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January 2017

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Subject:	Re: -EXT-Re: [DC] Via In Pad technology
From:	"Gebhardt, Bill" <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Tue, 24 Jan 2017 20:08:08 +0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

Thanks, Dave!  I will definitely look into it.



B/r,



Bill Gebhardt, C.I.D. +

PCB Designer

Mission Systems

General Atomics Aeronautical Systems, Inc.

Bldg A03-1381D

16761 Via Del Campo Ct

San Diego, CA  92127



Office: (858) 762-5035

Cell:  (909) 229-7824

Fax:  (858) 762-5939

Email:  [log in to unmask]



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-----Original Message-----

From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Dave Schaefer

Sent: Tuesday, January 24, 2017 9:56 AM

To: [log in to unmask]

Subject: -EXT-Re: [DC] Via In Pad technology



Type VII vias also offer improved thermal and electrical performance when properly specified.

Bare PCB piece cost is the only issue I know of for not specifying them.

I recommend having your vendor quote an existing design with and without VII vias.

I bet you'll be surprised at how cost effective they can be.



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