Hi Ofer,

Base of my and others present experience,

1.    FR 4 170 Tg is good enough for multi layers boards.
2.    The same answer
3.    Yes.
4.    No in general, may be fine tuning will be needed.


Best  Regards

ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
                 ISRAEL
Tel: 972-3-9266734    Mobile:972-55-786734
Fax: 972-3-9266480
e mail: [log in to unmask]



                      Ofer Cohen
                      <Ofer.Cohen@SEABRIDGENE         To:      [log in to unmask]
                      TWORKS.COM>                     cc:
                      Sent by: Leadfree               Subject: Re: [LF] Lead free compliant laminates
                      <[log in to unmask]>


                      26/11/2003 12:54
                      Please respond to
                      "(Leadfree Electronics
                      Assembly Forum)";
                      Please respond to Ofer
                      Cohen





> Hello all,
        Sorry for the missing information:  As we are starting the
development of a long-term cost sensitive project. The product will be
characterized by thick PCB (2.7 to 3.3 mm), aspect ration 10:1 and data
rate
of over 3 GB.
>  , I have to place in the design guidelines requirements for the lead
free
> technology.
>
> Can you please advise:
> 1.    Which laminates will survive dual-reflow + 2 repair thermal cycle?
> We are looking for the cheapest possible materials, preferably based on
> glass-epoxy.
> 2.    Are the compliant laminate already in stable production? If not -
> when?
> 3.    Do these laminates have the same electrical characteristics
> (breakdown voltage, electrical losses, Dk) as the FR4?
> 4.    Do the new pastes have different specifications from the stencil?
> pads design?
>
> Regards
> Ofer Cohen
> Manager - Quality Assurance, Reliability and Production Technologies
> Seabridge LTD
>
>

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