LEADFREE Archives

November 2003

Leadfree@IPC.ORG
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New Thread Al K Heid/Twinsburg/RA/Rockwell is out of the office.
Al K Heid/Twinsburg/RA/Rockwell is out of the office.
Al K. Heid
Thu, 27 Nov 2003 02:42:21 -0500
New Thread Automated Reply from Dario Sanchez <dsanchez>
Automated Reply from Dario Sanchez <dsanchez>
Dario Sanchez
Wed, 19 Nov 2003 20:30:43 -0600
New Thread Call for Papers: 2004 IEEE International Symposium on Electronics and the Environment
Call for Papers: 2004 IEEE International Symposium on Electronics and the Environment
Eric Williams
Thu, 20 Nov 2003 11:49:35 +0900
New Thread Cheryl Tulkoff/AUS/NIC is out of the office.
Re: Cheryl Tulkoff/AUS/NIC is out of the office.
Billy Bharath
Thu, 27 Nov 2003 10:48:14 +0200
Cheryl Tulkoff/AUS/NIC is out of the office.
Cheryl Tulkoff
Thu, 27 Nov 2003 01:01:31 -0600
New Thread Clavius Chin/TH/Asia/Celestica is out of the office.
Clavius Chin/TH/Asia/Celestica is out of the office.
Clavius Chin
Thu, 20 Nov 2003 14:15:18 +0700
New Thread IPC Listserv to be down Nov 14-Nov 16
IPC Listserv to be down Nov 14-Nov 16
<>
Thu, 13 Nov 2003 14:05:20 -0500
IPC Listserv to be down Nov 14-Nov 16
Keach Sasamori
Thu, 13 Nov 2003 13:02:17 -0600
New Thread Lead free and product design
Re: Lead free and product design
MA/NY DDave
Thu, 20 Nov 2003 22:50:58 -0600
Re: Lead free and product design
Bob Willis
Sat, 8 Nov 2003 10:03:11 -0000
Re: Lead free and product design
Thomi
Fri, 7 Nov 2003 23:33:43 +0100
Lead free and product design
Tempea, Ioan
Fri, 7 Nov 2003 10:06:27 -0500
New Thread Lead free compliant laminates
Re: Lead free compliant laminates
MA/NY DDave
Sun, 30 Nov 2003 21:24:22 -0600
Re: Lead free compliant laminates
Reuven ROKAH
Thu, 27 Nov 2003 09:31:55 +0200
Re: Lead free compliant laminates
Ofer Cohen
Wed, 26 Nov 2003 12:54:15 +0200
Lead free compliant laminates
Ofer Cohen
Wed, 26 Nov 2003 12:47:02 +0200
New Thread Lead Free SMT Circuit Board Assembly Workmanship Sp ec
Re: FW: Lead Free SMT Circuit Board Assembly Workmanship Sp ec
Whittaker, Dewey (AZ75)
Fri, 21 Nov 2003 14:18:12 -0700
New Thread Lead Free SMT Circuit Board Assembly Workmanship Spec
Re: Lead Free SMT Circuit Board Assembly Workmanship Spec
MA/NY DDave
Sun, 30 Nov 2003 21:45:17 -0600
Re: Lead Free SMT Circuit Board Assembly Workmanship Spec
Bob Willis
Mon, 24 Nov 2003 16:44:17 -0000
FW: Lead Free SMT Circuit Board Assembly Workmanship Spec
Vu, Tiffany
Fri, 21 Nov 2003 13:02:28 -0800
Lead Free SMT Circuit Board Assembly Workmanship Spec
Vu, Tiffany
Fri, 21 Nov 2003 12:55:38 -0800
New Thread Lead-free workshops
Lead-free workshops
Werner Engelmaier
Mon, 17 Nov 2003 07:57:29 EST
New Thread New member and question on EU regulation
Re: New member and question on EU regulation
Kay Nimmo
Mon, 3 Nov 2003 08:51:10 -0000
New Thread New to the group : Lead free landpatterns question
Re: New to the group : Lead free landpatterns question
MA/NY DDave
Mon, 3 Nov 2003 16:56:09 -0600
Re: New to the group : Lead free landpatterns question
Brian Ellis
Mon, 3 Nov 2003 14:14:45 +0200
Re: New to the group : Lead free landpatterns question
Bob Willis
Mon, 3 Nov 2003 12:01:35 -0000
Re: New to the group : Lead free landpatterns question
Brian Ellis
Mon, 3 Nov 2003 13:52:25 +0200
Re: New to the group : Lead free landpatterns question
Bob Willis
Mon, 3 Nov 2003 09:52:09 -0000
Re: New to the group : Lead free landpatterns question
Rene Maas
Mon, 3 Nov 2003 09:10:32 +0100
Re: New to the group : Lead free landpatterns question
Reuven ROKAH
Sun, 2 Nov 2003 09:15:44 +0200
Re: New to the group : Lead free landpatterns question
MA/NY DDave
Sat, 1 Nov 2003 00:01:00 -0600
New Thread Processing pure tin component
Re: Processing pure tin component
No Name
Thu, 6 Nov 2003 10:26:05 EST
Re: Processing pure tin component
Tenison Stone
Thu, 6 Nov 2003 09:15:31 -0600
Re: Processing pure tin component
Hilty, Robert D
Thu, 6 Nov 2003 10:17:25 -0500
Re: Processing pure tin component
Bev Christian
Thu, 6 Nov 2003 10:12:05 -0500
Processing pure tin component
Tenison Stone
Thu, 6 Nov 2003 09:00:18 -0600
New Thread Reliability data for 99.7Sn/0.7Cu soldering Pd/Ag thick film board
Re: Reliability data for 99.7Sn/0.7Cu soldering Pd/Ag thick film board
Shangguan, Dongkai, Ph.D.
Tue, 25 Nov 2003 10:50:53 -0800
Re: Reliability data for 99.7Sn/0.7Cu soldering Pd/Ag thick film board
Mike Fenner
Tue, 25 Nov 2003 13:23:34 -0000
Reliability data for 99.7Sn/0.7Cu soldering Pd/Ag thick film board
Zhang Yong Ming
Mon, 24 Nov 2003 13:28:49 +0800
New Thread Silver finish out Immersion Tin in???
Re: Silver finish out Immersion Tin in???
MA/NY DDave
Sun, 30 Nov 2003 22:15:47 -0600
Re: Silver finish out Immersion Tin in???
lee parker
Mon, 17 Nov 2003 08:54:52 -0500
Re: Silver finish out Immersion Tin in???
Bob Willis
Sun, 16 Nov 2003 11:33:02 -0000
Silver finish out Immersion Tin in???
Reuven ROKAH
Sun, 16 Nov 2003 13:13:26 +0200
New Thread SMT Reflow flip Reflow Yields
Re: SMT Reflow flip Reflow Yields
Bob Willis
Wed, 19 Nov 2003 19:01:28 -0000
Re: SMT Reflow flip Reflow Yields
Bob Willis
Wed, 19 Nov 2003 12:03:27 -0000
SMT Reflow flip Reflow Yields
Robert Hills
Tue, 18 Nov 2003 13:11:55 +1300
New Thread [Autoreply] Re: [LF] Cheryl Tulkoff/AUS/NIC is out of the office.
[Autoreply] Re: [LF] Cheryl Tulkoff/AUS/NIC is out of the office.
<>
Thu, 27 Nov 2003 07:55:34 +0100

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