TECHNET Archives

December 2008

TechNet@IPC.ORG
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Wolfgang Erat (1 Message)
Wilson, Bob (8 Messages)
Whittaker, Dewey (EHCOE) (10 Messages)
Werner engelmaier (21 Messages)
Werner Engelmaier /* (2 Messages)
Werner engelmaier (3 Messages)
Wenger, George M. (2 Messages)
Victor Hernandez (8 Messages)
Thayer, Wayne (5 Messages)
Terry L. Munson (1 Message)
Terry Kozlyk (1 Message)
Temkin, Gregg (1 Message)
Ted Tontis (2 Messages)
Ted Stern (1 Message)
Tan Geok Ang (2 Messages)
Syed Ahmad (3 Messages)
Stewart, Dougal (1 Message)
Steve Kelly (2 Messages)
Steve Gregory (6 Messages)
Steve Creswick (2 Messages)
stephengregory5849 (1 Message)
Stadem, Richard D. (12 Messages)
Simonik, Dave R. (David) (1 Message)
Schaefer, Chris (1 Message)
SAHLI habib (2 Messages)
Rudolph yu (5 Messages)
roland jaquet (2 Messages)
Roger Stoops (1 Message)
Roberts, Jon (1 Message)
Robert Kondner (8 Messages)
Rex Waygood (3 Messages)
Randall L Bock (4 Messages)
R Sedlak (5 Messages)
Phillip Bavaro (8 Messages)
Phil Nutting (2 Messages)
Pete Houwen (3 Messages)
Paul Reid (4 Messages)
Paul Edwards (12 Messages)
Paul Carter (1 Message)
Oscar Fallah (1 Message)
Nieznanski, John A - SSD (3 Messages)
Nick Ban (3 Messages)
N Burtt (3 Messages)
Mike Fenner (2 Messages)
Michelle Michelotti (2 Messages)
Michael Kirschner (1 Message)
McGlaughlin, Jeffrey A (2 Messages)
Mark C. (1 Message)
Louis Hart (3 Messages)
Lee Whiteman (2 Messages)
kwood716 (1 Message)
Kim Sterling (2 Messages)
Kim O'Neil (1 Message)
Kevin Glidden (2 Messages)
Ken Bloomquist (2 Messages)
Kane, Joseph E (US SSA) (1 Message)
Joyce Koo (12 Messages)
John Goulet (8 Messages)
John Burke (12 Messages)
Joetech82 (1 Message)
Joe Fjelstad (10 Messages)
Jerry Dengler (1 Message)
Jeremias, Michael (3 Messages)
Jason Zhao (1 Message)
James Mahoney (5 Messages)
Jack Olson (2 Messages)
Inge (3 Messages)
Igoshev, Vladimir (7 Messages)
Ian Hanna (1 Message)
Hernefjord Ingemar (6 Messages)
Haynes, Kim (2 Messages)
Guy Ramsey (3 Messages)
Gumpert, Ben (1 Message)
Grunde Gjertsen (1 Message)
Graham Naisbitt (1 Message)
Graham Collins (1 Message)
Dwight Mattix (3 Messages)
Douglas Pauls (4 Messages)
Douglas O. Pauls (3 Messages)
Dougal Stewart (1 Message)
Donald Vischulis (1 Message)
Diamond, Patrick (1 Message)
Dennis Fritz (1 Message)
David Tremmel (6 Messages)
David D. Hillman (5 Messages)
Dave Connitt (3 Messages)
Dale Ritzen (2 Messages)
Creswick, Steven (3 Messages)
Craig Cullum (2 Messages)
Cong He (4 Messages)
Chuck Brummer (1 Message)
Brian Ellis (5 Messages)
Brian Chandler (1 Message)
Bobwillis (2 Messages)
Bob Perkins (1 Message)
Bill Campbell (1 Message)
Bev Christian (5 Messages)
Barbara Burcham (3 Messages)
Andy Price (1 Message)
Andy Ng (4 Messages)
Anat Douek (1 Message)
Ahne Oosterhof (3 Messages)
<Richard Edgar> (2 Messages)
<> (2 Messages)

Subject

From Sorted by Sender, Reverse Alphabetically

Date
New Sender Wolfgang Erat
Re: x-outs in panel
Wolfgang Erat
Mon, 22 Dec 2008 08:52:13 -0500
New Sender Wilson, Bob
x-outs in panel
Wilson, Bob
Wed, 17 Dec 2008 10:47:05 -0800
Re: x-outs in panel
Wilson, Bob
Wed, 17 Dec 2008 10:57:59 -0800
test post NTC
Wilson, Bob
Wed, 17 Dec 2008 13:35:14 -0800
Re: flux and board cleaning issues
Wilson, Bob
Tue, 16 Dec 2008 16:12:19 -0800
flux and board cleaning issues
Wilson, Bob
Tue, 16 Dec 2008 15:55:02 -0800
Re: axial lead bend
Wilson, Bob
Thu, 18 Dec 2008 13:31:37 -0800
Re: axial lead bend
Wilson, Bob
Thu, 18 Dec 2008 13:27:55 -0800
Re: axial lead bend
Wilson, Bob
Thu, 18 Dec 2008 13:25:49 -0800
New Sender Whittaker, Dewey (EHCOE)
Re: Solder mask removal
Whittaker, Dewey (EHCOE)
Thu, 11 Dec 2008 13:22:01 -0700
Re: QUESTION ON GULL WING COMPONENT LEAD CONFIGURATION ANOMALY
Whittaker, Dewey (EHCOE)
Wed, 10 Dec 2008 11:52:15 -0700
Re: NTC [TN] Alumina Substrate
Whittaker, Dewey (EHCOE)
Wed, 3 Dec 2008 14:31:49 -0700
Re: NTC [TN] Alumina Substrate
Whittaker, Dewey (EHCOE)
Wed, 3 Dec 2008 14:07:24 -0700
Re: My apologies
Whittaker, Dewey (EHCOE)
Wed, 3 Dec 2008 13:40:19 -0700
Materials
Whittaker, Dewey (EHCOE)
Thu, 4 Dec 2008 10:04:58 -0700
Re: Conformal Coat and Eddy Currents
Whittaker, Dewey (EHCOE)
Tue, 9 Dec 2008 13:20:50 -0700
Re: Conformal Coat and Eddy Currents
Whittaker, Dewey (EHCOE)
Tue, 9 Dec 2008 06:59:18 -0700
Re: Conformal Coat and Eddy Currents
Whittaker, Dewey (EHCOE)
Thu, 4 Dec 2008 12:45:23 -0700
Re: Conductive Epoxy filled Vias
Whittaker, Dewey (EHCOE)
Wed, 3 Dec 2008 10:30:52 -0700
New Sender Werner engelmaier
Re: Xbox360 BGAs NTC
Werner engelmaier
Thu, 11 Dec 2008 15:52:08 -0500
Re: Xbox360 BGAs
Werner engelmaier
Thu, 11 Dec 2008 18:26:54 -0500
Re: Xbox360 BGAs
Werner engelmaier
Wed, 10 Dec 2008 22:05:09 -0500
Re: Xbox360 BGAs
Werner engelmaier
Wed, 10 Dec 2008 16:21:26 -0500
Re: Xbox360 BGAs
Werner engelmaier
Wed, 10 Dec 2008 14:26:20 -0500
Re: Xbox360 BGAs
Werner engelmaier
Tue, 9 Dec 2008 21:11:29 -0500
Re: Xbox360 BGAs
Werner engelmaier
Tue, 9 Dec 2008 18:30:02 -0500
Re: Xbox360 BGAs
Werner engelmaier
Tue, 9 Dec 2008 01:00:59 -0500
Re: Xbox360 BGAs
Werner engelmaier
Mon, 8 Dec 2008 18:35:48 -0500
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Werner engelmaier
Mon, 22 Dec 2008 13:50:13 -0500
Re: to apply partition correction on individual daisy chains or not?
Werner engelmaier
Thu, 18 Dec 2008 19:13:00 -0500
Re: to apply partition correction on individual daisy chains or not?
Werner engelmaier
Thu, 18 Dec 2008 15:07:06 -0500
Re: to apply partition correction on individual daisy chains or not?
Werner engelmaier
Thu, 18 Dec 2008 13:38:16 -0500
Re: NTC [TN] Alumina Substrate
Werner engelmaier
Wed, 3 Dec 2008 18:44:30 -0500
Re: Lead free soldering
Werner engelmaier
Thu, 4 Dec 2008 18:31:46 -0500
Re: Fwd: Draft for IPC-4101C
Werner engelmaier
Thu, 4 Dec 2008 07:33:18 -0500
Fwd: Draft for IPC-4101C
Werner engelmaier
Wed, 3 Dec 2008 18:11:05 -0500
Re: Conductive Epoxy filled Vias
Werner engelmaier
Tue, 2 Dec 2008 10:38:10 -0500
Re: BGA soldering open issue
Werner engelmaier
Tue, 9 Dec 2008 18:04:51 -0500
Re: axial lead bend
Werner engelmaier
Thu, 18 Dec 2008 15:28:23 -0500
Re: ??: Re: [TN] BGA soldering open issue
Werner engelmaier
Mon, 8 Dec 2008 18:28:19 -0500
New Sender Werner Engelmaier /*
Draft for IPC-4101C
Werner Engelmaier /*
Mon, 1 Dec 2008 18:33:43 EST
Re: ??: Re: [TN] BGA soldering open issue
Werner Engelmaier /*
Fri, 5 Dec 2008 16:37:01 EST
New Sender Werner engelmaier
Re: 答复: Re: [TN] BGA soldering open issue
Werner engelmaier
Mon, 8 Dec 2008 18:25:38 -0500
Re: 答复: Re: [TN] BGA soldering open issue
Werner engelmaier
Fri, 5 Dec 2008 15:11:25 -0500
Re: 答复: Re: [TN] BGA soldering open issue
Werner engelmaier
Thu, 4 Dec 2008 23:14:14 -0500
New Sender Wenger, George M.
Re: ENIG thickness measurement
Wenger, George M.
Fri, 5 Dec 2008 11:30:04 -0500
Re: BGA soldering open issue
Wenger, George M.
Thu, 4 Dec 2008 21:57:25 -0500
New Sender Victor Hernandez
Re: RE: Xbox360 BGA issue
Victor Hernandez
Mon, 8 Dec 2008 07:12:05 -0600
Re: Stripping Magnet Wire
Victor Hernandez
Tue, 2 Dec 2008 10:16:55 -0600
DC IN connector plating
Victor Hernandez
Tue, 2 Dec 2008 09:11:15 -0600
Re: Cold Forged Alunium (CFA), Cross section-grain structure
Victor Hernandez
Fri, 12 Dec 2008 14:10:20 -0600
Cold Forged Alunium (CFA), Cross section-grain structure
Victor Hernandez
Fri, 12 Dec 2008 12:49:43 -0600
Re: ??: Re: [TN] BGA soldering open issue
Victor Hernandez
Mon, 8 Dec 2008 08:50:45 -0600
Re: ??: Re: [TN] BGA soldering open issue
Victor Hernandez
Mon, 8 Dec 2008 08:32:51 -0600
Re: ??: Re: [TN] BGA soldering open issue
Victor Hernandez
Fri, 5 Dec 2008 15:25:02 -0600
New Sender Thayer, Wayne
Re: x-outs in panel
Thayer, Wayne
Wed, 17 Dec 2008 17:31:10 -0500
Re: Underfill, inhibition due to leftover activators in the flux residue
Thayer, Wayne
Fri, 26 Dec 2008 15:02:58 -0500
Re: Underfill, inhibition due to leftover activators in the flux residue
Thayer, Wayne
Tue, 23 Dec 2008 12:43:37 -0500
Re: Conductive Epoxy filled Vias
Thayer, Wayne
Tue, 2 Dec 2008 14:05:44 -0500
Re: Alumina Substrate
Thayer, Wayne
Mon, 1 Dec 2008 12:26:26 -0500
New Sender Terry L. Munson
Re: flux and board cleaning issues
Terry L. Munson
Wed, 17 Dec 2008 20:28:03 -0500
New Sender Terry Kozlyk
Re: Xbox360 BGAs
Terry Kozlyk
Sat, 6 Dec 2008 07:26:20 -0700
New Sender Temkin, Gregg
Solder mask removal
Temkin, Gregg
Thu, 11 Dec 2008 11:33:26 -0800
New Sender Ted Tontis
Re: Conformal Coat and Eddy Currents
Ted Tontis
Thu, 4 Dec 2008 13:27:41 -0600
Re: Alumina Substrate
Ted Tontis
Mon, 1 Dec 2008 08:47:39 -0600
New Sender Ted Stern
Re: flux and board cleaning issues
Ted Stern
Thu, 18 Dec 2008 11:00:59 -0600
New Sender Tan Geok Ang
Re: What are the industrial standards for Solder paste printing limits?
Tan Geok Ang
Wed, 3 Dec 2008 10:38:17 +0800
Re: Season's Greetings
Tan Geok Ang
Tue, 16 Dec 2008 10:46:32 +0800
New Sender Syed Ahmad
Re: Underfill, inhibition due to leftover activators in the flux residue
Syed Ahmad
Wed, 24 Dec 2008 09:18:26 -0600
Re: NTC Engineers!
Syed Ahmad
Tue, 30 Dec 2008 09:43:41 -0600
Re: Holiday Eating Guide
Syed Ahmad
Wed, 24 Dec 2008 10:20:51 -0600
New Sender Stewart, Dougal
Re: Multilayer construction
Stewart, Dougal
Mon, 22 Dec 2008 14:42:56 -0000
New Sender Steve Kelly
Re: Shorts in flex,
Steve Kelly
Fri, 5 Dec 2008 10:06:42 -0500
Shorts in flex,
Steve Kelly
Thu, 4 Dec 2008 17:02:47 -0500
New Sender Steve Gregory
RE: Xbox360 BGA issue
Steve Gregory
Mon, 8 Dec 2008 07:03:08 -0600
Re: Solder mask removal
Steve Gregory
Thu, 11 Dec 2008 13:44:57 -0600
Re: SCreswick@Gentex Signing Off
Steve Gregory
Fri, 12 Dec 2008 06:50:59 -0600
NTC Christmas Greetings
Steve Gregory
Fri, 19 Dec 2008 08:29:06 -0600
Re: axial lead bend
Steve Gregory
Thu, 18 Dec 2008 14:36:27 -0600
Re: Alumina Substrate
Steve Gregory
Mon, 1 Dec 2008 08:51:18 -0600
New Sender Steve Creswick
Re: Season's Greetings
Steve Creswick
Mon, 15 Dec 2008 12:30:30 -0500
SCreswick@Gentex Signing Off
Steve Creswick
Fri, 12 Dec 2008 05:41:07 -0500
New Sender stephengregory5849
Re: Plated Copper Dissolution at the Knee/Lead Free Soldering
stephengregory5849
Mon, 15 Dec 2008 17:45:57 -0600
New Sender Stadem, Richard D.
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Stadem, Richard D.
Tue, 23 Dec 2008 15:38:22 -0600
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Stadem, Richard D.
Mon, 22 Dec 2008 13:25:44 -0600
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Stadem, Richard D.
Mon, 22 Dec 2008 13:22:42 -0600
Re: What are the industrial standards for Solder paste printing limits?
Stadem, Richard D.
Tue, 2 Dec 2008 14:22:49 -0600
Re: What are the industrial standards for Solder paste printing limits?
Stadem, Richard D.
Tue, 2 Dec 2008 07:19:29 -0600
Re: Underfill, inhibition due to leftover activators in the flux residue
Stadem, Richard D.
Tue, 23 Dec 2008 08:14:58 -0600
Re: flux and board cleaning issues
Stadem, Richard D.
Thu, 18 Dec 2008 08:10:06 -0600
Re: Conformal Coat and Eddy Currents
Stadem, Richard D.
Thu, 4 Dec 2008 13:48:16 -0600
Re: axial lead bend
Stadem, Richard D.
Thu, 18 Dec 2008 14:37:10 -0600
Re: axial lead bend
Stadem, Richard D.
Thu, 18 Dec 2008 14:29:38 -0600
Re: Alumina Substrate
Stadem, Richard D.
Mon, 1 Dec 2008 12:52:58 -0600
Re: ??: Re: [TN] BGA soldering open issue
Stadem, Richard D.
Mon, 8 Dec 2008 08:41:48 -0600
New Sender Simonik, Dave R. (David)
Re: Way off-topic: CrO2 cassette tape
Simonik, Dave R. (David)
Thu, 18 Dec 2008 10:28:03 -0500
New Sender Schaefer, Chris
Re: Stripping Magnet Wire
Schaefer, Chris
Tue, 2 Dec 2008 10:13:52 -0600
New Sender SAHLI habib
Re: Multilayer construction
SAHLI habib
Mon, 22 Dec 2008 16:29:11 +0100
Multilayer construction
SAHLI habib
Mon, 22 Dec 2008 15:40:26 +0100
New Sender Rudolph yu
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Rudolph yu
Mon, 22 Dec 2008 18:56:01 +0000
What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Rudolph yu
Mon, 22 Dec 2008 18:34:59 +0000
Re: What are the industrial standards for Solder paste printing limits?
Rudolph yu
Tue, 2 Dec 2008 06:41:15 +0000
Re: What are the industrial standards for Solder paste printing limits?
Rudolph yu
Mon, 1 Dec 2008 23:51:37 +0000
What are the industrial standards for Solder paste printing limits?
Rudolph yu
Mon, 1 Dec 2008 20:51:34 +0000
New Sender roland jaquet
Re: Season's Greetings
roland jaquet
Mon, 15 Dec 2008 14:37:09 +0100
IPC-6012 Class 3 - Electrical Test Requirement
roland jaquet
Sat, 13 Dec 2008 14:56:14 +0100
New Sender Roger Stoops
Re: Way off-topic: CrO2 cassette tape
Roger Stoops
Thu, 18 Dec 2008 12:06:04 -0500
New Sender Roberts, Jon
QUESTION ON GULL WING COMPONENT LEAD CONFIGURATION ANOMALY
Roberts, Jon
Wed, 10 Dec 2008 12:48:32 -0600
New Sender Robert Kondner
Re: Xbox360 BGAs
Robert Kondner
Tue, 9 Dec 2008 18:56:59 -0500
Re: Xbox360 BGAs
Robert Kondner
Tue, 9 Dec 2008 08:57:03 -0500
Re: RE: Xbox360 BGA issue
Robert Kondner
Mon, 8 Dec 2008 10:02:05 -0500
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Robert Kondner
Mon, 22 Dec 2008 13:43:23 -0500
Re: What are the industrial standards for Solder paste printing limits?
Robert Kondner
Mon, 1 Dec 2008 16:47:03 -0500
Re: flux and board cleaning issues
Robert Kondner
Thu, 18 Dec 2008 10:05:56 -0500
Re: flux and board cleaning issues
Robert Kondner
Thu, 18 Dec 2008 10:01:22 -0500
Re: flux and board cleaning issues
Robert Kondner
Wed, 17 Dec 2008 11:03:57 -0500
New Sender Rex Waygood
Re: Tin Pest
Rex Waygood
Mon, 22 Dec 2008 16:38:53 -0000
Tin Pest
Rex Waygood
Mon, 22 Dec 2008 15:14:44 -0000
Re: IPC-6012 Class 3 - Electrical Test Requirement
Rex Waygood
Mon, 15 Dec 2008 09:24:02 -0000
New Sender Randall L Bock
Re: Season's Greetings
Randall L Bock
Mon, 15 Dec 2008 07:43:18 -0500
Re: SCreswick@Gentex Signing Off
Randall L Bock
Fri, 12 Dec 2008 06:42:18 -0500
Re: OT Friday newsflash
Randall L Bock
Fri, 5 Dec 2008 07:29:56 -0500
NORAD
Randall L Bock
Wed, 24 Dec 2008 09:31:52 -0500
New Sender R Sedlak
Re: Stripping Magnet Wire
R Sedlak
Wed, 3 Dec 2008 12:29:31 -0800
Re: Stripping Magnet Wire
R Sedlak
Tue, 2 Dec 2008 13:30:17 -0800
Re: flux and board cleaning issues
R Sedlak
Thu, 18 Dec 2008 08:30:09 -0800
Re: flux and board cleaning issues
R Sedlak
Wed, 17 Dec 2008 09:20:46 -0800
Re: flux and board cleaning issues
R Sedlak
Tue, 16 Dec 2008 16:04:18 -0800
New Sender Phillip Bavaro
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Phillip Bavaro
Mon, 22 Dec 2008 11:16:35 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Phillip Bavaro
Wed, 24 Dec 2008 11:28:51 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Phillip Bavaro
Wed, 24 Dec 2008 11:17:00 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Phillip Bavaro
Wed, 24 Dec 2008 10:40:35 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Phillip Bavaro
Wed, 24 Dec 2008 10:38:02 -0800
Underfill, inhibition due to leftover activators in the flux residue
Phillip Bavaro
Mon, 22 Dec 2008 15:02:18 -0800
Re: POP underfill?
Phillip Bavaro
Fri, 12 Dec 2008 13:44:12 -0800
POP underfill?
Phillip Bavaro
Wed, 10 Dec 2008 11:04:07 -0800
New Sender Phil Nutting
Re: flux and board cleaning issues
Phil Nutting
Wed, 17 Dec 2008 08:41:46 -0500
Re: Conductive Epoxy filled Vias
Phil Nutting
Tue, 2 Dec 2008 09:31:48 -0500
New Sender Pete Houwen
Re: x-outs in panel
Pete Houwen
Thu, 18 Dec 2008 08:03:45 -0600
Re: nickel erosion
Pete Houwen
Mon, 1 Dec 2008 08:29:19 -0600
Re: Conductive Epoxy filled Vias
Pete Houwen
Wed, 3 Dec 2008 07:57:46 -0600
New Sender Paul Reid
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Paul Reid
Tue, 23 Dec 2008 16:11:56 -0500
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Paul Reid
Tue, 23 Dec 2008 08:18:22 -0500
Re: Conductive Epoxy filled Vias
Paul Reid
Wed, 3 Dec 2008 13:20:43 -0500
Re: Conductive Epoxy filled Vias
Paul Reid
Wed, 3 Dec 2008 11:25:15 -0500
New Sender Paul Edwards
Re: Xbox360s
Paul Edwards
Fri, 12 Dec 2008 11:33:50 -0800
Re: vibration testing of tin-lead and lead-free solder joints
Paul Edwards
Fri, 19 Dec 2008 09:32:25 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Paul Edwards
Wed, 24 Dec 2008 13:32:26 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Paul Edwards
Mon, 22 Dec 2008 17:33:05 -0800
Re: Stripping Magnet Wire
Paul Edwards
Wed, 3 Dec 2008 12:11:15 -0800
Re: Stripping Magnet Wire
Paul Edwards
Wed, 3 Dec 2008 09:51:09 -0800
Re: flux and board cleaning issues
Paul Edwards
Thu, 18 Dec 2008 10:53:38 -0800
Re: flux and board cleaning issues
Paul Edwards
Thu, 18 Dec 2008 10:18:28 -0800
Re: flux and board cleaning issues
Paul Edwards
Wed, 17 Dec 2008 18:32:32 -0800
Re: flux and board cleaning issues
Paul Edwards
Wed, 17 Dec 2008 09:32:32 -0800
Re: BGA soldering open issue
Paul Edwards
Thu, 4 Dec 2008 19:07:33 -0800
Re: ??: Re: [TN] BGA soldering open is sue
Paul Edwards
Fri, 5 Dec 2008 09:41:56 -0800
New Sender Paul Carter
Re: TechNet Digest - 22 Dec 2008 to 23 Dec 2008 (#2008-350)
Paul Carter
Wed, 24 Dec 2008 06:26:30 -0000
New Sender Oscar Fallah
Re: Xbox360 BGAs
Oscar Fallah
Sat, 6 Dec 2008 11:59:16 -0800
New Sender Nieznanski, John A - SSD
Re: to apply partition correction on individual daisy chains or not?
Nieznanski, John A - SSD
Thu, 18 Dec 2008 18:54:36 -0500
Re: to apply partition correction on individual daisy chains or not?
Nieznanski, John A - SSD
Thu, 18 Dec 2008 14:33:27 -0500
to apply partition correction on individual daisy chains or not?
Nieznanski, John A - SSD
Thu, 18 Dec 2008 12:43:55 -0500
New Sender Nick Ban
Re: NTC [TN] Alumina Substrate
Nick Ban
Wed, 3 Dec 2008 22:44:45 -0600
Re: NTC [TN] Alumina Substrate
Nick Ban
Wed, 3 Dec 2008 15:40:13 -0600
Re: NTC [TN] Alumina Substrate
Nick Ban
Wed, 3 Dec 2008 15:27:54 -0600
New Sender N Burtt
Re: Xbox360 BGAs
N Burtt
Fri, 12 Dec 2008 03:17:17 -0600
Re: Way off-topic: CrO2 cassette tape
N Burtt
Fri, 19 Dec 2008 03:15:12 -0600
Re: flux and board cleaning issues
N Burtt
Wed, 17 Dec 2008 08:41:39 -0600
New Sender Mike Fenner
Re: Xbox360 BGAs NTC
Mike Fenner
Thu, 11 Dec 2008 10:36:23 -0000
Re: POP underfill?
Mike Fenner
Thu, 11 Dec 2008 10:41:52 -0000
New Sender Michelle Michelotti
Last chance to register for IPC/JEDEC's Lead Free Conference December 8-10, 2008
Michelle Michelotti
Mon, 1 Dec 2008 14:33:26 -0600
IPC/JEDEC Upcoming Lead-Free Event - 03/3-5/2009 Santa Clara, Calf.
Michelle Michelotti
Mon, 22 Dec 2008 10:27:52 -0600
New Sender Michael Kirschner
Re: NTC [TN] Way off-topic: CrO2 cassette tape
Michael Kirschner
Sun, 21 Dec 2008 14:08:38 -0600
New Sender McGlaughlin, Jeffrey A
Re: Alumina Substrate
McGlaughlin, Jeffrey A
Mon, 1 Dec 2008 10:54:15 -0500
Alumina Substrate
McGlaughlin, Jeffrey A
Mon, 1 Dec 2008 08:56:45 -0500
New Sender Mark C.
Re: Step Stencil Requirements
Mark C.
Fri, 5 Dec 2008 20:45:56 -0600
New Sender Louis Hart
Re: What are the industrial standards for Solder paste printing limits?
Louis Hart
Tue, 2 Dec 2008 10:47:34 -0500
Re: to apply partition correction on individual daisy chains or not?
Louis Hart
Thu, 18 Dec 2008 14:28:13 -0500
ENIG thickness measurement
Louis Hart
Fri, 5 Dec 2008 11:14:41 -0500
New Sender Lee Whiteman
Re: flux and board cleaning issues
Lee Whiteman
Wed, 17 Dec 2008 08:15:15 -0500
Re: Conformal Coat and Eddy Currents
Lee Whiteman
Thu, 4 Dec 2008 14:58:35 -0500
New Sender kwood716
Re: OT Friday newsflash
kwood716
Fri, 5 Dec 2008 07:07:56 -0500
New Sender Kim Sterling
set technet noemail
Kim Sterling
Wed, 3 Dec 2008 14:21:26 -0600
My apologies
Kim Sterling
Wed, 3 Dec 2008 14:32:28 -0600
New Sender Kim O'Neil
Plated Copper Dissolution at the Knee/Lead Free Soldering
Kim O'Neil
Mon, 15 Dec 2008 16:24:14 -0700
New Sender Kevin Glidden
Re: Solder mask removal
Kevin Glidden
Thu, 11 Dec 2008 15:33:11 -0500
Re: flux and board cleaning issues
Kevin Glidden
Wed, 17 Dec 2008 09:16:54 -0500
New Sender Ken Bloomquist
Re: Solder mask removal
Ken Bloomquist
Thu, 11 Dec 2008 15:58:43 -0800
Holiday Eating Guide
Ken Bloomquist
Wed, 24 Dec 2008 07:26:59 -0800
New Sender Kane, Joseph E (US SSA)
Stripping Magnet Wire
Kane, Joseph E (US SSA)
Tue, 2 Dec 2008 10:28:19 -0500
New Sender Joyce Koo
Re: Xbox360 BGAs NTC
Joyce Koo
Thu, 11 Dec 2008 12:27:44 -0500
Fw: X'mas venture
Joyce Koo
Wed, 24 Dec 2008 17:35:38 -0500
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Joyce Koo
Tue, 23 Dec 2008 10:37:49 -0500
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Joyce Koo
Mon, 22 Dec 2008 19:20:40 -0500
Re: Underfill, inhibition due to leftover activators in the flux residue
Joyce Koo
Tue, 23 Dec 2008 07:43:46 -0500
Re: Stripping Magnet Wire
Joyce Koo
Tue, 2 Dec 2008 19:56:39 -0500
Re: POP underfill?
Joyce Koo
Thu, 11 Dec 2008 07:49:42 -0500
Re: Holiday Eating Guide
Joyce Koo
Wed, 24 Dec 2008 10:47:54 -0500
Re: Conformal Coat and Eddy Currents
Joyce Koo
Sun, 7 Dec 2008 14:27:03 -0500
Re: Conductive Epoxy filled Vias
Joyce Koo
Tue, 2 Dec 2008 09:16:18 -0500
Re: AW: [TN] vibration testing of tin-lead and lead-free solder joints
Joyce Koo
Fri, 19 Dec 2008 16:14:48 -0500
Re: Alumina Substrate
Joyce Koo
Mon, 1 Dec 2008 13:39:44 -0500
New Sender John Goulet
Re: Xbox360 BGAs
John Goulet
Sun, 7 Dec 2008 19:44:19 +0000
Re: Lead free soldering
John Goulet
Sun, 7 Dec 2008 15:16:57 +0000
Re: Conformal Coat and Eddy Currents
John Goulet
Sun, 7 Dec 2008 15:28:32 +0000
Re: Compliant Pin Insertion Machines
John Goulet
Sun, 28 Dec 2008 22:47:28 +0000
Re: BGA soldering open issue
John Goulet
Sun, 7 Dec 2008 15:09:34 +0000
Re: ??: Re: [TN] BGA soldering open issue
John Goulet
Sun, 7 Dec 2008 14:40:37 +0000
Re: ç­å¤: Re: [TN] BGA soldering open issue
John Goulet
Sun, 7 Dec 2008 14:43:57 +0000
Re: ´ð¸´: Re: [TN] BGA soldering open issue
John Goulet
Sun, 7 Dec 2008 15:18:52 +0000
New Sender John Burke
Re: Xbox360s
John Burke
Fri, 12 Dec 2008 11:54:20 -0800
Re: x-outs in panel
John Burke
Wed, 17 Dec 2008 17:03:05 -0800
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
John Burke
Mon, 22 Dec 2008 12:46:03 -0800
Re: Solder mask removal
John Burke
Thu, 11 Dec 2008 13:15:39 -0800
Re: SCreswick@Gentex Signing Off
John Burke
Fri, 12 Dec 2008 07:12:43 -0800
Re: NTC [TN] Way off-topic: CrO2 cassette tape
John Burke
Thu, 18 Dec 2008 11:39:14 -0800
Re: NTC [TN] Stripping Magnet Wire
John Burke
Wed, 3 Dec 2008 12:37:16 -0800
Re: NTC [TN] Materials
John Burke
Thu, 4 Dec 2008 09:37:52 -0800
Re: NTC [TN] Alumina Substrate
John Burke
Wed, 3 Dec 2008 15:12:52 -0800
Re: NTC [TN] Alumina Substrate
John Burke
Mon, 1 Dec 2008 17:15:06 -0800
Re: NORAD
John Burke
Wed, 24 Dec 2008 09:41:12 -0800
Re: Conformal Coat and Eddy Currents
John Burke
Tue, 9 Dec 2008 09:37:57 -0800
New Sender Joetech82
Re: RF PCB for high frequency
Joetech82
Mon, 29 Dec 2008 08:56:22 -0800
New Sender Joe Fjelstad
Re: [LF] vibration testing of tin-lead and lead-free solder joints
Joe Fjelstad
Tue, 9 Dec 2008 11:03:35 EST
Re: Xbox360 BGAs
Joe Fjelstad
Sun, 7 Dec 2008 16:27:48 EST
Re: Vibration testing of tin-lead and lead-free solder joints
Joe Fjelstad
Mon, 8 Dec 2008 16:01:14 EST
vibration testing of tin-lead and lead-free solder joints
Joe Fjelstad
Mon, 8 Dec 2008 15:45:22 EST
Re: Stripping Magnet Wire
Joe Fjelstad
Wed, 3 Dec 2008 15:37:41 EST
Re: Stripping Magnet Wire
Joe Fjelstad
Wed, 3 Dec 2008 13:25:49 EST
Re: NTC [TN] Alumina Substrate
Joe Fjelstad
Wed, 3 Dec 2008 16:25:11 EST
Re: My apologies
Joe Fjelstad
Wed, 3 Dec 2008 15:34:04 EST
Bernard Madoff NTC
Joe Fjelstad
Sat, 20 Dec 2008 15:20:31 EST
A New Year's Resolution...
Joe Fjelstad
Wed, 31 Dec 2008 13:10:29 EST
New Sender Jerry Dengler
Board House recommendation
Jerry Dengler
Tue, 2 Dec 2008 08:44:07 -0500
New Sender Jeremias, Michael
AW: [TN] vibration testing of tin-lead and lead-free solder joints
Jeremias, Michael
Fri, 19 Dec 2008 19:03:08 +0100
AW: [TN] vibration testing of tin-lead and lead-free solder joints
Jeremias, Michael
Fri, 19 Dec 2008 12:20:08 +0100
AW: [TN] AW: [TN] vibration testing of tin-lead and lead-free solder joints
Jeremias, Michael
Mon, 22 Dec 2008 15:16:04 +0100
New Sender Jason Zhao
Re: What are the industrial standards for Solder paste printing limits?
Jason Zhao
Tue, 2 Dec 2008 14:22:42 -0600
New Sender James Mahoney
Re: Shorts in flex,
James Mahoney
Thu, 4 Dec 2008 17:11:06 -0500
Re: Multilayer construction
James Mahoney
Mon, 22 Dec 2008 09:49:05 -0500
Re: Immersion Tin
James Mahoney
Wed, 3 Dec 2008 11:05:26 -0500
Re: Immersion Tin
James Mahoney
Wed, 3 Dec 2008 10:34:29 -0500
Immersion Tin
James Mahoney
Wed, 3 Dec 2008 09:24:46 -0500
New Sender Jack Olson
Re: axial lead bend
Jack Olson
Fri, 19 Dec 2008 14:29:08 -0600
axial lead bend
Jack Olson
Thu, 18 Dec 2008 14:13:37 -0600
New Sender Inge
Re: Season's Greetings
Inge
Mon, 15 Dec 2008 08:04:11 -0800
Re: RF PCB for high frequency
Inge
Sun, 28 Dec 2008 08:52:56 -0800
Re: Alumina Substrate
Inge
Mon, 1 Dec 2008 13:49:05 -0800
New Sender Igoshev, Vladimir
Re: Xbox360 BGAs
Igoshev, Vladimir
Fri, 12 Dec 2008 10:14:53 -0500
Re: Xbox360 BGAs
Igoshev, Vladimir
Thu, 11 Dec 2008 18:59:28 -0500
Re: Xbox360 BGAs
Igoshev, Vladimir
Thu, 11 Dec 2008 09:42:33 -0500
Re: Xbox360 BGAs
Igoshev, Vladimir
Wed, 10 Dec 2008 16:26:25 -0500
Re: Xbox360 BGAs
Igoshev, Vladimir
Wed, 10 Dec 2008 15:59:18 -0500
Re: Xbox360 BGAs
Igoshev, Vladimir
Wed, 10 Dec 2008 11:50:27 -0500
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Igoshev, Vladimir
Tue, 23 Dec 2008 16:22:28 -0500
New Sender Ian Hanna
Re: Conformal Coat and Eddy Currents
Ian Hanna
Thu, 4 Dec 2008 14:59:20 -0500
New Sender Hernefjord Ingemar
Re: Way off-topic: CrO2 cassette tape
Hernefjord Ingemar
Fri, 19 Dec 2008 09:30:23 +0100
Re: NTC [TN] Alumina Substrate
Hernefjord Ingemar
Tue, 2 Dec 2008 14:43:03 +0100
Re: Alumina Substrate
Hernefjord Ingemar
Mon, 1 Dec 2008 16:19:49 +0100
Re: Alumina Substrate
Hernefjord Ingemar
Mon, 1 Dec 2008 16:19:15 +0100
Re: Alumina Substrate
Hernefjord Ingemar
Mon, 1 Dec 2008 15:57:48 +0100
Re: Alumina Substrate
Hernefjord Ingemar
Mon, 1 Dec 2008 15:53:43 +0100
New Sender Haynes, Kim
Re: vibration testing of tin-lead and lead-free solder joints
Haynes, Kim
Fri, 19 Dec 2008 14:29:45 -0600
Re: Conductive Epoxy filled Vias
Haynes, Kim
Tue, 2 Dec 2008 09:56:39 -0600
New Sender Guy Ramsey
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Guy Ramsey
Tue, 23 Dec 2008 23:33:55 -0500
Re: flux and board cleaning issues
Guy Ramsey
Wed, 17 Dec 2008 11:47:51 -0500
Re: flux and board cleaning issues
Guy Ramsey
Tue, 16 Dec 2008 22:48:03 -0500
New Sender Gumpert, Ben
Re: POP underfill?
Gumpert, Ben
Mon, 15 Dec 2008 06:54:20 -0500
New Sender Grunde Gjertsen
Re: Fwd: Draft for IPC-4101C
Grunde Gjertsen
Thu, 4 Dec 2008 07:45:07 +0100
New Sender Graham Naisbitt
Re: Conformal Coat and Eddy Currents
Graham Naisbitt
Sun, 7 Dec 2008 19:20:41 +0000
New Sender Graham Collins
Re: axial lead bend
Graham Collins
Thu, 18 Dec 2008 16:21:52 -0400
New Sender Dwight Mattix
Re: Underfill, inhibition due to leftover activators in the flux residue
Dwight Mattix
Tue, 23 Dec 2008 08:45:53 -0800
Re: Underfill, inhibition due to leftover activators in the flux residue
Dwight Mattix
Mon, 22 Dec 2008 17:33:50 -0800
Re: NTC Engineers!
Dwight Mattix
Tue, 30 Dec 2008 07:51:01 -0800
New Sender Douglas Pauls
Re: Xbox360 BGAs NTC
Douglas Pauls
Thu, 11 Dec 2008 11:38:05 -0600
Re: Solder mask removal
Douglas Pauls
Thu, 11 Dec 2008 14:04:50 -0600
Re: flux and board cleaning issues
Douglas Pauls
Thu, 18 Dec 2008 07:46:59 -0600
Re: flux and board cleaning issues
Douglas Pauls
Thu, 18 Dec 2008 07:34:27 -0600
New Sender Douglas O. Pauls
Re: NTC [TN] Materials
Douglas O. Pauls
Thu, 4 Dec 2008 13:15:49 -0600
Re: Conformal Coat and Eddy Currents
Douglas O. Pauls
Thu, 4 Dec 2008 13:59:57 -0600
Conformal Coat and Eddy Currents
Douglas O. Pauls
Thu, 4 Dec 2008 13:18:39 -0600
New Sender Dougal Stewart
0.051mm (2mil) cores
Dougal Stewart
Thu, 4 Dec 2008 07:38:22 -0600
New Sender Donald Vischulis
Re: Board House recommendation
Donald Vischulis
Tue, 2 Dec 2008 17:10:51 -0600
New Sender Diamond, Patrick
Re: Stripping Magnet Wire
Diamond, Patrick
Wed, 3 Dec 2008 07:14:19 -0000
New Sender Dennis Fritz
Re: Solder mask removal
Dennis Fritz
Thu, 11 Dec 2008 16:14:55 -0500
New Sender David Tremmel
Xbox360s
David Tremmel
Thu, 11 Dec 2008 20:51:05 -0600
Re: Xbox360 BGAs
David Tremmel
Mon, 8 Dec 2008 22:20:33 -0600
Xbox360 BGAs
David Tremmel
Sun, 7 Dec 2008 09:17:47 -0600
Xbox360 BGAs
David Tremmel
Fri, 5 Dec 2008 22:38:22 -0600
Re: RE: Xbox360 BGA issue
David Tremmel
Mon, 8 Dec 2008 20:56:24 -0600
Lead free soldering
David Tremmel
Thu, 4 Dec 2008 15:57:47 -0600
New Sender David D. Hillman
Re: Xbox360 BGAs NTC
David D. Hillman
Thu, 11 Dec 2008 07:07:56 -0600
Re: Underfill, inhibition due to leftover activators in the flux residue
David D. Hillman
Tue, 23 Dec 2008 06:54:57 -0600
Re: Tin Pest
David D. Hillman
Mon, 22 Dec 2008 09:20:49 -0600
Re: Cold Forged Alunium (CFA), Cross section-grain structure
David D. Hillman
Fri, 12 Dec 2008 13:23:02 -0600
Re: BGA soldering open issue
David D. Hillman
Fri, 5 Dec 2008 07:31:18 -0600
New Sender Dave Connitt
Re: Conductive Epoxy filled Vias
Dave Connitt
Tue, 2 Dec 2008 10:01:25 -0500
Re: Conductive Epoxy filled Vias
Dave Connitt
Tue, 2 Dec 2008 09:55:35 -0500
Conductive Epoxy filled Vias
Dave Connitt
Tue, 2 Dec 2008 09:07:27 -0500
New Sender Dale Ritzen
Re: What could be the root cause for a failed board that passed functiona test after going through reflow for the 2nd time?
Dale Ritzen
Wed, 24 Dec 2008 09:05:34 -0600
Re: flux and board cleaning issues
Dale Ritzen
Wed, 17 Dec 2008 07:43:46 -0600
New Sender Creswick, Steven
Re: Alumina Substrate
Creswick, Steven
Mon, 1 Dec 2008 12:21:33 -0500
Re: Alumina Substrate
Creswick, Steven
Mon, 1 Dec 2008 09:59:01 -0500
Re: Alumina Substrate
Creswick, Steven
Mon, 1 Dec 2008 09:53:08 -0500
New Sender Craig Cullum
Way off-topic: CrO2 cassette tape
Craig Cullum
Thu, 18 Dec 2008 09:04:05 -0600
Re: set technet noemail
Craig Cullum
Wed, 3 Dec 2008 14:32:19 -0600
New Sender Cong He
Re: BGA soldering open issue
Cong He
Tue, 9 Dec 2008 17:18:12 +0800
BGA soldering open issue
Cong He
Fri, 5 Dec 2008 10:08:37 +0800
答复: Re: [TN] BGA soldering open issue
Cong He
Fri, 5 Dec 2008 11:08:14 +0800
答复: Re: [TN] 答复: Re: [TN] BGA soldering open issue
Cong He
Mon, 8 Dec 2008 11:32:59 +0800
New Sender Chuck Brummer
Re: Multilayer construction
Chuck Brummer
Mon, 22 Dec 2008 08:05:40 -0800
New Sender Brian Ellis
Season's Greetings
Brian Ellis
Mon, 15 Dec 2008 14:34:57 +0200
OT Friday newsflash
Brian Ellis
Fri, 5 Dec 2008 10:18:52 +0200
NTC Engineers!
Brian Ellis
Tue, 30 Dec 2008 17:04:27 +0200
Re: flux and board cleaning issues
Brian Ellis
Thu, 18 Dec 2008 10:54:39 +0200
Re: flux and board cleaning issues
Brian Ellis
Wed, 17 Dec 2008 10:12:03 +0200
New Sender Brian Chandler
Compliant Pin Insertion Machines
Brian Chandler
Fri, 12 Dec 2008 14:28:44 -0600
New Sender Bobwillis
Re: POP underfill?
Bobwillis
Thu, 18 Dec 2008 19:22:27 -0500
Re: Plated Copper Dissolution at the Knee/Lead Free Soldering
Bobwillis
Thu, 18 Dec 2008 19:22:31 -0500
New Sender Bob Perkins
Unsubscribe
Bob Perkins
Fri, 19 Dec 2008 13:48:39 -0800
New Sender Bill Campbell
Re: Way off-topic: CrO2 cassette tape
Bill Campbell
Thu, 18 Dec 2008 10:55:15 -0600
New Sender Bev Christian
Re: Way off-topic: CrO2 cassette tape
Bev Christian
Thu, 18 Dec 2008 10:07:23 -0500
Re: Underfill, inhibition due to leftover activators in the flux residue
Bev Christian
Mon, 22 Dec 2008 20:15:37 -0500
Re: Underfill, inhibition due to leftover activators in the flux residue
Bev Christian
Mon, 22 Dec 2008 20:12:30 -0500
Re: Underfill, inhibition due to leftover activators in the flux residue
Bev Christian
Mon, 22 Dec 2008 18:34:05 -0500
NTC Re: [TN] Underfill, inhibition due to leftover activators in the flux residue
Bev Christian
Mon, 22 Dec 2008 21:04:44 -0500
New Sender Barbara Burcham
Re: set technet noemail
Barbara Burcham
Wed, 3 Dec 2008 14:27:57 -0600
Re: Season's Greetings
Barbara Burcham
Mon, 15 Dec 2008 09:27:15 -0600
Re: My apologies
Barbara Burcham
Wed, 3 Dec 2008 14:45:16 -0600
New Sender Andy Price
Re: Solder mask removal
Andy Price
Thu, 11 Dec 2008 15:20:31 -0500
New Sender Andy Ng
Re: What are the industrial standards for Solder paste printing limits?
Andy Ng
Tue, 2 Dec 2008 11:06:30 -0800
Re: What are the industrial standards for Solder paste printing limits?
Andy Ng
Mon, 1 Dec 2008 16:29:30 -0800
Re: What are the industrial standards for Solder paste printing limits?
Andy Ng
Mon, 1 Dec 2008 15:17:20 -0800
Re: flux and board cleaning issues
Andy Ng
Wed, 17 Dec 2008 18:09:00 -0800
New Sender Anat Douek
RF PCB for high frequency
Anat Douek
Sun, 28 Dec 2008 15:30:27 +0200
New Sender Ahne Oosterhof
Re: Xbox360 BGAs NTC
Ahne Oosterhof
Thu, 11 Dec 2008 09:14:44 -0800
Re: Solder mask removal
Ahne Oosterhof
Thu, 11 Dec 2008 12:06:04 -0800
Re: OT Friday newsflash
Ahne Oosterhof
Fri, 5 Dec 2008 09:23:11 -0800
New Sender <Richard Edgar>
Re: Immersion Tin
<Richard Edgar>
Wed, 3 Dec 2008 11:02:23 EST
Re: Immersion Tin
<Richard Edgar>
Wed, 3 Dec 2008 10:07:17 -0500
New Sender <>
Re: Xbox360s
<>
Mon, 15 Dec 2008 13:39:11 EST
Re: flux and board cleaning issues
<>
Thu, 18 Dec 2008 11:17:15 EST

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