LISTSERV mailing list manager LISTSERV 16.0

Help for TECHNET Archives


TECHNET Archives

TECHNET Archives


October 2008


View:

Show Author | Hide Author
Show Table of Contents | Hide Table of Contents

 

Table of Contents:

"Conductive" Bonding Material (11 messages)
"rock that grows tentacles" (1 message)
10% Discount ends November 21, 2008 - IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX 10% Discount ends November 21, 2008 (1 message)
Acceptance spec for pin hole/blow hole (2 messages)
Au embrittlement on Copper vs Nickel (13 messages)
Barrel and Corner cracks in copper elctroplating (17 messages)
Barrel and Corner cracks in copper electroplating (5 messages)
Big problem when coating with Parylene C. (1 message)
Conductor spacing in dependance of PCB material (2 messages)
Connection failure in the super collider (2 messages)
Controlled RH% Versus Screenprinting Results (11 messages)
Copper anode placement (1 message)
CPK (2 messages)
Design Rules for Punching Bare PCBs (1 message)
Designers Day - Irvine, California, October 22, 2008 (1 message)
Electroless parameters (3 messages)
Electrolytic (Flash) Nickel Gold Finish (13 messages)
Elongation for CCL & electroplating Cu (2 messages)
encap and polymeric material spec (1 message)
europeon commisioners email?? (1 message)
Failure Analysis Lab with Ion Chromatography testing capabilities (10 messages)
Friday - off topic question - do you get e-mails on your phone (15 messages)
Friday NTC (2 messages)
FW: [LF] Vapor Phase Soldering (8 messages)
FW: [LF] Vapour Phase Soldering (2 messages)
FW: [tinwhiskers] CERN report (4 messages)
FW: [TN] Solder Paste Height Measurement System (2 messages)
Get in touch with the Market! IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA (1 message)
Hard vs. soft gold (2 messages)
How to improve solder filling and wetting contact angles for thermal vias at wave soldering process. (6 messages)
Hurry & register for Test & Inspection Conference, November 10-12, 2008 Santa Clara, CA (1 message)
Hurry and Register for IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA (1 message)
Ionic Testing Process (3 messages)
IPC 2222 classes (5 messages)
IPC Eco-Compliance Webcast Series - Last Chance to Register! (1 message)
IPC hardware assembly spec (3 messages)
IPC's Eco-Compliance October Webcast Series Last Chance to Register! (1 message)
IPC-610, 8.2.5.5 (7 messages)
IPC/JEDEC Transitioning to Lead-Free Conference December 8-10, 2008 - Dallas, TX (1 message)
IR reflow oven (11 messages)
Last Chance to Register for IPC's Power Conversion Conference Featuring New Industry Standard (1 message)
Last Chance to Register! IPC's Eco-Compliance Webcast Series - October 2008 (1 message)
Lead Free BGA'S (17 messages)
Machine Key Performance Indicators (1 message)
Metal Core PCB (1 message)
MICRO VIA REPAIR (1 message)
Need soldering advice ASAP No II (11 messages)
Need soldering advice ASAP No II - tangential question.. (6 messages)
Need soldering advice ASAP! (24 messages)
PCB Documentation (4 messages)
PCB Manufacturing Processes (5 messages)
PCB pad non-wetting issues (14 messages)
Potting Encapsulation and Component Cleanliness (5 messages)
Problems with plating vias closed (10 messages)
Process question-Pls reply urgently....! (19 messages)
Register today! IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX (1 message)
ROHS, FLUX and FLuX CLEANING AGENT (2 messages)
Search for Viking 1630FS (1 message)
Seeking information on relaxation of FR4 under load over time (2 messages)
SMT dimensions guidelines, 1208 (4 messages)
Sn-Bi Alloy for soldering (8 messages)
Solder fillet (6 messages)
Solder Paste Height Measurement System (3 messages)
SOLDERING BERYLLIUM COPPER (5 messages)
Soldering to Aluminum? (10 messages)
Standards for Component Cleanliness (5 messages)
SunStar 991 (1 message)
Technical query: Land Patterns SMD (3 messages)
Throughhole Equipment Training (4 messages)
Underfill, Cause (4 messages)
Upcoming Power Conversion Conference Featuring New Industry Standard (1 message)
Vapor Phase Soldering - The way Forward? (7 messages)
Wave soldering temperature profile question (4 messages)
What is NADCAP ? (3 messages)

LISTSERV Archives

LISTSERV Archives

TECHNET Home

TECHNET Home

Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"Conductive" Bonding Material

"Conductive" Bonding Material

Joe Lara (Select Circuits) <[log in to unmask]>

Wed, 1 Oct 2008 14:03:01 -0400

38 lines

Re: "Conductive" Bonding Material

Creswick, Steven <[log in to unmask]>

Wed, 1 Oct 2008 14:33:49 -0400

126 lines

Re: "Conductive" Bonding Material

Creswick, Steven <[log in to unmask]>

Wed, 1 Oct 2008 14:44:03 -0400

159 lines

Re: "Conductive" Bonding Material

Phil Nutting <[log in to unmask]>

Wed, 1 Oct 2008 15:01:16 -0400

191 lines

Re: "Conductive" Bonding Material

Joe Lara (Select Circuits) <[log in to unmask]>

Wed, 1 Oct 2008 15:19:13 -0400

230 lines

Re: "Conductive" Bonding Material

Douglas O. Pauls <[log in to unmask]>

Wed, 1 Oct 2008 14:06:41 -0500

88 lines

Re: "Conductive" Bonding Material

Phil Nutting <[log in to unmask]>

Wed, 1 Oct 2008 15:47:30 -0400

118 lines

Re: "Conductive" Bonding Material

Inge <[log in to unmask]>

Wed, 1 Oct 2008 13:52:59 -0700

144 lines

Re: "Conductive" Bonding Material

Inge <[log in to unmask]>

Fri, 3 Oct 2008 11:02:55 -0700

223 lines

Re: "Conductive" Bonding Material

Creswick, Steven <[log in to unmask]>

Fri, 3 Oct 2008 20:33:21 -0400

300 lines

Re: "Conductive" Bonding Material

Robin John <[log in to unmask]>

Tue, 21 Oct 2008 16:36:52 -0500

24 lines

New Thread

"rock that grows tentacles"

"rock that grows tentacles"

Brooks, Bill <[log in to unmask]>

Tue, 7 Oct 2008 12:19:13 -0700

37 lines

New Thread

10% Discount ends November 21, 2008 - IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX 10% Discount ends November 21, 2008

10% Discount ends November 21, 2008 - IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX 10% Discount ends November 21, 2008

Michelle Michelotti <[log in to unmask]>

Thu, 30 Oct 2008 11:59:21 -0500

68 lines

New Thread

Acceptance spec for pin hole/blow hole

Acceptance spec for pin hole/blow hole

Charming Chan <[log in to unmask]>

Mon, 20 Oct 2008 16:54:10 +0800

36 lines

Re: Acceptance spec for pin hole/blow hole

Guy Ramsey <[log in to unmask]>

Mon, 20 Oct 2008 09:04:20 -0400

69 lines

New Thread

Au embrittlement on Copper vs Nickel

Au embrittlement on Copper vs Nickel

Gumpert, Ben <[log in to unmask]>

Fri, 24 Oct 2008 10:58:47 -0400

38 lines

Re: Au embrittlement on Copper vs Nickel

David D. Hillman <[log in to unmask]>

Fri, 24 Oct 2008 10:28:47 -0500

92 lines

Re: Au embrittlement on Copper vs Nickel

Gumpert, Ben <[log in to unmask]>

Fri, 24 Oct 2008 14:03:46 -0400

121 lines

Re: Au embrittlement on Copper vs Nickel

David D. Hillman <[log in to unmask]>

Fri, 24 Oct 2008 14:11:49 -0500

175 lines

Re: Au embrittlement on Copper vs Nickel

Werner Engelmaier /* <[log in to unmask]>

Fri, 24 Oct 2008 16:18:44 -0400

85 lines

Re: Au embrittlement on Copper vs Nickel

Inge <[log in to unmask]>

Sat, 25 Oct 2008 11:20:32 -0700

162 lines

Re: Au embrittlement on Copper vs Nickel

Bev Christian <[log in to unmask]>

Sat, 25 Oct 2008 14:29:36 -0400

200 lines

Re: Au embrittlement on Copper vs Nickel

David D. Hillman <[log in to unmask]>

Mon, 27 Oct 2008 08:33:56 -0500

241 lines

Re: Au embrittlement on Copper vs Nickel

Gumpert, Ben <[log in to unmask]>

Mon, 27 Oct 2008 07:27:04 -0400

205 lines

Re: Au embrittlement on Copper vs Nickel

Stadem, Richard D. <[log in to unmask]>

Mon, 27 Oct 2008 08:07:38 -0500

203 lines

Re: Au embrittlement on Copper vs Nickel

Gumpert, Ben <[log in to unmask]>

Tue, 28 Oct 2008 05:53:33 -0400

28 lines

Re: Au embrittlement on Copper vs Nickel

Pete Houwen <[log in to unmask]>

Thu, 30 Oct 2008 15:30:20 -0500

38 lines

Re: Au embrittlement on Copper vs Nickel

Pete Houwen <[log in to unmask]>

Fri, 31 Oct 2008 09:59:43 -0500

47 lines

New Thread

Barrel and Corner cracks in copper elctroplating

Barrel and Corner cracks in copper elctroplating

Ido Mashall <[log in to unmask]>

Fri, 3 Oct 2008 21:12:43 +0300

60 lines

Re: Barrel and Corner cracks in copper elctroplating

Scott Westheimer <[log in to unmask]>

Fri, 3 Oct 2008 16:52:47 -0400

60 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid <[log in to unmask]>

Fri, 3 Oct 2008 17:51:57 -0400

139 lines

Re: Barrel and Corner cracks in copper elctroplating

Ido Mashall <[log in to unmask]>

Sat, 4 Oct 2008 11:41:50 +0300

207 lines

Re: Barrel and Corner cracks in copper elctroplating

SUBSCRIBE technet legg <[log in to unmask]>

Sat, 4 Oct 2008 10:21:10 -0500

34 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid <[log in to unmask]>

Sat, 4 Oct 2008 19:28:17 -0400

148 lines

Re: Barrel and Corner cracks in copper elctroplating

Ido Mashall <[log in to unmask]>

Sun, 5 Oct 2008 22:54:59 +0200

202 lines

Re: Barrel and Corner cracks in copper elctroplating

Ido Mashall <[log in to unmask]>

Mon, 6 Oct 2008 14:04:05 +0200

110 lines

Re: Barrel and Corner cracks in copper elctroplating

Werner Engelmaier /* <[log in to unmask]>

Mon, 6 Oct 2008 16:26:03 -0400

236 lines

Re: Barrel and Corner cracks in copper elctroplating

Terry L. Munson <[log in to unmask]>

Mon, 6 Oct 2008 16:34:50 EDT

263 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid <[log in to unmask]>

Mon, 6 Oct 2008 17:56:24 -0400

286 lines

Re: Barrel and Corner cracks in copper elctroplating

Werner Engelmaier /* <[log in to unmask]>

Tue, 7 Oct 2008 04:42:47 EDT

29 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid <[log in to unmask]>

Tue, 7 Oct 2008 08:27:57 -0400

76 lines

Re: Barrel and Corner cracks in copper elctroplating

Igoshev, Vladimir <[log in to unmask]>

Tue, 7 Oct 2008 08:37:27 -0400

70 lines

Re: Barrel and Corner cracks in copper elctroplating

Stadem, Richard D. <[log in to unmask]>

Tue, 7 Oct 2008 07:40:33 -0500

113 lines

Re: Barrel and Corner cracks in copper elctroplating

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Oct 2008 07:02:30 -0700

141 lines

Re: Barrel and Corner cracks in copper elctroplating

[log in to unmask]

Tue, 7 Oct 2008 10:58:22 -0400

187 lines

New Thread

Barrel and Corner cracks in copper electroplating

Re: Barrel and Corner cracks in copper electroplating

Victor Hernandez <[log in to unmask]>

Mon, 6 Oct 2008 06:05:53 -0500

82 lines

Re: Barrel and Corner cracks in copper electroplating

Randy Bock Sr. <[log in to unmask]>

Mon, 6 Oct 2008 07:08:37 -0400

140 lines

Re: Barrel and Corner cracks in copper electroplating

Victor Hernandez <[log in to unmask]>

Mon, 6 Oct 2008 06:20:51 -0500

173 lines

Re: Barrel and Corner cracks in copper electroplating

Ido Mashall <[log in to unmask]>

Mon, 6 Oct 2008 13:56:39 +0200

236 lines

Re: Barrel and Corner cracks in copper electroplating

Victor Hernandez <[log in to unmask]>

Tue, 7 Oct 2008 06:54:55 -0500

328 lines

New Thread

Big problem when coating with Parylene C.

Re: Big problem when coating with Parylene C.

Reuven Rokah <[log in to unmask]>

Thu, 2 Oct 2008 10:03:10 +0300

37 lines

New Thread

Conductor spacing in dependance of PCB material

Conductor spacing in dependance of PCB material

Hechenberger Philipp <[log in to unmask]>

Thu, 2 Oct 2008 17:26:12 +0200

85 lines

Re: Conductor spacing in dependance of PCB material

Brian Ellis <[log in to unmask]>

Thu, 2 Oct 2008 19:03:31 +0300

130 lines

New Thread

Connection failure in the super collider

Connection failure in the super collider

John Burke <[log in to unmask]>

Mon, 6 Oct 2008 14:31:55 -0700

47 lines

Re: Connection failure in the super collider

[log in to unmask]

Mon, 6 Oct 2008 17:59:38 EDT

38 lines

New Thread

Controlled RH% Versus Screenprinting Results

Controlled RH% Versus Screenprinting Results

Leland Woodall <[log in to unmask]>

Wed, 8 Oct 2008 14:10:38 -0400

43 lines

Re: Controlled RH% Versus Screenprinting Results

John Burke <[log in to unmask]>

Wed, 8 Oct 2008 11:46:57 -0700

77 lines

Re: Controlled RH% Versus Screenprinting Results

Nowland, Russell Howard (Russell) <[log in to unmask]>

Wed, 8 Oct 2008 13:57:52 -0500

103 lines

Re: Controlled RH% Versus Screenprinting Results

Mike Sewell <[log in to unmask]>

Wed, 8 Oct 2008 14:00:24 -0500

71 lines

Re: Controlled RH% Versus Screenprinting Results

Leland Woodall <[log in to unmask]>

Wed, 8 Oct 2008 15:59:46 -0400

105 lines

Re: Controlled RH% Versus Screenprinting Results

Nowland, Russell Howard (Russell) <[log in to unmask]>

Wed, 8 Oct 2008 15:04:18 -0500

144 lines

Re: Controlled RH% Versus Screenprinting Results

Stadem, Richard D. <[log in to unmask]>

Wed, 8 Oct 2008 15:06:26 -0500

128 lines

Re: Controlled RH% Versus Screenprinting Results

John Burke <[log in to unmask]>

Wed, 8 Oct 2008 13:09:36 -0700

144 lines

Re: Controlled RH% Versus Screenprinting Results

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 05:46:36 -0400

91 lines

Re: Controlled RH% Versus Screenprinting Results

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Oct 2008 06:55:47 -0700

177 lines

Re: Controlled RH% Versus Screenprinting Results

Joe Fjelstad <[log in to unmask]>

Mon, 13 Oct 2008 16:17:35 EDT

200 lines

New Thread

Copper anode placement

Copper anode placement

Adam Seychell <[log in to unmask]>

Tue, 28 Oct 2008 18:06:13 +1100

46 lines

New Thread

CPK

CPK

john queen <[log in to unmask]>

Tue, 28 Oct 2008 10:55:01 -0000

29 lines

Re: CPK

Guy Ramsey <[log in to unmask]>

Wed, 29 Oct 2008 10:22:09 -0400

59 lines

New Thread

Design Rules for Punching Bare PCBs

Design Rules for Punching Bare PCBs

James Verrette <[log in to unmask]>

Tue, 21 Oct 2008 16:04:48 -0400

31 lines

New Thread

Designers Day - Irvine, California, October 22, 2008

Designers Day - Irvine, California, October 22, 2008

Tina Nerad <[log in to unmask]>

Thu, 9 Oct 2008 13:37:11 -0500

48 lines

New Thread

Electroless parameters

Electroless parameters

mp3 <[log in to unmask]>

Fri, 24 Oct 2008 06:48:48 +0530

30 lines

Re: Electroless parameters

Scott Westheimer <[log in to unmask]>

Fri, 24 Oct 2008 06:50:14 -0400

53 lines

Re: Electroless parameters

Bob METCALF <[log in to unmask]>

Fri, 24 Oct 2008 07:03:09 -0700

96 lines

New Thread

Electrolytic (Flash) Nickel Gold Finish

Electrolytic (Flash) Nickel Gold Finish

Anand <[log in to unmask]>

Wed, 1 Oct 2008 16:02:42 -0500

48 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Lee parker <[log in to unmask]>

Wed, 1 Oct 2008 20:44:55 -0400

85 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Hernefjord Ingemar <[log in to unmask]>

Thu, 2 Oct 2008 09:00:06 +0200

72 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Lee parker <[log in to unmask]>

Thu, 2 Oct 2008 10:01:24 -0400

150 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Anil kher <[log in to unmask]>

Fri, 3 Oct 2008 12:31:12 +0530

116 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Werner Engelmaier /* <[log in to unmask]>

Fri, 3 Oct 2008 05:05:55 -0400

177 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Joyce Koo <[log in to unmask]>

Fri, 3 Oct 2008 08:57:24 -0400

218 lines

Re: Electrolytic (Flash) Nickel Gold Finish

anand paliwal <[log in to unmask]>

Fri, 3 Oct 2008 08:39:39 -0600

97 lines

Re: Electrolytic (Flash) Nickel Gold Finish

George Milad <[log in to unmask]>

Fri, 3 Oct 2008 11:35:43 EDT

50 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Lee parker <[log in to unmask]>

Fri, 3 Oct 2008 19:51:26 -0400

213 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Werner Engelmaier /* <[log in to unmask]>

Sat, 4 Oct 2008 04:14:46 EDT

32 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Yong How GOH <[log in to unmask]>

Tue, 7 Oct 2008 10:38:48 +0800

144 lines

Re: Electrolytic (Flash) Nickel Gold Finish

anand paliwal <[log in to unmask]>

Tue, 7 Oct 2008 08:22:10 -0600

169 lines

New Thread

Elongation for CCL & electroplating Cu

Elongation for CCL & electroplating Cu

Lin Leo <[log in to unmask]>

Wed, 15 Oct 2008 18:45:07 +0800

36 lines

Re: Elongation for CCL & electroplating Cu

Werner Engelmaier /* <[log in to unmask]>

Wed, 15 Oct 2008 09:11:35 -0400

91 lines

New Thread

encap and polymeric material spec

encap and polymeric material spec

Joyce Koo <[log in to unmask]>

Thu, 9 Oct 2008 21:39:41 -0400

53 lines

New Thread

europeon commisioners email??

europeon commisioners email??

PCB designer <[log in to unmask]>

Mon, 27 Oct 2008 11:18:22 -0500

29 lines

New Thread

Failure Analysis Lab with Ion Chromatography testing capabilities

Failure Analysis Lab with Ion Chromatography testing capabilities

James Verrette <[log in to unmask]>

Thu, 2 Oct 2008 14:21:51 -0400

30 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Kelly Morris <[log in to unmask]>

Thu, 2 Oct 2008 13:07:16 -0500

30 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Graham Collins <[log in to unmask]>

Thu, 2 Oct 2008 15:34:12 -0300

73 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Joyce Koo <[log in to unmask]>

Thu, 2 Oct 2008 14:34:28 -0400

66 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Thomas Borman <[log in to unmask]>

Thu, 2 Oct 2008 14:47:24 -0500

66 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Stadem, Richard D. <[log in to unmask]>

Thu, 2 Oct 2008 15:05:40 -0500

61 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Bob METCALF <[log in to unmask]>

Thu, 2 Oct 2008 15:11:03 -0700

114 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Mark Palmer <[log in to unmask]>

Thu, 2 Oct 2008 16:42:39 -0500

114 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Joyce Koo <[log in to unmask]>

Thu, 2 Oct 2008 18:33:02 -0400

160 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Sean Hill <[log in to unmask]>

Thu, 2 Oct 2008 15:43:35 -0700

175 lines

New Thread

Friday - off topic question - do you get e-mails on your phone

Friday - off topic question - do you get e-mails on your phone

Kim Sterling <[log in to unmask]>

Fri, 10 Oct 2008 13:09:20 -0500

52 lines

Re: Friday - off topic question - do you get e-mails on your phone

<Richard Edgar> <[log in to unmask]>

Fri, 10 Oct 2008 14:19:41 -0400

90 lines

Re: Friday - off topic question - do you get e-mails on your phone

Randy Bock Sr. <[log in to unmask]>

Fri, 10 Oct 2008 14:30:15 -0400

153 lines

Re: Friday - off topic question - do you get e-mails on your phone

Bev Christian <[log in to unmask]>

Fri, 10 Oct 2008 14:55:10 -0400

97 lines

Re: Friday - off topic question - do you get e-mails on your phone

John Burke <[log in to unmask]>

Fri, 10 Oct 2008 13:03:09 -0700

89 lines

Re: Friday - off topic question - do you get e-mails on your phone

Inge <[log in to unmask]>

Fri, 10 Oct 2008 13:54:44 -0700

80 lines

Re: Friday - off topic question - do you get e-mails on your phone

Bob METCALF <[log in to unmask]>

Fri, 10 Oct 2008 15:49:05 -0700

108 lines

Re: Friday - off topic question - do you get e-mails on your phone

Sean Hill <[log in to unmask]>

Fri, 10 Oct 2008 16:10:35 -0700

129 lines

Re: Friday - off topic question - do you get e-mails on your phone

Mike Fenner <[log in to unmask]>

Sat, 11 Oct 2008 12:23:12 +0100

125 lines

Re: Friday - off topic question - do you get e-mails on your phone

Leif Erik Laerum <[log in to unmask]>

Mon, 13 Oct 2008 07:45:44 -0500

76 lines

Re: Friday - off topic question - do you get e-mails on your phone

Ken Bloomquist <[log in to unmask]>

Mon, 13 Oct 2008 07:36:20 -0700

141 lines

Re: Friday - off topic question - do you get e-mails on your phone

Douglas O. Pauls <[log in to unmask]>

Mon, 13 Oct 2008 09:59:29 -0500

197 lines

Re: Friday - off topic question - do you get e-mails on your phone

Bev Christian <[log in to unmask]>

Mon, 13 Oct 2008 11:17:08 -0400

238 lines

Re: Friday - off topic question - do you get e-mails on your phone

Douglas O. Pauls <[log in to unmask]>

Mon, 13 Oct 2008 10:20:56 -0500

266 lines

Re: Friday - off topic question - do you get e-mails on your phone

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Oct 2008 10:42:41 -0500

324 lines

New Thread

Friday NTC

Friday NTC

Phil Nutting <[log in to unmask]>

Fri, 10 Oct 2008 14:27:02 -0400

63 lines

Re: Friday NTC

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Oct 2008 08:15:07 -0700

98 lines

New Thread

FW: [LF] Vapor Phase Soldering

FW: [LF] Vapor Phase Soldering

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Oct 2008 10:37:49 -0500

90 lines

Re: FW: [LF] Vapor Phase Soldering

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Oct 2008 10:48:47 -0500

120 lines

Re: FW: [LF] Vapor Phase Soldering

Grunde Gjertsen <[log in to unmask]>

Thu, 16 Oct 2008 07:29:54 +0200

163 lines

Re: FW: [LF] Vapor Phase Soldering

Stadem, Richard D. <[log in to unmask]>

Thu, 16 Oct 2008 08:03:02 -0500

221 lines

Re: FW: [LF] Vapor Phase Soldering

Werner Engelmaier /* <[log in to unmask]>

Thu, 16 Oct 2008 11:04:01 -0400

215 lines

Re: FW: [LF] Vapor Phase Soldering

Grunde Gjertsen <[log in to unmask]>

Fri, 17 Oct 2008 12:55:19 +0200

251 lines

Re: FW: [LF] Vapor Phase Soldering

Inge <[log in to unmask]>

Fri, 17 Oct 2008 13:11:17 -0700

132 lines

Re: FW: [LF] Vapor Phase Soldering

Stadem, Richard D. <[log in to unmask]>

Mon, 20 Oct 2008 09:33:03 -0500

274 lines

New Thread

FW: [LF] Vapour Phase Soldering

Re: FW: [LF] Vapour Phase Soldering

Bob Willis <[log in to unmask]>

Thu, 16 Oct 2008 15:31:10 +0100

282 lines

Re: FW: [LF] Vapour Phase Soldering

Stadem, Richard D. <[log in to unmask]>

Thu, 16 Oct 2008 10:31:27 -0500

306 lines

New Thread

FW: [tinwhiskers] CERN report

FW: [tinwhiskers] CERN report

John Burke <[log in to unmask]>

Fri, 17 Oct 2008 09:34:40 -0700

64 lines

Re: FW: [tinwhiskers] CERN report

Inge <[log in to unmask]>

Fri, 17 Oct 2008 13:24:33 -0700

96 lines

Re: FW: [tinwhiskers] CERN report

Inge <[log in to unmask]>

Fri, 17 Oct 2008 13:28:58 -0700

121 lines

Re: FW: [tinwhiskers] CERN report

Paul Edwards <[log in to unmask]>

Fri, 17 Oct 2008 15:58:21 -0700

185 lines

New Thread

FW: [TN] Solder Paste Height Measurement System

FW: [TN] Solder Paste Height Measurement System

Stadem, Richard D. <[log in to unmask]>

Mon, 20 Oct 2008 07:45:53 -0500

119 lines

Re: FW: [TN] Solder Paste Height Measurement System

Robin John <[log in to unmask]>

Mon, 20 Oct 2008 09:06:18 -0500

148 lines

New Thread

Get in touch with the Market! IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Get in touch with the Market! IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Michelle Michelotti <[log in to unmask]>

Thu, 23 Oct 2008 14:44:31 -0500

59 lines

New Thread

Hard vs. soft gold

Hard vs. soft gold

Guy Ramsey <[log in to unmask]>

Thu, 23 Oct 2008 05:11:33 -0400

30 lines

Re: Hard vs. soft gold

Stadem, Richard D. <[log in to unmask]>

Thu, 23 Oct 2008 08:07:47 -0500

87 lines

New Thread

How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Charming Chan <[log in to unmask]>

Tue, 28 Oct 2008 20:25:01 +0800

33 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Tan Geok Ang <[log in to unmask]>

Tue, 28 Oct 2008 22:00:08 +0800

75 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Charming Chan <[log in to unmask]>

Wed, 29 Oct 2008 08:59:22 +0800

98 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Tan Geok Ang <[log in to unmask]>

Wed, 29 Oct 2008 09:16:54 +0800

193 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Pete Houwen <[log in to unmask]>

Wed, 29 Oct 2008 08:06:55 -0500

53 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Phil Nutting <[log in to unmask]>

Wed, 29 Oct 2008 11:29:28 -0400

89 lines

New Thread

Hurry & register for Test & Inspection Conference, November 10-12, 2008 Santa Clara, CA

Hurry & register for Test & Inspection Conference, November 10-12, 2008 Santa Clara, CA

Michelle Michelotti <[log in to unmask]>

Wed, 15 Oct 2008 15:00:22 -0500

61 lines

New Thread

Hurry and Register for IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Hurry and Register for IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Michelle Michelotti <[log in to unmask]>

Wed, 8 Oct 2008 10:00:55 -0500

58 lines

New Thread

Ionic Testing Process

Ionic Testing Process

Chris Schaefer <[log in to unmask]>

Wed, 15 Oct 2008 15:13:15 -0500

45 lines

Re: Ionic Testing Process

Joe Russeau <[log in to unmask]>

Wed, 15 Oct 2008 18:02:03 -0400

107 lines

Re: Ionic Testing Process

Brian Ellis <[log in to unmask]>

Thu, 16 Oct 2008 14:31:20 +0300

66 lines

New Thread

IPC 2222 classes

IPC 2222 classes

Louis Hart <[log in to unmask]>

Thu, 30 Oct 2008 10:50:05 -0400

35 lines

Re: IPC 2222 classes

Woolley, Mark D. (Mark) <[log in to unmask]>

Thu, 30 Oct 2008 09:12:48 -0600

80 lines

Re: IPC 2222 classes

Louis Hart <[log in to unmask]>

Thu, 30 Oct 2008 11:41:17 -0400

105 lines

Re: IPC 2222 classes

Gary Ferrari <[log in to unmask]>

Thu, 30 Oct 2008 11:43:43 -0400

55 lines

Re: IPC 2222 classes

Guy Ramsey <[log in to unmask]>

Thu, 30 Oct 2008 22:00:51 -0400

129 lines

New Thread

IPC Eco-Compliance Webcast Series - Last Chance to Register!

IPC Eco-Compliance Webcast Series - Last Chance to Register!

Michelle Michelotti <[log in to unmask]>

Tue, 14 Oct 2008 09:56:06 -0500

46 lines

New Thread

IPC hardware assembly spec

IPC hardware assembly spec

Genny Gibbard <[log in to unmask]>

Wed, 8 Oct 2008 16:11:19 -0600

31 lines

Re: IPC hardware assembly spec

Phil Nutting <[log in to unmask]>

Thu, 9 Oct 2008 08:16:50 -0400

68 lines

Re: IPC hardware assembly spec

Douglas O. Pauls <[log in to unmask]>

Thu, 9 Oct 2008 07:27:25 -0500

29 lines

New Thread

IPC's Eco-Compliance October Webcast Series Last Chance to Register!

IPC's Eco-Compliance October Webcast Series Last Chance to Register!

Michelle Michelotti <[log in to unmask]>

Mon, 6 Oct 2008 08:36:10 -0500

56 lines

New Thread

IPC-610, 8.2.5.5

IPC-610, 8.2.5.5

Genny Gibbard <[log in to unmask]>

Fri, 24 Oct 2008 16:22:25 -0600

39 lines

Re: IPC-610, 8.2.5.5

Gumpert, Ben <[log in to unmask]>

Mon, 27 Oct 2008 07:10:00 -0400

71 lines

Re: IPC-610, 8.2.5.5

Genny Gibbard <[log in to unmask]>

Mon, 27 Oct 2008 08:58:08 -0600

96 lines

Re: IPC-610, 8.2.5.5

Steve Gregory <[log in to unmask]>

Mon, 27 Oct 2008 12:13:12 -0500

114 lines

Re: IPC-610, 8.2.5.5

Green, Mike <[log in to unmask]>

Tue, 28 Oct 2008 10:53:02 -0600

150 lines

Re: IPC-610, 8.2.5.5

Ted Tontis <[log in to unmask]>

Tue, 28 Oct 2008 12:31:12 -0500

192 lines

Re: IPC-610, 8.2.5.5

Genny Gibbard <[log in to unmask]>

Tue, 28 Oct 2008 12:05:37 -0600

189 lines

New Thread

IPC/JEDEC Transitioning to Lead-Free Conference December 8-10, 2008 - Dallas, TX

IPC/JEDEC Transitioning to Lead-Free Conference December 8-10, 2008 - Dallas, TX

Michelle Michelotti <[log in to unmask]>

Thu, 16 Oct 2008 09:14:42 -0500

77 lines

New Thread

IR reflow oven

IR reflow oven

Wilson, Bob <[log in to unmask]>

Thu, 2 Oct 2008 14:13:21 -0700

41 lines

Re: IR reflow oven

Kevin Glidden <[log in to unmask]>

Fri, 3 Oct 2008 08:32:31 -0400

91 lines

Re: IR reflow oven

Croslin, Robert <[log in to unmask]>

Fri, 3 Oct 2008 09:19:36 -0400

135 lines

Re: IR reflow oven

Wilson, Bob <[log in to unmask]>

Fri, 3 Oct 2008 08:46:30 -0700

191 lines

Re: IR reflow oven

Kevin Glidden <[log in to unmask]>

Fri, 3 Oct 2008 12:06:57 -0400

225 lines

Re: IR reflow oven

David D. Hillman <[log in to unmask]>

Fri, 3 Oct 2008 11:12:37 -0500

241 lines

Re: IR reflow oven

Joe Fjelstad <[log in to unmask]>

Fri, 3 Oct 2008 12:32:02 EDT

218 lines

Re: IR reflow oven

Wilson, Bob <[log in to unmask]>

Fri, 3 Oct 2008 10:11:12 -0700

250 lines

Re: IR reflow oven

P. Langeveld <[log in to unmask]>

Fri, 3 Oct 2008 20:19:57 +0200

273 lines

Re: IR reflow oven

Stadem, Richard D. <[log in to unmask]>

Sun, 5 Oct 2008 08:54:10 -0500

222 lines

Re: IR reflow oven

Stadem, Richard D. <[log in to unmask]>

Sun, 5 Oct 2008 08:55:50 -0500

249 lines

New Thread

Last Chance to Register for IPC's Power Conversion Conference Featuring New Industry Standard

Last Chance to Register for IPC's Power Conversion Conference Featuring New Industry Standard

Michelle Michelotti <[log in to unmask]>

Wed, 22 Oct 2008 12:13:31 -0500

81 lines

New Thread

Last Chance to Register! IPC's Eco-Compliance Webcast Series - October 2008

Last Chance to Register! IPC's Eco-Compliance Webcast Series - October 2008

Michelle Michelotti <[log in to unmask]>

Wed, 1 Oct 2008 14:27:03 -0500

56 lines

New Thread

Lead Free BGA'S

Lead Free BGA'S

John Foster <[log in to unmask]>

Tue, 21 Oct 2008 08:21:14 -0700

35 lines

Re: Lead Free BGA'S

Igoshev, Vladimir <[log in to unmask]>

Tue, 21 Oct 2008 11:27:16 -0400

38 lines

Re: Lead Free BGA'S

Deac Descoteaux <[log in to unmask]>

Tue, 21 Oct 2008 11:27:35 -0400

71 lines

Re: Lead Free BGA'S

Gumpert, Ben <[log in to unmask]>

Tue, 21 Oct 2008 11:35:19 -0400

65 lines

Re: Lead Free BGA'S

Rex Waygood <[log in to unmask]>

Tue, 21 Oct 2008 17:08:34 +0100

94 lines

Re: Lead Free BGA'S

Croslin, Robert <[log in to unmask]>

Tue, 21 Oct 2008 12:09:50 -0400

69 lines

Re: Lead Free BGA'S

Lee Whiteman <[log in to unmask]>

Tue, 21 Oct 2008 12:10:29 -0400

135 lines

Re: Lead Free BGA'S

Woolley, Mark D. (Mark) <[log in to unmask]>

Tue, 21 Oct 2008 10:17:56 -0600

107 lines

Re: Lead Free BGA'S

David D. Hillman <[log in to unmask]>

Tue, 21 Oct 2008 11:22:50 -0500

92 lines

Re: Lead Free BGA'S

Stadem, Richard D. <[log in to unmask]>

Tue, 21 Oct 2008 12:03:11 -0500

156 lines

Re: Lead Free BGA'S

Paul Edwards <[log in to unmask]>

Tue, 21 Oct 2008 10:03:06 -0700

124 lines

Re: Lead Free BGA'S

Joyce Koo <[log in to unmask]>

Tue, 21 Oct 2008 13:19:12 -0400

73 lines

Re: Lead Free BGA'S

Werner Engelmaier /* <[log in to unmask]>

Tue, 21 Oct 2008 14:43:37 -0400

154 lines

Re: Lead Free BGA'S

David D. Hillman <[log in to unmask]>

Tue, 21 Oct 2008 14:37:51 -0500

209 lines

Re: Lead Free BGA'S

Reuven Rokah <[log in to unmask]>

Wed, 22 Oct 2008 09:46:46 +0200

164 lines

Re: Lead Free BGA'S

Stadem, Richard D. <[log in to unmask]>

Thu, 23 Oct 2008 14:03:22 -0500

262 lines

Re: Lead Free BGA'S

Bob Willis <[log in to unmask]>

Sat, 25 Oct 2008 14:34:58 +0100

181 lines

New Thread

Machine Key Performance Indicators

Machine Key Performance Indicators

Rueda, Ernesto <[log in to unmask]>

Sat, 4 Oct 2008 12:46:39 -0700

75 lines

New Thread

Metal Core PCB

Metal Core PCB

mp3 <[log in to unmask]>

Fri, 24 Oct 2008 06:57:44 +0530

31 lines

New Thread

MICRO VIA REPAIR

Re: MICRO VIA REPAIR

Wolfgang Erat <[log in to unmask]>

Sun, 12 Oct 2008 15:17:58 -0400

158 lines

New Thread

Need soldering advice ASAP No II

Re: Need soldering advice ASAP No II

Inge <[log in to unmask]>

Thu, 9 Oct 2008 09:31:10 -0700

35 lines

Re: Need soldering advice ASAP No II

Thayer, Wayne <[log in to unmask]>

Thu, 9 Oct 2008 13:19:51 -0400

73 lines

Re: Need soldering advice ASAP No II

Inge <[log in to unmask]>

Thu, 9 Oct 2008 10:41:49 -0700

94 lines

Re: Need soldering advice ASAP No II

Inge <[log in to unmask]>

Thu, 9 Oct 2008 10:55:45 -0700

125 lines

Re: Need soldering advice ASAP No II

Haynes, Kim <[log in to unmask]>

Thu, 9 Oct 2008 13:11:23 -0500

121 lines

Re: Need soldering advice ASAP No II

Inge <[log in to unmask]>

Thu, 9 Oct 2008 11:34:04 -0700

151 lines

Re: Need soldering advice ASAP No II

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 14:51:19 -0400

194 lines

Re: Need soldering advice ASAP No II

Inge <[log in to unmask]>

Thu, 9 Oct 2008 12:08:40 -0700

185 lines

Re: Need soldering advice ASAP No II

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 15:30:58 -0400

259 lines

Re: Need soldering advice ASAP No II

Haynes, Kim <[log in to unmask]>

Thu, 9 Oct 2008 15:37:35 -0500

164 lines

Re: Need soldering advice ASAP No II

Mike Fenner <[log in to unmask]>

Mon, 13 Oct 2008 09:32:57 +0100

305 lines

New Thread

Need soldering advice ASAP No II - tangential question..

Re: Need soldering advice ASAP No II - tangential question..

Eric CHRISTISON <[log in to unmask]>

Mon, 13 Oct 2008 09:49:37 +0100

52 lines

Re: Need soldering advice ASAP No II - tangential question..

Woolley, Mark D. (Mark) <[log in to unmask]>

Mon, 13 Oct 2008 10:13:35 -0600

92 lines

Re: Need soldering advice ASAP No II - tangential question..

[log in to unmask]

Mon, 13 Oct 2008 13:01:29 EDT

35 lines

Re: Need soldering advice ASAP No II - tangential question..

Mike Fenner <[log in to unmask]>

Tue, 14 Oct 2008 11:40:48 +0100

117 lines

Re: Need soldering advice ASAP No II - tangential question..

Jack Crawford <[log in to unmask]>

Tue, 14 Oct 2008 20:50:17 -0500

56 lines

Re: Need soldering advice ASAP No II - tangential question..

Mike Fenner <[log in to unmask]>

Wed, 15 Oct 2008 11:36:19 +0100

94 lines

New Thread

Need soldering advice ASAP!

Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 08:59:46 -0700

35 lines

Re: Need soldering advice ASAP!

Paul Edwards <[log in to unmask]>

Thu, 9 Oct 2008 09:20:18 -0700

98 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 09:35:45 -0700

102 lines

Re: Need soldering advice ASAP!

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 12:36:50 -0400

95 lines

Re: Need soldering advice ASAP!

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 12:41:17 -0400

122 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 09:48:08 -0700

111 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 09:53:14 -0700

152 lines

Re: Need soldering advice ASAP!

Igoshev, Vladimir <[log in to unmask]>

Thu, 9 Oct 2008 13:00:10 -0400

92 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 10:02:38 -0700

154 lines

Re: Need soldering advice ASAP!

McGlaughlin, Jeffrey A <[log in to unmask]>

Thu, 9 Oct 2008 13:06:48 -0400

185 lines

Re: Need soldering advice ASAP!

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 13:09:25 -0400

215 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 10:29:49 -0700

244 lines

Re: Need soldering advice ASAP!

Thayer, Wayne <[log in to unmask]>

Thu, 9 Oct 2008 15:18:28 -0400

283 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Thu, 9 Oct 2008 12:25:53 -0700

314 lines

Re: Need soldering advice ASAP!

Creswick, Steven <[log in to unmask]>

Thu, 9 Oct 2008 15:33:24 -0400

361 lines

Re: Need soldering advice ASAP!

Hernefjord Ingemar <[log in to unmask]>

Fri, 10 Oct 2008 10:25:55 +0200

365 lines

Re: Need soldering advice ASAP!

Creswick, Steven <[log in to unmask]>

Fri, 10 Oct 2008 05:35:58 -0400

409 lines

Re: Need soldering advice ASAP!

Joyce Koo <[log in to unmask]>

Fri, 10 Oct 2008 06:58:08 -0400

401 lines

Re: Need soldering advice ASAP!

Joyce Koo <[log in to unmask]>

Fri, 10 Oct 2008 07:14:04 -0400

414 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Sat, 11 Oct 2008 00:36:13 -0700

432 lines

Re: Need soldering advice ASAP!

Inge <[log in to unmask]>

Sat, 11 Oct 2008 00:38:34 -0700

373 lines

Re: Need soldering advice ASAP!

Mike Fenner <[log in to unmask]>

Sat, 11 Oct 2008 09:56:55 +0100

87 lines

Re: Need soldering advice ASAP!

Joyce Koo <[log in to unmask]>

Sat, 11 Oct 2008 08:00:07 -0400

132 lines

Re: Need soldering advice ASAP!

Mike Fenner <[log in to unmask]>

Mon, 13 Oct 2008 08:53:29 +0100

254 lines

New Thread

PCB Documentation

PCB Documentation

Kuczynski, Michael (MED US) <[log in to unmask]>

Mon, 6 Oct 2008 19:07:14 -0400

96 lines

Re: PCB Documentation

- bogert <[log in to unmask]>

Mon, 6 Oct 2008 19:28:41 -0400

132 lines

Re: PCB Documentation

Gumpert, Ben <[log in to unmask]>

Tue, 7 Oct 2008 06:39:36 -0400

126 lines

Re: PCB Documentation

Pete Houwen <[log in to unmask]>

Tue, 7 Oct 2008 08:53:55 -0500

59 lines

New Thread

PCB Manufacturing Processes

PCB Manufacturing Processes

roland jaquet <[log in to unmask]>

Fri, 10 Oct 2008 14:20:55 +0200

39 lines

Re: PCB Manufacturing Processes

Steve Gregory <[log in to unmask]>

Fri, 10 Oct 2008 07:35:39 -0500

72 lines

Re: PCB Manufacturing Processes

Gumpert, Ben <[log in to unmask]>

Fri, 10 Oct 2008 08:35:12 -0400

66 lines

Re: PCB Manufacturing Processes

Temkin, Gregg <[log in to unmask]>

Fri, 10 Oct 2008 07:53:09 -0700

100 lines

Re: PCB Manufacturing Processes

Douglas O. Pauls <[log in to unmask]>

Mon, 13 Oct 2008 09:25:53 -0500

83 lines

New Thread

PCB pad non-wetting issues

PCB pad non-wetting issues

Paymon Sani <[log in to unmask]>

Thu, 9 Oct 2008 09:57:20 -0400

41 lines

Re: PCB pad non-wetting issues

Phil Nutting <[log in to unmask]>

Thu, 9 Oct 2008 10:12:52 -0400

80 lines

Re: PCB pad non-wetting issues

John Burke <[log in to unmask]>

Thu, 9 Oct 2008 07:25:18 -0700

77 lines

Re: PCB pad non-wetting issues

Paymon Sani <[log in to unmask]>

Thu, 9 Oct 2008 10:48:54 -0400

116 lines

Re: PCB pad non-wetting issues

Paymon Sani <[log in to unmask]>

Thu, 9 Oct 2008 10:54:03 -0400

111 lines

Re: PCB pad non-wetting issues

Fox, Ian <[log in to unmask]>

Thu, 9 Oct 2008 16:02:35 +0100

119 lines

Re: PCB pad non-wetting issues

Igoshev, Vladimir <[log in to unmask]>

Thu, 9 Oct 2008 13:08:28 -0400

42 lines

Re: PCB pad non-wetting issues

Tan Geok Ang <[log in to unmask]>

Fri, 10 Oct 2008 09:23:04 +0800

139 lines

Re: PCB pad non-wetting issues

John Burke <[log in to unmask]>

Thu, 9 Oct 2008 19:12:40 -0700

176 lines

Re: PCB pad non-wetting issues

Paymon Sani <[log in to unmask]>

Fri, 10 Oct 2008 08:46:31 -0400

150 lines

Re: PCB pad non-wetting issues

Werner Engelmaier /* <[log in to unmask]>

Fri, 10 Oct 2008 09:34:54 -0400

92 lines

Re: PCB pad non-wetting issues

Igoshev, Vladimir <[log in to unmask]>

Fri, 10 Oct 2008 09:39:57 -0400

65 lines

Re: PCB pad non-wetting issues

John Burke <[log in to unmask]>

Fri, 10 Oct 2008 07:45:11 -0700

185 lines

Re: PCB pad non-wetting issues

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Oct 2008 07:13:22 -0700

145 lines

New Thread

Potting Encapsulation and Component Cleanliness

Re: Potting Encapsulation and Component Cleanliness

- bogert <[log in to unmask]>

Sat, 4 Oct 2008 07:42:39 -0400

84 lines

Re: Potting Encapsulation and Component Cleanliness

Joyce Koo <[log in to unmask]>

Sat, 4 Oct 2008 08:01:56 -0400

128 lines

Re: Potting Encapsulation and Component Cleanliness

Graham Naisbitt <[log in to unmask]>

Sun, 5 Oct 2008 20:50:50 +0100

97 lines

Re: Potting Encapsulation and Component Cleanliness

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 6 Oct 2008 13:02:00 -0700

128 lines

Re: Potting Encapsulation and Component Cleanliness

Bev Christian <[log in to unmask]>

Mon, 6 Oct 2008 16:37:35 -0400

109 lines

New Thread

Problems with plating vias closed

Problems with plating vias closed

Dave Connitt <[log in to unmask]>

Wed, 15 Oct 2008 13:56:40 -0400

38 lines

Re: Problems with plating vias closed

George Milad <[log in to unmask]>

Wed, 15 Oct 2008 14:24:01 EDT

36 lines

Re: Problems with plating vias closed

Dwight Mattix <[log in to unmask]>

Wed, 15 Oct 2008 12:48:49 -0700

67 lines

Re: Problems with plating vias closed

Pete Houwen <[log in to unmask]>

Thu, 16 Oct 2008 08:36:12 -0500

26 lines

Re: Problems with plating vias closed

Dave Connitt <[log in to unmask]>

Thu, 16 Oct 2008 10:35:19 -0400

50 lines

Re: Problems with plating vias closed

Dennis Fritz <[log in to unmask]>

Thu, 16 Oct 2008 11:26:14 -0400

80 lines

Re: Problems with plating vias closed

Dwight Mattix <[log in to unmask]>

Thu, 16 Oct 2008 08:39:11 -0700

71 lines

Re: Problems with plating vias closed

Dwight Mattix <[log in to unmask]>

Thu, 16 Oct 2008 09:01:17 -0700

114 lines

Re: Problems with plating vias closed

Chezhian, Krishnan (Radhakrishnan) <[log in to unmask]>

Fri, 17 Oct 2008 08:32:42 +0800

157 lines

Re: Problems with plating vias closed

Dwight Mattix <[log in to unmask]>

Thu, 16 Oct 2008 17:56:37 -0700

149 lines

New Thread

Process question-Pls reply urgently....!

Process question-Pls reply urgently....!

anand paliwal <[log in to unmask]>

Tue, 14 Oct 2008 11:40:37 -0600

32 lines

Re: Process question-Pls reply urgently....!

Douglas O. Pauls <[log in to unmask]>

Tue, 14 Oct 2008 13:08:02 -0500

76 lines

Re: Process question-Pls reply urgently....!

anand paliwal <[log in to unmask]>

Tue, 14 Oct 2008 12:18:45 -0600

86 lines

Re: Process question-Pls reply urgently....!

Roger Stoops <[log in to unmask]>

Tue, 14 Oct 2008 14:22:02 -0400

117 lines

Re: Process question-Pls reply urgently....!

Lee Whiteman <[log in to unmask]>

Tue, 14 Oct 2008 14:23:45 -0400

125 lines

Re: Process question-Pls reply urgently....!

Lee Whiteman <[log in to unmask]>

Tue, 14 Oct 2008 14:28:20 -0400

157 lines

Re: Process question-Pls reply urgently....!

anand paliwal <[log in to unmask]>

Tue, 14 Oct 2008 12:51:38 -0600

194 lines

Re: Process question-Pls reply urgently....!

Graham Collins <[log in to unmask]>

Tue, 14 Oct 2008 15:53:56 -0300

233 lines

Re: Process question-Pls reply urgently....!

Roger Stoops <[log in to unmask]>

Tue, 14 Oct 2008 14:59:54 -0400

185 lines

Re: Process question-Pls reply urgently....!

Roger Stoops <[log in to unmask]>

Tue, 14 Oct 2008 15:03:21 -0400

234 lines

Re: Process question-Pls reply urgently....!

Jason Zhao <[log in to unmask]>

Tue, 14 Oct 2008 14:12:34 -0500

224 lines

Re: Process question-Pls reply urgently....!

Werner Engelmaier /* <[log in to unmask]>

Tue, 14 Oct 2008 15:19:52 -0400

83 lines

Re: Process question-Pls reply urgently....!

Guy Ramsey <[log in to unmask]>

Tue, 14 Oct 2008 15:21:13 -0400

229 lines

Re: Process question-Pls reply urgently....!

Syed Ahmad <[log in to unmask]>

Wed, 15 Oct 2008 09:36:39 -0500

113 lines

Re: Process question-Pls reply urgently....!

Werner Engelmaier /* <[log in to unmask]>

Wed, 15 Oct 2008 12:42:36 -0400

157 lines

Re: Process question-Pls reply urgently....!

Paul Reid <[log in to unmask]>

Wed, 15 Oct 2008 13:47:14 -0400

142 lines

Re: Process question-Pls reply urgently....!

Lee Whiteman <[log in to unmask]>

Wed, 15 Oct 2008 13:52:31 -0400

211 lines

Re: Process question-Pls reply urgently....!

Paymon Sani <[log in to unmask]>

Wed, 15 Oct 2008 17:09:56 -0400

279 lines

Re: Process question-Pls reply urgently....!

Werner Engelmaier /* <[log in to unmask]>

Wed, 15 Oct 2008 22:47:01 -0400

241 lines

New Thread

Register today! IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX

Register today! IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX

Michelle Michelotti <[log in to unmask]>

Thu, 23 Oct 2008 15:56:01 -0500

70 lines

New Thread

ROHS, FLUX and FLuX CLEANING AGENT

Re: ROHS, FLUX and FLuX CLEANING AGENT

jonathan noquil <[log in to unmask]>

Thu, 9 Oct 2008 15:06:38 +0800

36 lines

Re: ROHS, FLUX and FLuX CLEANING AGENT

Ahne Oosterhof <[log in to unmask]>

Thu, 9 Oct 2008 10:19:31 -0700

64 lines

New Thread

Search for Viking 1630FS

Search for Viking 1630FS

Bill Clark <[log in to unmask]>

Wed, 15 Oct 2008 12:22:50 -0400

30 lines

New Thread

Seeking information on relaxation of FR4 under load over time

Seeking information on relaxation of FR4 under load over time

- bogert <[log in to unmask]>

Mon, 6 Oct 2008 19:19:17 -0400

59 lines

Re: Seeking information on relaxation of FR4 under load over time

John Burke <[log in to unmask]>

Mon, 6 Oct 2008 18:21:07 -0700

100 lines

New Thread

SMT dimensions guidelines, 1208

SMT dimensions guidelines, 1208

Victor Hernandez <[log in to unmask]>

Thu, 9 Oct 2008 08:35:08 -0500

27 lines

Re: SMT dimensions guidelines, 1208

Donald Kyle <[log in to unmask]>

Thu, 9 Oct 2008 08:48:38 -0500

59 lines

Re: SMT dimensions guidelines, 1208

Lenny Carter <[log in to unmask]>

Thu, 9 Oct 2008 10:09:56 -0400

87 lines

Re: SMT dimensions guidelines, 1208

Croslin, Robert <[log in to unmask]>

Thu, 9 Oct 2008 13:34:26 -0400

127 lines

New Thread

Sn-Bi Alloy for soldering

Sn-Bi Alloy for soldering

Kane, Amol (349) <[log in to unmask]>

Tue, 7 Oct 2008 11:56:56 -0400

58 lines

Re: Sn-Bi Alloy for soldering

David D. Hillman <[log in to unmask]>

Tue, 7 Oct 2008 14:00:25 -0500

189 lines

Re: Sn-Bi Alloy for soldering

Douglas O. Pauls <[log in to unmask]>

Tue, 7 Oct 2008 14:55:08 -0500

228 lines

Re: Sn-Bi Alloy for soldering

Thayer, Wayne <[log in to unmask]>

Tue, 7 Oct 2008 16:08:49 -0400

299 lines

Re: Sn-Bi Alloy for soldering

Lee Whiteman <[log in to unmask]>

Tue, 7 Oct 2008 17:12:36 -0400

109 lines

Re: Sn-Bi Alloy for soldering

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Oct 2008 14:36:12 -0700

288 lines

Re: Sn-Bi Alloy for soldering

Mike Fenner <[log in to unmask]>

Wed, 8 Oct 2008 14:15:06 +0100

158 lines

Re: Sn-Bi Alloy for soldering

[log in to unmask]

Thu, 9 Oct 2008 19:07:30 EDT

46 lines

New Thread

Solder fillet

Solder fillet

[log in to unmask] <[log in to unmask]>

Tue, 28 Oct 2008 16:07:47 +0530

29 lines

Re: Solder fillet

Stadem, Richard D. <[log in to unmask]>

Tue, 28 Oct 2008 08:54:43 -0500

58 lines

Re: Solder fillet

Steve Gregory <[log in to unmask]>

Tue, 28 Oct 2008 09:31:58 -0500

75 lines

Re: Solder fillet

Robert Kondner <[log in to unmask]>

Tue, 28 Oct 2008 10:45:34 -0400

188 lines

Re: Solder fillet

[log in to unmask] <[log in to unmask]>

Wed, 29 Oct 2008 09:02:33 +0530

89 lines

Re: Solder fillet

Mike Fenner <[log in to unmask]>

Wed, 29 Oct 2008 11:51:00 -0000

147 lines

New Thread

Solder Paste Height Measurement System

Solder Paste Height Measurement System

Robin John <[log in to unmask]>

Wed, 15 Oct 2008 15:06:41 -0500

31 lines

Re: Solder Paste Height Measurement System

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Oct 2008 15:34:08 -0500

56 lines

Re: Solder Paste Height Measurement System

Brandon Judd <[log in to unmask]>

Fri, 17 Oct 2008 10:49:49 -0400

70 lines

New Thread

SOLDERING BERYLLIUM COPPER

SOLDERING BERYLLIUM COPPER

Roberts, Jon <[log in to unmask]>

Tue, 7 Oct 2008 09:47:16 -0500

41 lines

Re: SOLDERING BERYLLIUM COPPER

Inge <[log in to unmask]>

Tue, 7 Oct 2008 08:56:32 -0700

73 lines

Re: SOLDERING BERYLLIUM COPPER

Roberts, Jon <[log in to unmask]>

Tue, 7 Oct 2008 11:08:53 -0500

132 lines

Re: SOLDERING BERYLLIUM COPPER

Inge <[log in to unmask]>

Tue, 7 Oct 2008 12:27:09 -0700

146 lines

Re: SOLDERING BERYLLIUM COPPER

Mike Fenner <[log in to unmask]>

Wed, 8 Oct 2008 14:03:28 +0100

81 lines

New Thread

Soldering to Aluminum?

Soldering to Aluminum?

Pete Houwen <[log in to unmask]>

Wed, 29 Oct 2008 09:00:54 -0500

37 lines

Re: Soldering to Aluminum?

Eric CHRISTISON <[log in to unmask]>

Wed, 29 Oct 2008 15:09:50 +0000

69 lines

Re: Soldering to Aluminum?

Phil Nutting <[log in to unmask]>

Wed, 29 Oct 2008 11:34:39 -0400

82 lines

Re: Soldering to Aluminum?

Dave Dixon <[log in to unmask]>

Wed, 29 Oct 2008 16:17:08 -0500

73 lines

Re: Soldering to Aluminum?

John Burke <[log in to unmask]>

Wed, 29 Oct 2008 15:19:39 -0700

103 lines

Re: Soldering to Aluminum?

Mike Fenner <[log in to unmask]>

Thu, 30 Oct 2008 09:21:43 -0000

173 lines

Re: Soldering to Aluminum?

Mike Fenner <[log in to unmask]>

Thu, 30 Oct 2008 09:30:15 -0000

113 lines

Re: Soldering to Aluminum?

Paul Edwards <[log in to unmask]>

Thu, 30 Oct 2008 09:13:35 -0700

272 lines

Re: Soldering to Aluminum?

Joyce Koo <[log in to unmask]>

Thu, 30 Oct 2008 12:37:34 -0400

269 lines

Re: Soldering to Aluminum?

Mike Fenner <[log in to unmask]>

Fri, 31 Oct 2008 09:31:15 -0000

267 lines

New Thread

Standards for Component Cleanliness

Standards for Component Cleanliness

Bev Christian <[log in to unmask]>

Thu, 9 Oct 2008 12:03:27 -0400

40 lines

Re: Standards for Component Cleanliness

Brian Ellis <[log in to unmask]>

Fri, 10 Oct 2008 08:58:26 +0300

83 lines

Re: Standards for Component Cleanliness

Joyce Koo <[log in to unmask]>

Fri, 10 Oct 2008 02:05:19 -0400

96 lines

Re: Standards for Component Cleanliness

Mike Fenner <[log in to unmask]>

Mon, 13 Oct 2008 09:36:11 +0100

73 lines

Re: Standards for Component Cleanliness

Bob Willis <[log in to unmask]>

Mon, 13 Oct 2008 13:03:47 +0100

132 lines

New Thread

SunStar 991

SunStar 991

Tan Geok Ang <[log in to unmask]>

Fri, 24 Oct 2008 15:58:19 +0800

31 lines

New Thread

Technical query: Land Patterns SMD

Technical query: Land Patterns SMD

Mankeekar Tushar <[log in to unmask]>

Fri, 10 Oct 2008 10:23:39 +0530

77 lines

Re: Technical query: Land Patterns SMD

Mankeekar Tushar <[log in to unmask]>

Fri, 10 Oct 2008 10:24:46 +0530

88 lines

Re: Technical query: Land Patterns SMD

Tan Geok Ang <[log in to unmask]>

Fri, 10 Oct 2008 13:49:17 +0800

117 lines

New Thread

Throughhole Equipment Training

Throughhole Equipment Training

Karen Capps <[log in to unmask]>

Mon, 27 Oct 2008 13:25:21 -0400

86 lines

Re: Throughhole Equipment Training

Steve Gregory <[log in to unmask]>

Mon, 27 Oct 2008 13:19:21 -0500

155 lines

Re: Throughhole Equipment Training

Raye Rivera <[log in to unmask]>

Tue, 28 Oct 2008 09:36:17 -0500

51 lines

Re: Throughhole Equipment Training

Ken Bloomquist <[log in to unmask]>

Tue, 28 Oct 2008 10:04:47 -0800

128 lines

New Thread

Underfill, Cause

Underfill, Cause

Tan Geok Ang <[log in to unmask]>

Thu, 23 Oct 2008 09:29:47 +0800

42 lines

Re: Underfill, Cause

Werner Engelmaier /* <[log in to unmask]>

Fri, 24 Oct 2008 10:31:35 -0400

125 lines

Re: Underfill, Cause

Werner Engelmaier /* <[log in to unmask]>

Sun, 26 Oct 2008 14:06:21 EDT

48 lines

Re: Underfill, Cause

Tan Geok Ang <[log in to unmask]>

Tue, 28 Oct 2008 11:59:50 +0800

59 lines

New Thread

Upcoming Power Conversion Conference Featuring New Industry Standard

Upcoming Power Conversion Conference Featuring New Industry Standard

Michelle Michelotti <[log in to unmask]>

Mon, 6 Oct 2008 13:58:49 -0500

92 lines

New Thread

Vapor Phase Soldering - The way Forward?

Vapor Phase Soldering - The way Forward?

Eric CHRISTISON <[log in to unmask]>

Thu, 16 Oct 2008 13:57:27 +0100

63 lines

Re: Vapor Phase Soldering - The way Forward?

Brian Ellis <[log in to unmask]>

Thu, 16 Oct 2008 16:28:09 +0300

59 lines

Re: Vapor Phase Soldering - The way Forward?

Stadem, Richard D. <[log in to unmask]>

Thu, 16 Oct 2008 08:44:05 -0500

88 lines

Re: Vapor Phase Soldering - The way Forward?

Lee Whiteman <[log in to unmask]>

Thu, 16 Oct 2008 14:25:18 -0400

123 lines

Re: Vapor Phase Soldering - The way Forward?

Werner Engelmaier /* <[log in to unmask]>

Thu, 16 Oct 2008 15:28:44 -0400

145 lines

Re: Vapor Phase Soldering - The way Forward?

Lee parker <[log in to unmask]>

Thu, 16 Oct 2008 15:39:59 -0400

180 lines

Re: Vapor Phase Soldering - The way Forward?

Stadem, Richard D. <[log in to unmask]>

Thu, 16 Oct 2008 14:43:48 -0500

175 lines

New Thread

Wave soldering temperature profile question

Wave soldering temperature profile question

- bogert <[log in to unmask]>

Sat, 4 Oct 2008 07:36:59 -0400

37 lines

Re: Wave soldering temperature profile question

Werner Engelmaier /* <[log in to unmask]>

Sat, 4 Oct 2008 10:36:35 -0400

112 lines

Re: Wave soldering temperature profile question

Alan Kreplick <[log in to unmask]>

Mon, 6 Oct 2008 06:48:15 -0400

100 lines

Re: Wave soldering temperature profile question

Phillip Bavaro <[log in to unmask]>

Mon, 6 Oct 2008 09:38:28 -0700

173 lines

New Thread

What is NADCAP ?

Re: What is NADCAP ?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 6 Oct 2008 10:38:22 -0700

79 lines

Re: What is NADCAP ?

Inge <[log in to unmask]>

Mon, 6 Oct 2008 12:54:56 -0700

108 lines

Re: What is NADCAP ?

Mike Fenner <[log in to unmask]>

Thu, 9 Oct 2008 12:56:31 +0100

149 lines

Advanced Options


Options

Log In

Log In

Get Password

Get Password


Search Archives

Search Archives


Subscribe or Unsubscribe

Subscribe or Unsubscribe


Archives

May 2017
April 2017
March 2017
February 2017
January 2017
December 2016
November 2016
October 2016
September 2016
August 2016
July 2016
June 2016
May 2016
April 2016
March 2016
February 2016
January 2016
December 2015
November 2015
October 2015
September 2015
August 2015
July 2015
June 2015
May 2015
April 2015
March 2015
February 2015
January 2015
December 2014
November 2014
October 2014
September 2014
August 2014
July 2014
June 2014
May 2014
April 2014
March 2014
February 2014
January 2014
December 2013
November 2013
October 2013
September 2013
August 2013
July 2013
June 2013
May 2013
April 2013
March 2013
February 2013
January 2013
December 2012
November 2012
October 2012
September 2012
August 2012
July 2012
June 2012
May 2012
April 2012
March 2012
February 2012
January 2012
December 2011
November 2011
October 2011
September 2011
August 2011
July 2011
June 2011
May 2011
April 2011
March 2011
February 2011
January 2011
December 2010
November 2010
October 2010
September 2010
August 2010
July 2010
June 2010
May 2010
April 2010
March 2010
February 2010
January 2010
December 2009
November 2009
October 2009
September 2009
August 2009
July 2009
June 2009
May 2009
April 2009
March 2009
February 2009
January 2009
December 2008
November 2008
October 2008
September 2008
August 2008
July 2008
June 2008
May 2008
April 2008
March 2008
February 2008
January 2008
December 2007
November 2007
October 2007
September 2007
August 2007
July 2007
June 2007
May 2007
April 2007
March 2007
February 2007
January 2007
December 2006
November 2006
October 2006
September 2006
August 2006
July 2006
June 2006
May 2006
April 2006
March 2006
February 2006
January 2006
December 2005
November 2005
October 2005
September 2005
August 2005
July 2005
June 2005
May 2005
April 2005
March 2005
February 2005
January 2005
December 2004
November 2004
October 2004
September 2004
August 2004
July 2004
June 2004
May 2004
April 2004
March 2004
February 2004
January 2004
December 2003
November 2003
October 2003
September 2003
August 2003
July 2003
June 2003
May 2003
April 2003
March 2003
February 2003
January 2003
December 2002
November 2002
October 2002
September 2002
August 2002
July 2002
June 2002
May 2002
April 2002
March 2002
February 2002
January 2002
December 2001
November 2001
October 2001
September 2001
August 2001
July 2001
June 2001
May 2001
April 2001
March 2001
February 2001
January 2001
December 2000
November 2000
October 2000
September 2000
August 2000
July 2000
June 2000
May 2000
April 2000
March 2000
February 2000
January 2000
December 1999
November 1999
October 1999
September 1999
August 1999
July 1999
June 1999
May 1999
April 1999
March 1999
February 1999
January 1999
December 1998
November 1998
October 1998
September 1998
August 1998
July 1998
June 1998
May 1998
April 1998
March 1998
February 1998
January 1998
December 1997
November 1997
October 1997
September 1997
August 1997
July 1997
June 1997
May 1997
April 1997
March 1997
February 1997
January 1997
1996
1995

ATOM RSS1 RSS2



LISTSERV.IPC.ORG

CataList Email List Search Powered by the LISTSERV Email List Manager