"Snake Board"... (13 Messages)
"Snake Board"...an epilog. (4 Messages)
0402 SOLDERING (3 Messages)
0603 Resistors failing after Reflow (3 Messages)
2AP10 (1 Message)
Annular ring (1 Message)
Annular solder land size (2 Messages)
Antw: [TN] Lead-free Component Finishes (10 Messages)
Antw: [TN] SiPad (3 Messages)
AOI innerlayers (1 Message)
AOIs, scan technology vs Camera (1 Message)
Autoclave Manufacturers (3 Messages)
B.B.T Testing (2 Messages)
B.E.S.T. Inc (2 Messages)
Bare Board Fab: Flex Material Shortage? (4 Messages)
Bare board test services (6 Messages)
basic info on soldering (6 Messages)
Battery contamination ??? (4 Messages)
bean bags for wave soldering (5 Messages)
Blind Via Rework!!! (2 Messages)
Board rework (3 Messages)
bracelets (6 Messages)
Breaking of capacitor (5 Messages)
BT (1 Message)
Carbon on board. (2 Messages)
CC Mechanical stress (4 Messages)
Celeco CP Direct plating process (3 Messages)
Ceramic Capacitor Board Edge Clearance (3 Messages)
CID Allegro Designer Needed (3 Messages)
Comment on Wave Solder Profile Method (3 Messages)
Conductor Cuts -- Question about using Epoxy (3 Messages)
conformal coat over no clean flux residue (13 Messages)
copper etchant (3 Messages)
CSP vs HASL (1 Message)
CTE Evaluation (2 Messages)
current density (4 Messages)
Dedicated Equipment (4 Messages)
Drill Bit Geometry Defects (2 Messages)
electrical test fixtures.. (3 Messages)
Electro Plate Circuitry. (1 Message)
eless copper (6 Messages)
EOL (11 Messages)
EOL- second (1 Message)
Epoxy Potting - Leaks (2 Messages)
Equivalence between IPC-A-600 and BS 123200 & BS 123300 ? (1 Message)
etest environment.. (3 Messages)
excellon communication cables.. (1 Message)
exellon servers.. (1 Message)
Expired and Moisture sensitive parts. (4 Messages)
Feedershop (2 Messages)
Flip chip BGA substrate pad finish (1 Message)
Fracture toughness of ENIG interface (2 Messages)
Front End Questions (1 Message)
GERBER files (6 Messages)
In-Line Cleaners (Aqueous Wash) (5 Messages)
Inner Wall Defect (6 Messages)
Integrated Circuit Internal Bond Wire Failures - Seeking Information Concerning (4 Messages)
Intelligent Cad Data. (2 Messages)
Internal annular ring size vs drill bit size selection (1 Message)
IPC 610 Interpretation (4 Messages)
IPC News Release--IPC and JEDEC Leading the Way to Lead Free (1 Message)
IPC Seeking Industry Experts for Lead Free Conferences (1 Message)
IPC specifications question (4 Messages)
IPC-1710 (2 Messages)
IPC-275 to IPC-2221 (1 Message)
IPC-610 Rev D (3 Messages)
IPC-7721 (Procedure 3.5.1) (2 Messages)
IPC-DR-572 (4 Messages)
It's Less Than 4 Weeks to IPC Expo/APEX/Designers Summit in Anaheim (1 Message)
J-Stnd-001 Section 8.31 (Particulate Matter) (5 Messages)
Karen Walters/USA/Skyworks is out of the office. (1 Message)
Lead Free time line +++ reflow oven requirements for lead free. (1 Message)
Lead-free Component Finishes (18 Messages)
lifted lead (3 Messages)
List of Fuji Equipment Capabilities (2 Messages)
Low level shiny copper spots after cupric chloride etchi ng (2 Messages)
Low level shiny copper spots after cupric chloride etching (7 Messages)
Matte vs. Gloss Finish for Solder Mask (3 Messages)
Mechanical stress on ceramic chip caps (3 Messages)
Minimum External Annular Ring (1 Message)
MSD Question (6 Messages)
Multiline Bushings.. (1 Message)
Nitrogen vs Compressed Air (4 Messages)
No Clean solder paste note for Telecom/Networking products (4 Messages)
No Of PCB/PWB Rework (2 Messages)
OSP surface finish (1 Message)
OT: Custom Cable Assemblies (13 Messages)
Paste Height Measurement Systems 2D and 3D (6 Messages)
Paste inspection on the stencilprinter (6 Messages)
PBGA Void/pin holes (9 Messages)
PC Board Thickness Requirements (4 Messages)
PCB compliant to lead free (1 Message)
PCB Material (2 Messages)
PCB warp (8 Messages)
plasma (3 Messages)
Production Chairs tearing up the Epoxy floor. (12 Messages)
Project Management Software Recommendations (9 Messages)
Pros and cons of switching from 55110 to 31032 (5 Messages)
Qualification of a lead-free process (4 Messages)
Qualified Suppliers (1 Message)
Randall L Bock/MSD/US/PBI is out of the office. (1 Message)
RE : [TN] Comment on Wave Solder Profile Method (1 Message)
References for ADot Design Engineering (2 Messages)
reflowing 0402 SMT capacitors with underside termination s (3 Messages)
reflowing 0402 SMT capacitors with underside terminations (2 Messages)
Sample boards and assemblies sought for X-Ray laminography study (1 Message)
Silver Palladium Termination (5 Messages)
SiPad (2 Messages)
Six Sigma Course (2 Messages)
SMT definitions (3 Messages)
Snake Board Part II? (5 Messages)
SNEC Mtg (1 Message)
Soaking Circuit Boards in Alcohol (8 Messages)
Solder Mask Defects - What casue it. (2 Messages)
Solder Mask Defects - What cause it. (1 Message)
Solder mask touch up (1 Message)
Solder Sticking To SS Screws (9 Messages)
spare parts for bilco.. (1 Message)
Stress measurement on PCB (4 Messages)
Subject: Re: [TN] Equivalence between IPC-A-600 and BS 123200 & BS 123300 ? (1 Message)
Tape and Reel MFG. (3 Messages)
Test points (1 Message)
Testing on MLCC clearance for depaneling (1 Message)
thermal cycle coupons (3 Messages)
Thermal Profiling systems (7 Messages)
Thin core stripping machine for flex (2 Messages)
Underfill for TCE Problem (2 Messages)
Using / qualifying Indium 92H Solder Paste (1 Message)
Valerie St Cyr/Bos/Teradyne is out of the office. (2 Messages)
wave solder reflow (1 Message)
Wave soldering 1825 ceramic caps (2 Messages)
What are the recommendations of PCB surface finishing for (0.5mm pitch) CSP pacakge component ? (5 Messages)
white no clean flux residue (3 Messages)
Why Dry film Solder Masks? (6 Messages)
[TN] reflowing 0402 SMT capacitors with underside termination s (1 Message)