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October 2008

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Subject:
From:
Eric CHRISTISON <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Eric CHRISTISON <[log in to unmask]>
Date:
Thu, 16 Oct 2008 13:57:27 +0100
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Re: [TN] FW: [LF] Vapor Phase Soldering






" I should also opine that when soldering RoHS-compliant assemblies using
lead-free solder paste, you will probably get a much better yield with
VPS than you ever will with convection. Especially in the case of SAC
solders. "


Richard's statement prompts me to ask a related question.

The subject of vapour phase soldering came up in a review that I 
attended this morning on the qualification of a new semiconductor 
package. It was stated that VP soldering would become a lot more popular 
in the future because of a number of advantages it has over hot air when 
using it on lead free components.

What is the opinion of Technet on this? I'm particularily interested on 
predictions of it's usage for the manufacture of high volume PWB assys 
for consumer electronics.

Thanks,

-- 
Eric Christison Msc
Mechanical Engineer
Consumer & Micro group
Imaging Division

STMicroelectronics (R&D) Ltd
33 Pinkhill
Edinburgh EH12 7BF
United Kingdom

Tel:	+44 (0)131 336 6165
Fax:	+ 44 (0)131 336 6001

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