Subject: | |
From: | |
Reply To: | |
Date: | Tue, 21 Feb 2006 15:03:15 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
I will be on travel and unable to participate.
Mike Luke
Raytheon
Dennis Fritz
<dfritz@MACDERMID
.COM> To
Sent by: [log in to unmask]
EmbeddedNet cc
<[log in to unmask]
ORG> Subject
[EM] Embedded Passive Users Group
call - tomorrow, February 22
02/21/06 12:40 PM
Please respond to
D-50 Embedded
Devices Committee
Forum
<[log in to unmask]
ORG>; Please
respond to
Dennis Fritz
<dfritz@MACDERMID
.COM>
Here is the agenda I have drafted for the call tomorrow. Sorry that two
speaker efforts have fallen through for tomorrow, but we need to follow up
on Expo/Apex, and we can discuss the industry input to the iNEMI roadmap
for 2006 from their product emulator groups. I will try to post that input
to the EPUG site by tomorrow mid morning. Just as food for thought, here
are two recent Japanese announcements that we can discuss, also. I have
more on the Casio presentation and will post it by tomorrow, also.
5. DNP - Dai Nippon Printing (Major printing company in Japan) 2/8
Has started the industry first volume production of the embedded passive
multi-layer boards produced by Bt2 technology.
Dai Nippon to Make PC Boards Embedded with Passive Devices
Tokyo, Jan. 17 (Jiji Press)--Dai Nippon Printing Co. said Tuesday that it
will begin in April mass-producing printed circuit boards embedded with
passive devices, such as capacitors and resistors.
The first domestic mass production of parts-embedded PC boards is in
response to the need for smaller digital devices, such as mobile phones,
notebook computers and digital still cameras.
The new product, for instance, can reduce the size of a fingerprint
identification module by 20 pct, the company said.
The company will initially produce 20 million units a month at its Kuki
plant in Saitama Prefecture, north of Tokyo. It is targeting sales of one
billion yen for fiscal 2006 starting in April.
9. Casio (Major electronics company in Japan) 2/8
Will organize a new technical consortium “EWLP (Embedded Wafer Level
Package)” with CMK to expand the applications.
[attachment "Agenda - Embedded Passive Call 2 22 06.doc" deleted by Michael
G Luke/US/Raytheon]
|
|
|