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October 2008


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Table of Contents:

"Conductive" Bonding Material (11 messages)
"rock that grows tentacles" (1 message)
10% Discount ends November 21, 2008 - IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX 10% Discount ends November 21, 2008 (1 message)
Acceptance spec for pin hole/blow hole (2 messages)
Au embrittlement on Copper vs Nickel (13 messages)
Barrel and Corner cracks in copper elctroplating (17 messages)
Barrel and Corner cracks in copper electroplating (5 messages)
Big problem when coating with Parylene C. (1 message)
Conductor spacing in dependance of PCB material (2 messages)
Connection failure in the super collider (2 messages)
Controlled RH% Versus Screenprinting Results (11 messages)
Copper anode placement (1 message)
CPK (2 messages)
Design Rules for Punching Bare PCBs (1 message)
Designers Day - Irvine, California, October 22, 2008 (1 message)
Electroless parameters (3 messages)
Electrolytic (Flash) Nickel Gold Finish (13 messages)
Elongation for CCL & electroplating Cu (2 messages)
encap and polymeric material spec (1 message)
europeon commisioners email?? (1 message)
Failure Analysis Lab with Ion Chromatography testing capabilities (10 messages)
Friday - off topic question - do you get e-mails on your phone (15 messages)
Friday NTC (2 messages)
FW: [LF] Vapor Phase Soldering (8 messages)
FW: [LF] Vapour Phase Soldering (2 messages)
FW: [tinwhiskers] CERN report (4 messages)
FW: [TN] Solder Paste Height Measurement System (2 messages)
Get in touch with the Market! IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA (1 message)
Hard vs. soft gold (2 messages)
How to improve solder filling and wetting contact angles for thermal vias at wave soldering process. (6 messages)
Hurry & register for Test & Inspection Conference, November 10-12, 2008 Santa Clara, CA (1 message)
Hurry and Register for IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA (1 message)
Ionic Testing Process (3 messages)
IPC 2222 classes (5 messages)
IPC Eco-Compliance Webcast Series - Last Chance to Register! (1 message)
IPC hardware assembly spec (3 messages)
IPC's Eco-Compliance October Webcast Series Last Chance to Register! (1 message)
IPC-610, 8.2.5.5 (7 messages)
IPC/JEDEC Transitioning to Lead-Free Conference December 8-10, 2008 - Dallas, TX (1 message)
IR reflow oven (11 messages)
Last Chance to Register for IPC's Power Conversion Conference Featuring New Industry Standard (1 message)
Last Chance to Register! IPC's Eco-Compliance Webcast Series - October 2008 (1 message)
Lead Free BGA'S (17 messages)
Machine Key Performance Indicators (1 message)
Metal Core PCB (1 message)
MICRO VIA REPAIR (1 message)
Need soldering advice ASAP No II (11 messages)
Need soldering advice ASAP No II - tangential question.. (6 messages)
Need soldering advice ASAP! (24 messages)
PCB Documentation (4 messages)
PCB Manufacturing Processes (5 messages)
PCB pad non-wetting issues (14 messages)
Potting Encapsulation and Component Cleanliness (5 messages)
Problems with plating vias closed (10 messages)
Process question-Pls reply urgently....! (19 messages)
Register today! IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX (1 message)
ROHS, FLUX and FLuX CLEANING AGENT (2 messages)
Search for Viking 1630FS (1 message)
Seeking information on relaxation of FR4 under load over time (2 messages)
SMT dimensions guidelines, 1208 (4 messages)
Sn-Bi Alloy for soldering (8 messages)
Solder fillet (6 messages)
Solder Paste Height Measurement System (3 messages)
SOLDERING BERYLLIUM COPPER (5 messages)
Soldering to Aluminum? (10 messages)
Standards for Component Cleanliness (5 messages)
SunStar 991 (1 message)
Technical query: Land Patterns SMD (3 messages)
Throughhole Equipment Training (4 messages)
Underfill, Cause (4 messages)
Upcoming Power Conversion Conference Featuring New Industry Standard (1 message)
Vapor Phase Soldering - The way Forward? (7 messages)
Wave soldering temperature profile question (4 messages)
What is NADCAP ? (3 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"Conductive" Bonding Material

Re: "Conductive" Bonding Material

Robin John

Tue, 21 Oct 2008 16:36:52 -0500

24 lines

Re: "Conductive" Bonding Material

Creswick, Steven

Fri, 3 Oct 2008 20:33:21 -0400

300 lines

Re: "Conductive" Bonding Material

Inge

Fri, 3 Oct 2008 11:02:55 -0700

223 lines

Re: "Conductive" Bonding Material

Inge

Wed, 1 Oct 2008 13:52:59 -0700

144 lines

Re: "Conductive" Bonding Material

Phil Nutting

Wed, 1 Oct 2008 15:47:30 -0400

118 lines

Re: "Conductive" Bonding Material

Douglas O. Pauls

Wed, 1 Oct 2008 14:06:41 -0500

88 lines

Re: "Conductive" Bonding Material

Joe Lara (Select Circuits)

Wed, 1 Oct 2008 15:19:13 -0400

230 lines

Re: "Conductive" Bonding Material

Phil Nutting

Wed, 1 Oct 2008 15:01:16 -0400

191 lines

Re: "Conductive" Bonding Material

Creswick, Steven

Wed, 1 Oct 2008 14:44:03 -0400

159 lines

Re: "Conductive" Bonding Material

Creswick, Steven

Wed, 1 Oct 2008 14:33:49 -0400

126 lines

"Conductive" Bonding Material

Joe Lara (Select Circuits)

Wed, 1 Oct 2008 14:03:01 -0400

38 lines

New Thread

"rock that grows tentacles"

"rock that grows tentacles"

Brooks, Bill

Tue, 7 Oct 2008 12:19:13 -0700

37 lines

New Thread

10% Discount ends November 21, 2008 - IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX 10% Discount ends November 21, 2008

10% Discount ends November 21, 2008 - IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX 10% Discount ends November 21, 2008

Michelle Michelotti

Thu, 30 Oct 2008 11:59:21 -0500

68 lines

New Thread

Acceptance spec for pin hole/blow hole

Re: Acceptance spec for pin hole/blow hole

Guy Ramsey

Mon, 20 Oct 2008 09:04:20 -0400

69 lines

Acceptance spec for pin hole/blow hole

Charming Chan

Mon, 20 Oct 2008 16:54:10 +0800

36 lines

New Thread

Au embrittlement on Copper vs Nickel

Re: Au embrittlement on Copper vs Nickel

Pete Houwen

Fri, 31 Oct 2008 09:59:43 -0500

47 lines

Re: Au embrittlement on Copper vs Nickel

Pete Houwen

Thu, 30 Oct 2008 15:30:20 -0500

38 lines

Re: Au embrittlement on Copper vs Nickel

Gumpert, Ben

Tue, 28 Oct 2008 05:53:33 -0400

28 lines

Re: Au embrittlement on Copper vs Nickel

Stadem, Richard D.

Mon, 27 Oct 2008 08:07:38 -0500

203 lines

Re: Au embrittlement on Copper vs Nickel

Gumpert, Ben

Mon, 27 Oct 2008 07:27:04 -0400

205 lines

Re: Au embrittlement on Copper vs Nickel

David D. Hillman

Mon, 27 Oct 2008 08:33:56 -0500

241 lines

Re: Au embrittlement on Copper vs Nickel

Bev Christian

Sat, 25 Oct 2008 14:29:36 -0400

200 lines

Re: Au embrittlement on Copper vs Nickel

Inge

Sat, 25 Oct 2008 11:20:32 -0700

162 lines

Re: Au embrittlement on Copper vs Nickel

Werner Engelmaier /*

Fri, 24 Oct 2008 16:18:44 -0400

85 lines

Re: Au embrittlement on Copper vs Nickel

David D. Hillman

Fri, 24 Oct 2008 14:11:49 -0500

175 lines

Re: Au embrittlement on Copper vs Nickel

Gumpert, Ben

Fri, 24 Oct 2008 14:03:46 -0400

121 lines

Re: Au embrittlement on Copper vs Nickel

David D. Hillman

Fri, 24 Oct 2008 10:28:47 -0500

92 lines

Au embrittlement on Copper vs Nickel

Gumpert, Ben

Fri, 24 Oct 2008 10:58:47 -0400

38 lines

New Thread

Barrel and Corner cracks in copper elctroplating

Re: Barrel and Corner cracks in copper elctroplating

<>

Tue, 7 Oct 2008 10:58:22 -0400

187 lines

Re: Barrel and Corner cracks in copper elctroplating

Whittaker, Dewey (EHCOE)

Tue, 7 Oct 2008 07:02:30 -0700

141 lines

Re: Barrel and Corner cracks in copper elctroplating

Stadem, Richard D.

Tue, 7 Oct 2008 07:40:33 -0500

113 lines

Re: Barrel and Corner cracks in copper elctroplating

Igoshev, Vladimir

Tue, 7 Oct 2008 08:37:27 -0400

70 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid

Tue, 7 Oct 2008 08:27:57 -0400

76 lines

Re: Barrel and Corner cracks in copper elctroplating

Werner Engelmaier /*

Tue, 7 Oct 2008 04:42:47 EDT

29 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid

Mon, 6 Oct 2008 17:56:24 -0400

286 lines

Re: Barrel and Corner cracks in copper elctroplating

Terry L. Munson

Mon, 6 Oct 2008 16:34:50 EDT

263 lines

Re: Barrel and Corner cracks in copper elctroplating

Werner Engelmaier /*

Mon, 6 Oct 2008 16:26:03 -0400

236 lines

Re: Barrel and Corner cracks in copper elctroplating

Ido Mashall

Mon, 6 Oct 2008 14:04:05 +0200

110 lines

Re: Barrel and Corner cracks in copper elctroplating

Ido Mashall

Sun, 5 Oct 2008 22:54:59 +0200

202 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid

Sat, 4 Oct 2008 19:28:17 -0400

148 lines

Re: Barrel and Corner cracks in copper elctroplating

SUBSCRIBE technet legg

Sat, 4 Oct 2008 10:21:10 -0500

34 lines

Re: Barrel and Corner cracks in copper elctroplating

Ido Mashall

Sat, 4 Oct 2008 11:41:50 +0300

207 lines

Re: Barrel and Corner cracks in copper elctroplating

Paul Reid

Fri, 3 Oct 2008 17:51:57 -0400

139 lines

Re: Barrel and Corner cracks in copper elctroplating

Scott Westheimer

Fri, 3 Oct 2008 16:52:47 -0400

60 lines

Barrel and Corner cracks in copper elctroplating

Ido Mashall

Fri, 3 Oct 2008 21:12:43 +0300

60 lines

New Thread

Barrel and Corner cracks in copper electroplating

Re: Barrel and Corner cracks in copper electroplating

Victor Hernandez

Tue, 7 Oct 2008 06:54:55 -0500

328 lines

Re: Barrel and Corner cracks in copper electroplating

Ido Mashall

Mon, 6 Oct 2008 13:56:39 +0200

236 lines

Re: Barrel and Corner cracks in copper electroplating

Victor Hernandez

Mon, 6 Oct 2008 06:20:51 -0500

173 lines

Re: Barrel and Corner cracks in copper electroplating

Randy Bock Sr.

Mon, 6 Oct 2008 07:08:37 -0400

140 lines

Re: Barrel and Corner cracks in copper electroplating

Victor Hernandez

Mon, 6 Oct 2008 06:05:53 -0500

82 lines

New Thread

Big problem when coating with Parylene C.

Re: Big problem when coating with Parylene C.

Reuven Rokah

Thu, 2 Oct 2008 10:03:10 +0300

37 lines

New Thread

Conductor spacing in dependance of PCB material

Re: Conductor spacing in dependance of PCB material

Brian Ellis

Thu, 2 Oct 2008 19:03:31 +0300

130 lines

Conductor spacing in dependance of PCB material

Hechenberger Philipp

Thu, 2 Oct 2008 17:26:12 +0200

85 lines

New Thread

Connection failure in the super collider

Re: Connection failure in the super collider

<>

Mon, 6 Oct 2008 17:59:38 EDT

38 lines

Connection failure in the super collider

John Burke

Mon, 6 Oct 2008 14:31:55 -0700

47 lines

New Thread

Controlled RH% Versus Screenprinting Results

Re: Controlled RH% Versus Screenprinting Results

Joe Fjelstad

Mon, 13 Oct 2008 16:17:35 EDT

200 lines

Re: Controlled RH% Versus Screenprinting Results

Whittaker, Dewey (EHCOE)

Mon, 13 Oct 2008 06:55:47 -0700

177 lines

Re: Controlled RH% Versus Screenprinting Results

Creswick, Steven

Thu, 9 Oct 2008 05:46:36 -0400

91 lines

Re: Controlled RH% Versus Screenprinting Results

John Burke

Wed, 8 Oct 2008 13:09:36 -0700

144 lines

Re: Controlled RH% Versus Screenprinting Results

Stadem, Richard D.

Wed, 8 Oct 2008 15:06:26 -0500

128 lines

Re: Controlled RH% Versus Screenprinting Results

Nowland, Russell Howard (Russell)

Wed, 8 Oct 2008 15:04:18 -0500

144 lines

Re: Controlled RH% Versus Screenprinting Results

Leland Woodall

Wed, 8 Oct 2008 15:59:46 -0400

105 lines

Re: Controlled RH% Versus Screenprinting Results

Mike Sewell

Wed, 8 Oct 2008 14:00:24 -0500

71 lines

Re: Controlled RH% Versus Screenprinting Results

Nowland, Russell Howard (Russell)

Wed, 8 Oct 2008 13:57:52 -0500

103 lines

Re: Controlled RH% Versus Screenprinting Results

John Burke

Wed, 8 Oct 2008 11:46:57 -0700

77 lines

Controlled RH% Versus Screenprinting Results

Leland Woodall

Wed, 8 Oct 2008 14:10:38 -0400

43 lines

New Thread

Copper anode placement

Copper anode placement

Adam Seychell

Tue, 28 Oct 2008 18:06:13 +1100

46 lines

New Thread

CPK

Re: CPK

Guy Ramsey

Wed, 29 Oct 2008 10:22:09 -0400

59 lines

CPK

john queen

Tue, 28 Oct 2008 10:55:01 -0000

29 lines

New Thread

Design Rules for Punching Bare PCBs

Design Rules for Punching Bare PCBs

James Verrette

Tue, 21 Oct 2008 16:04:48 -0400

31 lines

New Thread

Designers Day - Irvine, California, October 22, 2008

Designers Day - Irvine, California, October 22, 2008

Tina Nerad

Thu, 9 Oct 2008 13:37:11 -0500

48 lines

New Thread

Electroless parameters

Re: Electroless parameters

Bob METCALF

Fri, 24 Oct 2008 07:03:09 -0700

96 lines

Re: Electroless parameters

Scott Westheimer

Fri, 24 Oct 2008 06:50:14 -0400

53 lines

Electroless parameters

mp3

Fri, 24 Oct 2008 06:48:48 +0530

30 lines

New Thread

Electrolytic (Flash) Nickel Gold Finish

Re: Electrolytic (Flash) Nickel Gold Finish

anand paliwal

Tue, 7 Oct 2008 08:22:10 -0600

169 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Yong How GOH

Tue, 7 Oct 2008 10:38:48 +0800

144 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Werner Engelmaier /*

Sat, 4 Oct 2008 04:14:46 EDT

32 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Lee parker

Fri, 3 Oct 2008 19:51:26 -0400

213 lines

Re: Electrolytic (Flash) Nickel Gold Finish

George Milad

Fri, 3 Oct 2008 11:35:43 EDT

50 lines

Re: Electrolytic (Flash) Nickel Gold Finish

anand paliwal

Fri, 3 Oct 2008 08:39:39 -0600

97 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Joyce Koo

Fri, 3 Oct 2008 08:57:24 -0400

218 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Werner Engelmaier /*

Fri, 3 Oct 2008 05:05:55 -0400

177 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Anil kher

Fri, 3 Oct 2008 12:31:12 +0530

116 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Lee parker

Thu, 2 Oct 2008 10:01:24 -0400

150 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Hernefjord Ingemar

Thu, 2 Oct 2008 09:00:06 +0200

72 lines

Re: Electrolytic (Flash) Nickel Gold Finish

Lee parker

Wed, 1 Oct 2008 20:44:55 -0400

85 lines

Electrolytic (Flash) Nickel Gold Finish

Anand

Wed, 1 Oct 2008 16:02:42 -0500

48 lines

New Thread

Elongation for CCL & electroplating Cu

Re: Elongation for CCL & electroplating Cu

Werner Engelmaier /*

Wed, 15 Oct 2008 09:11:35 -0400

91 lines

Elongation for CCL & electroplating Cu

Lin Leo

Wed, 15 Oct 2008 18:45:07 +0800

36 lines

New Thread

encap and polymeric material spec

encap and polymeric material spec

Joyce Koo

Thu, 9 Oct 2008 21:39:41 -0400

53 lines

New Thread

europeon commisioners email??

europeon commisioners email??

PCB designer

Mon, 27 Oct 2008 11:18:22 -0500

29 lines

New Thread

Failure Analysis Lab with Ion Chromatography testing capabilities

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Sean Hill

Thu, 2 Oct 2008 15:43:35 -0700

175 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Joyce Koo

Thu, 2 Oct 2008 18:33:02 -0400

160 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Mark Palmer

Thu, 2 Oct 2008 16:42:39 -0500

114 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Bob METCALF

Thu, 2 Oct 2008 15:11:03 -0700

114 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Stadem, Richard D.

Thu, 2 Oct 2008 15:05:40 -0500

61 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Thomas Borman

Thu, 2 Oct 2008 14:47:24 -0500

66 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Joyce Koo

Thu, 2 Oct 2008 14:34:28 -0400

66 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Graham Collins

Thu, 2 Oct 2008 15:34:12 -0300

73 lines

Re: Failure Analysis Lab with Ion Chromatography testing capabilities

Kelly Morris

Thu, 2 Oct 2008 13:07:16 -0500

30 lines

Failure Analysis Lab with Ion Chromatography testing capabilities

James Verrette

Thu, 2 Oct 2008 14:21:51 -0400

30 lines

New Thread

Friday - off topic question - do you get e-mails on your phone

Re: Friday - off topic question - do you get e-mails on your phone

Stadem, Richard D.

Mon, 13 Oct 2008 10:42:41 -0500

324 lines

Re: Friday - off topic question - do you get e-mails on your phone

Douglas O. Pauls

Mon, 13 Oct 2008 10:20:56 -0500

266 lines

Re: Friday - off topic question - do you get e-mails on your phone

Bev Christian

Mon, 13 Oct 2008 11:17:08 -0400

238 lines

Re: Friday - off topic question - do you get e-mails on your phone

Douglas O. Pauls

Mon, 13 Oct 2008 09:59:29 -0500

197 lines

Re: Friday - off topic question - do you get e-mails on your phone

Ken Bloomquist

Mon, 13 Oct 2008 07:36:20 -0700

141 lines

Re: Friday - off topic question - do you get e-mails on your phone

Leif Erik Laerum

Mon, 13 Oct 2008 07:45:44 -0500

76 lines

Re: Friday - off topic question - do you get e-mails on your phone

Mike Fenner

Sat, 11 Oct 2008 12:23:12 +0100

125 lines

Re: Friday - off topic question - do you get e-mails on your phone

Sean Hill

Fri, 10 Oct 2008 16:10:35 -0700

129 lines

Re: Friday - off topic question - do you get e-mails on your phone

Bob METCALF

Fri, 10 Oct 2008 15:49:05 -0700

108 lines

Re: Friday - off topic question - do you get e-mails on your phone

Inge

Fri, 10 Oct 2008 13:54:44 -0700

80 lines

Re: Friday - off topic question - do you get e-mails on your phone

John Burke

Fri, 10 Oct 2008 13:03:09 -0700

89 lines

Re: Friday - off topic question - do you get e-mails on your phone

Bev Christian

Fri, 10 Oct 2008 14:55:10 -0400

97 lines

Re: Friday - off topic question - do you get e-mails on your phone

Randy Bock Sr.

Fri, 10 Oct 2008 14:30:15 -0400

153 lines

Re: Friday - off topic question - do you get e-mails on your phone

<Richard Edgar>

Fri, 10 Oct 2008 14:19:41 -0400

90 lines

Friday - off topic question - do you get e-mails on your phone

Kim Sterling

Fri, 10 Oct 2008 13:09:20 -0500

52 lines

New Thread

Friday NTC

Re: Friday NTC

Whittaker, Dewey (EHCOE)

Mon, 13 Oct 2008 08:15:07 -0700

98 lines

Friday NTC

Phil Nutting

Fri, 10 Oct 2008 14:27:02 -0400

63 lines

New Thread

FW: [LF] Vapor Phase Soldering

Re: FW: [LF] Vapor Phase Soldering

Stadem, Richard D.

Mon, 20 Oct 2008 09:33:03 -0500

274 lines

Re: FW: [LF] Vapor Phase Soldering

Inge

Fri, 17 Oct 2008 13:11:17 -0700

132 lines

Re: FW: [LF] Vapor Phase Soldering

Grunde Gjertsen

Fri, 17 Oct 2008 12:55:19 +0200

251 lines

Re: FW: [LF] Vapor Phase Soldering

Werner Engelmaier /*

Thu, 16 Oct 2008 11:04:01 -0400

215 lines

Re: FW: [LF] Vapor Phase Soldering

Stadem, Richard D.

Thu, 16 Oct 2008 08:03:02 -0500

221 lines

Re: FW: [LF] Vapor Phase Soldering

Grunde Gjertsen

Thu, 16 Oct 2008 07:29:54 +0200

163 lines

Re: FW: [LF] Vapor Phase Soldering

Stadem, Richard D.

Wed, 15 Oct 2008 10:48:47 -0500

120 lines

FW: [LF] Vapor Phase Soldering

Stadem, Richard D.

Wed, 15 Oct 2008 10:37:49 -0500

90 lines

New Thread

FW: [LF] Vapour Phase Soldering

Re: FW: [LF] Vapour Phase Soldering

Stadem, Richard D.

Thu, 16 Oct 2008 10:31:27 -0500

306 lines

Re: FW: [LF] Vapour Phase Soldering

Bob Willis

Thu, 16 Oct 2008 15:31:10 +0100

282 lines

New Thread

FW: [tinwhiskers] CERN report

Re: FW: [tinwhiskers] CERN report

Paul Edwards

Fri, 17 Oct 2008 15:58:21 -0700

185 lines

Re: FW: [tinwhiskers] CERN report

Inge

Fri, 17 Oct 2008 13:28:58 -0700

121 lines

Re: FW: [tinwhiskers] CERN report

Inge

Fri, 17 Oct 2008 13:24:33 -0700

96 lines

FW: [tinwhiskers] CERN report

John Burke

Fri, 17 Oct 2008 09:34:40 -0700

64 lines

New Thread

FW: [TN] Solder Paste Height Measurement System

Re: FW: [TN] Solder Paste Height Measurement System

Robin John

Mon, 20 Oct 2008 09:06:18 -0500

148 lines

FW: [TN] Solder Paste Height Measurement System

Stadem, Richard D.

Mon, 20 Oct 2008 07:45:53 -0500

119 lines

New Thread

Get in touch with the Market! IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Get in touch with the Market! IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Michelle Michelotti

Thu, 23 Oct 2008 14:44:31 -0500

59 lines

New Thread

Hard vs. soft gold

Re: Hard vs. soft gold

Stadem, Richard D.

Thu, 23 Oct 2008 08:07:47 -0500

87 lines

Hard vs. soft gold

Guy Ramsey

Thu, 23 Oct 2008 05:11:33 -0400

30 lines

New Thread

How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Phil Nutting

Wed, 29 Oct 2008 11:29:28 -0400

89 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Pete Houwen

Wed, 29 Oct 2008 08:06:55 -0500

53 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Tan Geok Ang

Wed, 29 Oct 2008 09:16:54 +0800

193 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Charming Chan

Wed, 29 Oct 2008 08:59:22 +0800

98 lines

Re: How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Tan Geok Ang

Tue, 28 Oct 2008 22:00:08 +0800

75 lines

How to improve solder filling and wetting contact angles for thermal vias at wave soldering process.

Charming Chan

Tue, 28 Oct 2008 20:25:01 +0800

33 lines

New Thread

Hurry & register for Test & Inspection Conference, November 10-12, 2008 Santa Clara, CA

Hurry & register for Test & Inspection Conference, November 10-12, 2008 Santa Clara, CA

Michelle Michelotti

Wed, 15 Oct 2008 15:00:22 -0500

61 lines

New Thread

Hurry and Register for IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Hurry and Register for IPC International Test & Inspection Technology Conference - November 10-12, 2008 Santa Clara, CA

Michelle Michelotti

Wed, 8 Oct 2008 10:00:55 -0500

58 lines

New Thread

Ionic Testing Process

Re: Ionic Testing Process

Brian Ellis

Thu, 16 Oct 2008 14:31:20 +0300

66 lines

Re: Ionic Testing Process

Joe Russeau

Wed, 15 Oct 2008 18:02:03 -0400

107 lines

Ionic Testing Process

Chris Schaefer

Wed, 15 Oct 2008 15:13:15 -0500

45 lines

New Thread

IPC 2222 classes

Re: IPC 2222 classes

Guy Ramsey

Thu, 30 Oct 2008 22:00:51 -0400

129 lines

Re: IPC 2222 classes

Gary Ferrari

Thu, 30 Oct 2008 11:43:43 -0400

55 lines

Re: IPC 2222 classes

Louis Hart

Thu, 30 Oct 2008 11:41:17 -0400

105 lines

Re: IPC 2222 classes

Woolley, Mark D. (Mark)

Thu, 30 Oct 2008 09:12:48 -0600

80 lines

IPC 2222 classes

Louis Hart

Thu, 30 Oct 2008 10:50:05 -0400

35 lines

New Thread

IPC Eco-Compliance Webcast Series - Last Chance to Register!

IPC Eco-Compliance Webcast Series - Last Chance to Register!

Michelle Michelotti

Tue, 14 Oct 2008 09:56:06 -0500

46 lines

New Thread

IPC hardware assembly spec

Re: IPC hardware assembly spec

Douglas O. Pauls

Thu, 9 Oct 2008 07:27:25 -0500

29 lines

Re: IPC hardware assembly spec

Phil Nutting

Thu, 9 Oct 2008 08:16:50 -0400

68 lines

IPC hardware assembly spec

Genny Gibbard

Wed, 8 Oct 2008 16:11:19 -0600

31 lines

New Thread

IPC's Eco-Compliance October Webcast Series Last Chance to Register!

IPC's Eco-Compliance October Webcast Series Last Chance to Register!

Michelle Michelotti

Mon, 6 Oct 2008 08:36:10 -0500

56 lines

New Thread

IPC-610, 8.2.5.5

Re: IPC-610, 8.2.5.5

Genny Gibbard

Tue, 28 Oct 2008 12:05:37 -0600

189 lines

Re: IPC-610, 8.2.5.5

Ted Tontis

Tue, 28 Oct 2008 12:31:12 -0500

192 lines

Re: IPC-610, 8.2.5.5

Green, Mike

Tue, 28 Oct 2008 10:53:02 -0600

150 lines

Re: IPC-610, 8.2.5.5

Steve Gregory

Mon, 27 Oct 2008 12:13:12 -0500

114 lines

Re: IPC-610, 8.2.5.5

Genny Gibbard

Mon, 27 Oct 2008 08:58:08 -0600

96 lines

Re: IPC-610, 8.2.5.5

Gumpert, Ben

Mon, 27 Oct 2008 07:10:00 -0400

71 lines

IPC-610, 8.2.5.5

Genny Gibbard

Fri, 24 Oct 2008 16:22:25 -0600

39 lines

New Thread

IPC/JEDEC Transitioning to Lead-Free Conference December 8-10, 2008 - Dallas, TX

IPC/JEDEC Transitioning to Lead-Free Conference December 8-10, 2008 - Dallas, TX

Michelle Michelotti

Thu, 16 Oct 2008 09:14:42 -0500

77 lines

New Thread

IR reflow oven

Re: IR reflow oven

Stadem, Richard D.

Sun, 5 Oct 2008 08:55:50 -0500

249 lines

Re: IR reflow oven

Stadem, Richard D.

Sun, 5 Oct 2008 08:54:10 -0500

222 lines

Re: IR reflow oven

P. Langeveld

Fri, 3 Oct 2008 20:19:57 +0200

273 lines

Re: IR reflow oven

Wilson, Bob

Fri, 3 Oct 2008 10:11:12 -0700

250 lines

Re: IR reflow oven

Joe Fjelstad

Fri, 3 Oct 2008 12:32:02 EDT

218 lines

Re: IR reflow oven

David D. Hillman

Fri, 3 Oct 2008 11:12:37 -0500

241 lines

Re: IR reflow oven

Kevin Glidden

Fri, 3 Oct 2008 12:06:57 -0400

225 lines

Re: IR reflow oven

Wilson, Bob

Fri, 3 Oct 2008 08:46:30 -0700

191 lines

Re: IR reflow oven

Croslin, Robert

Fri, 3 Oct 2008 09:19:36 -0400

135 lines

Re: IR reflow oven

Kevin Glidden

Fri, 3 Oct 2008 08:32:31 -0400

91 lines

IR reflow oven

Wilson, Bob

Thu, 2 Oct 2008 14:13:21 -0700

41 lines

New Thread

Last Chance to Register for IPC's Power Conversion Conference Featuring New Industry Standard

Last Chance to Register for IPC's Power Conversion Conference Featuring New Industry Standard

Michelle Michelotti

Wed, 22 Oct 2008 12:13:31 -0500

81 lines

New Thread

Last Chance to Register! IPC's Eco-Compliance Webcast Series - October 2008

Last Chance to Register! IPC's Eco-Compliance Webcast Series - October 2008

Michelle Michelotti

Wed, 1 Oct 2008 14:27:03 -0500

56 lines

New Thread

Lead Free BGA'S

Re: Lead Free BGA'S

Bob Willis

Sat, 25 Oct 2008 14:34:58 +0100

181 lines

Re: Lead Free BGA'S

Stadem, Richard D.

Thu, 23 Oct 2008 14:03:22 -0500

262 lines

Re: Lead Free BGA'S

Reuven Rokah

Wed, 22 Oct 2008 09:46:46 +0200

164 lines

Re: Lead Free BGA'S

David D. Hillman

Tue, 21 Oct 2008 14:37:51 -0500

209 lines

Re: Lead Free BGA'S

Werner Engelmaier /*

Tue, 21 Oct 2008 14:43:37 -0400

154 lines

Re: Lead Free BGA'S

Joyce Koo

Tue, 21 Oct 2008 13:19:12 -0400

73 lines

Re: Lead Free BGA'S

Paul Edwards

Tue, 21 Oct 2008 10:03:06 -0700

124 lines

Re: Lead Free BGA'S

Stadem, Richard D.

Tue, 21 Oct 2008 12:03:11 -0500

156 lines

Re: Lead Free BGA'S

David D. Hillman

Tue, 21 Oct 2008 11:22:50 -0500

92 lines

Re: Lead Free BGA'S

Woolley, Mark D. (Mark)

Tue, 21 Oct 2008 10:17:56 -0600

107 lines

Re: Lead Free BGA'S

Lee Whiteman

Tue, 21 Oct 2008 12:10:29 -0400

135 lines

Re: Lead Free BGA'S

Croslin, Robert

Tue, 21 Oct 2008 12:09:50 -0400

69 lines

Re: Lead Free BGA'S

Rex Waygood

Tue, 21 Oct 2008 17:08:34 +0100

94 lines

Re: Lead Free BGA'S

Gumpert, Ben

Tue, 21 Oct 2008 11:35:19 -0400

65 lines

Re: Lead Free BGA'S

Deac Descoteaux

Tue, 21 Oct 2008 11:27:35 -0400

71 lines

Re: Lead Free BGA'S

Igoshev, Vladimir

Tue, 21 Oct 2008 11:27:16 -0400

38 lines

Lead Free BGA'S

John Foster

Tue, 21 Oct 2008 08:21:14 -0700

35 lines

New Thread

Machine Key Performance Indicators

Machine Key Performance Indicators

Rueda, Ernesto

Sat, 4 Oct 2008 12:46:39 -0700

75 lines

New Thread

Metal Core PCB

Metal Core PCB

mp3

Fri, 24 Oct 2008 06:57:44 +0530

31 lines

New Thread

MICRO VIA REPAIR

Re: MICRO VIA REPAIR

Wolfgang Erat

Sun, 12 Oct 2008 15:17:58 -0400

158 lines

New Thread

Need soldering advice ASAP No II

Re: Need soldering advice ASAP No II

Mike Fenner

Mon, 13 Oct 2008 09:32:57 +0100

305 lines

Re: Need soldering advice ASAP No II

Haynes, Kim

Thu, 9 Oct 2008 15:37:35 -0500

164 lines

Re: Need soldering advice ASAP No II

Creswick, Steven

Thu, 9 Oct 2008 15:30:58 -0400

259 lines

Re: Need soldering advice ASAP No II

Inge

Thu, 9 Oct 2008 12:08:40 -0700

185 lines

Re: Need soldering advice ASAP No II

Creswick, Steven

Thu, 9 Oct 2008 14:51:19 -0400

194 lines

Re: Need soldering advice ASAP No II

Inge

Thu, 9 Oct 2008 11:34:04 -0700

151 lines

Re: Need soldering advice ASAP No II

Haynes, Kim

Thu, 9 Oct 2008 13:11:23 -0500

121 lines

Re: Need soldering advice ASAP No II

Inge

Thu, 9 Oct 2008 10:55:45 -0700

125 lines

Re: Need soldering advice ASAP No II

Inge

Thu, 9 Oct 2008 10:41:49 -0700

94 lines

Re: Need soldering advice ASAP No II

Thayer, Wayne

Thu, 9 Oct 2008 13:19:51 -0400

73 lines

Re: Need soldering advice ASAP No II

Inge

Thu, 9 Oct 2008 09:31:10 -0700

35 lines

New Thread

Need soldering advice ASAP No II - tangential question..

Re: Need soldering advice ASAP No II - tangential question..

Mike Fenner

Wed, 15 Oct 2008 11:36:19 +0100

94 lines

Re: Need soldering advice ASAP No II - tangential question..

Jack Crawford

Tue, 14 Oct 2008 20:50:17 -0500

56 lines

Re: Need soldering advice ASAP No II - tangential question..

Mike Fenner

Tue, 14 Oct 2008 11:40:48 +0100

117 lines

Re: Need soldering advice ASAP No II - tangential question..

<>

Mon, 13 Oct 2008 13:01:29 EDT

35 lines

Re: Need soldering advice ASAP No II - tangential question..

Woolley, Mark D. (Mark)

Mon, 13 Oct 2008 10:13:35 -0600

92 lines

Re: Need soldering advice ASAP No II - tangential question..

Eric CHRISTISON

Mon, 13 Oct 2008 09:49:37 +0100

52 lines

New Thread

Need soldering advice ASAP!

Re: Need soldering advice ASAP!

Mike Fenner

Mon, 13 Oct 2008 08:53:29 +0100

254 lines

Re: Need soldering advice ASAP!

Joyce Koo

Sat, 11 Oct 2008 08:00:07 -0400

132 lines

Re: Need soldering advice ASAP!

Mike Fenner

Sat, 11 Oct 2008 09:56:55 +0100

87 lines

Re: Need soldering advice ASAP!

Inge

Sat, 11 Oct 2008 00:38:34 -0700

373 lines

Re: Need soldering advice ASAP!

Inge

Sat, 11 Oct 2008 00:36:13 -0700

432 lines

Re: Need soldering advice ASAP!

Joyce Koo

Fri, 10 Oct 2008 07:14:04 -0400

414 lines

Re: Need soldering advice ASAP!

Joyce Koo

Fri, 10 Oct 2008 06:58:08 -0400

401 lines

Re: Need soldering advice ASAP!

Creswick, Steven

Fri, 10 Oct 2008 05:35:58 -0400

409 lines

Re: Need soldering advice ASAP!

Hernefjord Ingemar

Fri, 10 Oct 2008 10:25:55 +0200

365 lines

Re: Need soldering advice ASAP!

Creswick, Steven

Thu, 9 Oct 2008 15:33:24 -0400

361 lines

Re: Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 12:25:53 -0700

314 lines

Re: Need soldering advice ASAP!

Thayer, Wayne

Thu, 9 Oct 2008 15:18:28 -0400

283 lines

Re: Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 10:29:49 -0700

244 lines

Re: Need soldering advice ASAP!

Creswick, Steven

Thu, 9 Oct 2008 13:09:25 -0400

215 lines

Re: Need soldering advice ASAP!

McGlaughlin, Jeffrey A

Thu, 9 Oct 2008 13:06:48 -0400

185 lines

Re: Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 10:02:38 -0700

154 lines

Re: Need soldering advice ASAP!

Igoshev, Vladimir

Thu, 9 Oct 2008 13:00:10 -0400

92 lines

Re: Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 09:53:14 -0700

152 lines

Re: Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 09:48:08 -0700

111 lines

Re: Need soldering advice ASAP!

Creswick, Steven

Thu, 9 Oct 2008 12:41:17 -0400

122 lines

Re: Need soldering advice ASAP!

Creswick, Steven

Thu, 9 Oct 2008 12:36:50 -0400

95 lines

Re: Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 09:35:45 -0700

102 lines

Re: Need soldering advice ASAP!

Paul Edwards

Thu, 9 Oct 2008 09:20:18 -0700

98 lines

Need soldering advice ASAP!

Inge

Thu, 9 Oct 2008 08:59:46 -0700

35 lines

New Thread

PCB Documentation

Re: PCB Documentation

Pete Houwen

Tue, 7 Oct 2008 08:53:55 -0500

59 lines

Re: PCB Documentation

Gumpert, Ben

Tue, 7 Oct 2008 06:39:36 -0400

126 lines

Re: PCB Documentation

- bogert

Mon, 6 Oct 2008 19:28:41 -0400

132 lines

PCB Documentation

Kuczynski, Michael (MED US)

Mon, 6 Oct 2008 19:07:14 -0400

96 lines

New Thread

PCB Manufacturing Processes

Re: PCB Manufacturing Processes

Douglas O. Pauls

Mon, 13 Oct 2008 09:25:53 -0500

83 lines

Re: PCB Manufacturing Processes

Temkin, Gregg

Fri, 10 Oct 2008 07:53:09 -0700

100 lines

Re: PCB Manufacturing Processes

Gumpert, Ben

Fri, 10 Oct 2008 08:35:12 -0400

66 lines

Re: PCB Manufacturing Processes

Steve Gregory

Fri, 10 Oct 2008 07:35:39 -0500

72 lines

PCB Manufacturing Processes

roland jaquet

Fri, 10 Oct 2008 14:20:55 +0200

39 lines

New Thread

PCB pad non-wetting issues

Re: PCB pad non-wetting issues

Whittaker, Dewey (EHCOE)

Mon, 13 Oct 2008 07:13:22 -0700

145 lines

Re: PCB pad non-wetting issues

John Burke

Fri, 10 Oct 2008 07:45:11 -0700

185 lines

Re: PCB pad non-wetting issues

Igoshev, Vladimir

Fri, 10 Oct 2008 09:39:57 -0400

65 lines

Re: PCB pad non-wetting issues

Werner Engelmaier /*

Fri, 10 Oct 2008 09:34:54 -0400

92 lines

Re: PCB pad non-wetting issues

Paymon Sani

Fri, 10 Oct 2008 08:46:31 -0400

150 lines

Re: PCB pad non-wetting issues

John Burke

Thu, 9 Oct 2008 19:12:40 -0700

176 lines

Re: PCB pad non-wetting issues

Tan Geok Ang

Fri, 10 Oct 2008 09:23:04 +0800

139 lines

Re: PCB pad non-wetting issues

Igoshev, Vladimir

Thu, 9 Oct 2008 13:08:28 -0400

42 lines

Re: PCB pad non-wetting issues

Fox, Ian

Thu, 9 Oct 2008 16:02:35 +0100

119 lines

Re: PCB pad non-wetting issues

Paymon Sani

Thu, 9 Oct 2008 10:54:03 -0400

111 lines

Re: PCB pad non-wetting issues

Paymon Sani

Thu, 9 Oct 2008 10:48:54 -0400

116 lines

Re: PCB pad non-wetting issues

John Burke

Thu, 9 Oct 2008 07:25:18 -0700

77 lines

Re: PCB pad non-wetting issues

Phil Nutting

Thu, 9 Oct 2008 10:12:52 -0400

80 lines

PCB pad non-wetting issues

Paymon Sani

Thu, 9 Oct 2008 09:57:20 -0400

41 lines

New Thread

Potting Encapsulation and Component Cleanliness

Re: Potting Encapsulation and Component Cleanliness

Bev Christian

Mon, 6 Oct 2008 16:37:35 -0400

109 lines

Re: Potting Encapsulation and Component Cleanliness

Whittaker, Dewey (EHCOE)

Mon, 6 Oct 2008 13:02:00 -0700

128 lines

Re: Potting Encapsulation and Component Cleanliness

Graham Naisbitt

Sun, 5 Oct 2008 20:50:50 +0100

97 lines

Re: Potting Encapsulation and Component Cleanliness

Joyce Koo

Sat, 4 Oct 2008 08:01:56 -0400

128 lines

Re: Potting Encapsulation and Component Cleanliness

- bogert

Sat, 4 Oct 2008 07:42:39 -0400

84 lines

New Thread

Problems with plating vias closed

Re: Problems with plating vias closed

Dwight Mattix

Thu, 16 Oct 2008 17:56:37 -0700

149 lines

Re: Problems with plating vias closed

Chezhian, Krishnan (Radhakrishnan)

Fri, 17 Oct 2008 08:32:42 +0800

157 lines

Re: Problems with plating vias closed

Dwight Mattix

Thu, 16 Oct 2008 09:01:17 -0700

114 lines

Re: Problems with plating vias closed

Dwight Mattix

Thu, 16 Oct 2008 08:39:11 -0700

71 lines

Re: Problems with plating vias closed

Dennis Fritz

Thu, 16 Oct 2008 11:26:14 -0400

80 lines

Re: Problems with plating vias closed

Dave Connitt

Thu, 16 Oct 2008 10:35:19 -0400

50 lines

Re: Problems with plating vias closed

Pete Houwen

Thu, 16 Oct 2008 08:36:12 -0500

26 lines

Re: Problems with plating vias closed

Dwight Mattix

Wed, 15 Oct 2008 12:48:49 -0700

67 lines

Re: Problems with plating vias closed

George Milad

Wed, 15 Oct 2008 14:24:01 EDT

36 lines

Problems with plating vias closed

Dave Connitt

Wed, 15 Oct 2008 13:56:40 -0400

38 lines

New Thread

Process question-Pls reply urgently....!

Re: Process question-Pls reply urgently....!

Werner Engelmaier /*

Wed, 15 Oct 2008 22:47:01 -0400

241 lines

Re: Process question-Pls reply urgently....!

Paymon Sani

Wed, 15 Oct 2008 17:09:56 -0400

279 lines

Re: Process question-Pls reply urgently....!

Lee Whiteman

Wed, 15 Oct 2008 13:52:31 -0400

211 lines

Re: Process question-Pls reply urgently....!

Paul Reid

Wed, 15 Oct 2008 13:47:14 -0400

142 lines

Re: Process question-Pls reply urgently....!

Werner Engelmaier /*

Wed, 15 Oct 2008 12:42:36 -0400

157 lines

Re: Process question-Pls reply urgently....!

Syed Ahmad

Wed, 15 Oct 2008 09:36:39 -0500

113 lines

Re: Process question-Pls reply urgently....!

Guy Ramsey

Tue, 14 Oct 2008 15:21:13 -0400

229 lines

Re: Process question-Pls reply urgently....!

Werner Engelmaier /*

Tue, 14 Oct 2008 15:19:52 -0400

83 lines

Re: Process question-Pls reply urgently....!

Jason Zhao

Tue, 14 Oct 2008 14:12:34 -0500

224 lines

Re: Process question-Pls reply urgently....!

Roger Stoops

Tue, 14 Oct 2008 15:03:21 -0400

234 lines

Re: Process question-Pls reply urgently....!

Roger Stoops

Tue, 14 Oct 2008 14:59:54 -0400

185 lines

Re: Process question-Pls reply urgently....!

Graham Collins

Tue, 14 Oct 2008 15:53:56 -0300

233 lines

Re: Process question-Pls reply urgently....!

anand paliwal

Tue, 14 Oct 2008 12:51:38 -0600

194 lines

Re: Process question-Pls reply urgently....!

Lee Whiteman

Tue, 14 Oct 2008 14:28:20 -0400

157 lines

Re: Process question-Pls reply urgently....!

Lee Whiteman

Tue, 14 Oct 2008 14:23:45 -0400

125 lines

Re: Process question-Pls reply urgently....!

Roger Stoops

Tue, 14 Oct 2008 14:22:02 -0400

117 lines

Re: Process question-Pls reply urgently....!

anand paliwal

Tue, 14 Oct 2008 12:18:45 -0600

86 lines

Re: Process question-Pls reply urgently....!

Douglas O. Pauls

Tue, 14 Oct 2008 13:08:02 -0500

76 lines

Process question-Pls reply urgently....!

anand paliwal

Tue, 14 Oct 2008 11:40:37 -0600

32 lines

New Thread

Register today! IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX

Register today! IPC/JEDEC Lead-Free Conference December 8-10, 2008 - Dallas, TX

Michelle Michelotti

Thu, 23 Oct 2008 15:56:01 -0500

70 lines

New Thread

ROHS, FLUX and FLuX CLEANING AGENT

Re: ROHS, FLUX and FLuX CLEANING AGENT

Ahne Oosterhof

Thu, 9 Oct 2008 10:19:31 -0700

64 lines

Re: ROHS, FLUX and FLuX CLEANING AGENT

jonathan noquil

Thu, 9 Oct 2008 15:06:38 +0800

36 lines

New Thread

Search for Viking 1630FS

Search for Viking 1630FS

Bill Clark

Wed, 15 Oct 2008 12:22:50 -0400

30 lines

New Thread

Seeking information on relaxation of FR4 under load over time

Re: Seeking information on relaxation of FR4 under load over time

John Burke

Mon, 6 Oct 2008 18:21:07 -0700

100 lines

Seeking information on relaxation of FR4 under load over time

- bogert

Mon, 6 Oct 2008 19:19:17 -0400

59 lines

New Thread

SMT dimensions guidelines, 1208

Re: SMT dimensions guidelines, 1208

Croslin, Robert

Thu, 9 Oct 2008 13:34:26 -0400

127 lines

Re: SMT dimensions guidelines, 1208

Lenny Carter

Thu, 9 Oct 2008 10:09:56 -0400

87 lines

Re: SMT dimensions guidelines, 1208

Donald Kyle

Thu, 9 Oct 2008 08:48:38 -0500

59 lines

SMT dimensions guidelines, 1208

Victor Hernandez

Thu, 9 Oct 2008 08:35:08 -0500

27 lines

New Thread

Sn-Bi Alloy for soldering

Re: Sn-Bi Alloy for soldering

<>

Thu, 9 Oct 2008 19:07:30 EDT

46 lines

Re: Sn-Bi Alloy for soldering

Mike Fenner

Wed, 8 Oct 2008 14:15:06 +0100

158 lines

Re: Sn-Bi Alloy for soldering

Whittaker, Dewey (EHCOE)

Tue, 7 Oct 2008 14:36:12 -0700

288 lines

Re: Sn-Bi Alloy for soldering

Lee Whiteman

Tue, 7 Oct 2008 17:12:36 -0400

109 lines

Re: Sn-Bi Alloy for soldering

Thayer, Wayne

Tue, 7 Oct 2008 16:08:49 -0400

299 lines

Re: Sn-Bi Alloy for soldering

Douglas O. Pauls

Tue, 7 Oct 2008 14:55:08 -0500

228 lines

Re: Sn-Bi Alloy for soldering

David D. Hillman

Tue, 7 Oct 2008 14:00:25 -0500

189 lines

Sn-Bi Alloy for soldering

Kane, Amol (349)

Tue, 7 Oct 2008 11:56:56 -0400

58 lines

New Thread

Solder fillet

Re: Solder fillet

Mike Fenner

Wed, 29 Oct 2008 11:51:00 -0000

147 lines

Re: Solder fillet

[log in to unmask]

Wed, 29 Oct 2008 09:02:33 +0530

89 lines

Re: Solder fillet

Robert Kondner

Tue, 28 Oct 2008 10:45:34 -0400

188 lines

Re: Solder fillet

Steve Gregory

Tue, 28 Oct 2008 09:31:58 -0500

75 lines

Re: Solder fillet

Stadem, Richard D.

Tue, 28 Oct 2008 08:54:43 -0500

58 lines

Solder fillet

[log in to unmask]

Tue, 28 Oct 2008 16:07:47 +0530

29 lines

New Thread

Solder Paste Height Measurement System

Re: Solder Paste Height Measurement System

Brandon Judd

Fri, 17 Oct 2008 10:49:49 -0400

70 lines

Re: Solder Paste Height Measurement System

Stadem, Richard D.

Wed, 15 Oct 2008 15:34:08 -0500

56 lines

Solder Paste Height Measurement System

Robin John

Wed, 15 Oct 2008 15:06:41 -0500

31 lines

New Thread

SOLDERING BERYLLIUM COPPER

Re: SOLDERING BERYLLIUM COPPER

Mike Fenner

Wed, 8 Oct 2008 14:03:28 +0100

81 lines

Re: SOLDERING BERYLLIUM COPPER

Inge

Tue, 7 Oct 2008 12:27:09 -0700

146 lines

Re: SOLDERING BERYLLIUM COPPER

Roberts, Jon

Tue, 7 Oct 2008 11:08:53 -0500

132 lines

Re: SOLDERING BERYLLIUM COPPER

Inge

Tue, 7 Oct 2008 08:56:32 -0700

73 lines

SOLDERING BERYLLIUM COPPER

Roberts, Jon

Tue, 7 Oct 2008 09:47:16 -0500

41 lines

New Thread

Soldering to Aluminum?

Re: Soldering to Aluminum?

Mike Fenner

Fri, 31 Oct 2008 09:31:15 -0000

267 lines

Re: Soldering to Aluminum?

Joyce Koo

Thu, 30 Oct 2008 12:37:34 -0400

269 lines

Re: Soldering to Aluminum?

Paul Edwards

Thu, 30 Oct 2008 09:13:35 -0700

272 lines

Re: Soldering to Aluminum?

Mike Fenner

Thu, 30 Oct 2008 09:30:15 -0000

113 lines

Re: Soldering to Aluminum?

Mike Fenner

Thu, 30 Oct 2008 09:21:43 -0000

173 lines

Re: Soldering to Aluminum?

John Burke

Wed, 29 Oct 2008 15:19:39 -0700

103 lines

Re: Soldering to Aluminum?

Dave Dixon

Wed, 29 Oct 2008 16:17:08 -0500

73 lines

Re: Soldering to Aluminum?

Phil Nutting

Wed, 29 Oct 2008 11:34:39 -0400

82 lines

Re: Soldering to Aluminum?

Eric CHRISTISON

Wed, 29 Oct 2008 15:09:50 +0000

69 lines

Soldering to Aluminum?

Pete Houwen

Wed, 29 Oct 2008 09:00:54 -0500

37 lines

New Thread

Standards for Component Cleanliness

Re: Standards for Component Cleanliness

Bob Willis

Mon, 13 Oct 2008 13:03:47 +0100

132 lines

Re: Standards for Component Cleanliness

Mike Fenner

Mon, 13 Oct 2008 09:36:11 +0100

73 lines

Re: Standards for Component Cleanliness

Joyce Koo

Fri, 10 Oct 2008 02:05:19 -0400

96 lines

Re: Standards for Component Cleanliness

Brian Ellis

Fri, 10 Oct 2008 08:58:26 +0300

83 lines

Standards for Component Cleanliness

Bev Christian

Thu, 9 Oct 2008 12:03:27 -0400

40 lines

New Thread

SunStar 991

SunStar 991

Tan Geok Ang

Fri, 24 Oct 2008 15:58:19 +0800

31 lines

New Thread

Technical query: Land Patterns SMD

Re: Technical query: Land Patterns SMD

Tan Geok Ang

Fri, 10 Oct 2008 13:49:17 +0800

117 lines

Re: Technical query: Land Patterns SMD

Mankeekar Tushar

Fri, 10 Oct 2008 10:24:46 +0530

88 lines

Technical query: Land Patterns SMD

Mankeekar Tushar

Fri, 10 Oct 2008 10:23:39 +0530

77 lines

New Thread

Throughhole Equipment Training

Re: Throughhole Equipment Training

Ken Bloomquist

Tue, 28 Oct 2008 10:04:47 -0800

128 lines

Re: Throughhole Equipment Training

Raye Rivera

Tue, 28 Oct 2008 09:36:17 -0500

51 lines

Re: Throughhole Equipment Training

Steve Gregory

Mon, 27 Oct 2008 13:19:21 -0500

155 lines

Throughhole Equipment Training

Karen Capps

Mon, 27 Oct 2008 13:25:21 -0400

86 lines

New Thread

Underfill, Cause

Re: Underfill, Cause

Tan Geok Ang

Tue, 28 Oct 2008 11:59:50 +0800

59 lines

Re: Underfill, Cause

Werner Engelmaier /*

Sun, 26 Oct 2008 14:06:21 EDT

48 lines

Re: Underfill, Cause

Werner Engelmaier /*

Fri, 24 Oct 2008 10:31:35 -0400

125 lines

Underfill, Cause

Tan Geok Ang

Thu, 23 Oct 2008 09:29:47 +0800

42 lines

New Thread

Upcoming Power Conversion Conference Featuring New Industry Standard

Upcoming Power Conversion Conference Featuring New Industry Standard

Michelle Michelotti

Mon, 6 Oct 2008 13:58:49 -0500

92 lines

New Thread

Vapor Phase Soldering - The way Forward?

Re: Vapor Phase Soldering - The way Forward?

Stadem, Richard D.

Thu, 16 Oct 2008 14:43:48 -0500

175 lines

Re: Vapor Phase Soldering - The way Forward?

Lee parker

Thu, 16 Oct 2008 15:39:59 -0400

180 lines

Re: Vapor Phase Soldering - The way Forward?

Werner Engelmaier /*

Thu, 16 Oct 2008 15:28:44 -0400

145 lines

Re: Vapor Phase Soldering - The way Forward?

Lee Whiteman

Thu, 16 Oct 2008 14:25:18 -0400

123 lines

Re: Vapor Phase Soldering - The way Forward?

Stadem, Richard D.

Thu, 16 Oct 2008 08:44:05 -0500

88 lines

Re: Vapor Phase Soldering - The way Forward?

Brian Ellis

Thu, 16 Oct 2008 16:28:09 +0300

59 lines

Vapor Phase Soldering - The way Forward?

Eric CHRISTISON

Thu, 16 Oct 2008 13:57:27 +0100

63 lines

New Thread

Wave soldering temperature profile question

Re: Wave soldering temperature profile question

Phillip Bavaro

Mon, 6 Oct 2008 09:38:28 -0700

173 lines

Re: Wave soldering temperature profile question

Alan Kreplick

Mon, 6 Oct 2008 06:48:15 -0400

100 lines

Re: Wave soldering temperature profile question

Werner Engelmaier /*

Sat, 4 Oct 2008 10:36:35 -0400

112 lines

Wave soldering temperature profile question

- bogert

Sat, 4 Oct 2008 07:36:59 -0400

37 lines

New Thread

What is NADCAP ?

Re: What is NADCAP ?

Mike Fenner

Thu, 9 Oct 2008 12:56:31 +0100

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Re: What is NADCAP ?

Inge

Mon, 6 Oct 2008 12:54:56 -0700

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Re: What is NADCAP ?

Whittaker, Dewey (EHCOE)

Mon, 6 Oct 2008 10:38:22 -0700

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