
reduce the size of a fingerprint identification module by 20 pct, the company
said.
The company will initially produce
20 million units a month at its Kuki plant in Saitama Prefecture, north
of Tokyo. It is targeting sales of one billion yen for fiscal 2006 starting
in April.
9. Casio
(Major electronics company in Japan) 2/8
Will organize a new technical consortium
“EWLP (Embedded Wafer Level Package)” with CMK to expand the applications.