I saw the same thing with TI palladium leads using that paste.  Hint:
try other brands of water soluble paste.  I found it was not related to
profiles or aging of components.

>-----Original Message-----
>From:  Rick Thompson [SMTP:[log in to unmask]]
>Sent:  Friday, October 02, 1998 8:39 AM
>To:    [log in to unmask]
>Subject:       [TN] Soldering Palladium plated leads
>
>Hi,
>
>With all the current discussion of solderability issues, I'm hoping some of
>you may be able to apply your expertise and give me some insight into a
>problem we seem to consistently have.  When soldering components with
>palladium plated leads, we do not seem to get any wetting on the leads.  It
>kind of looks like the 'footprint in mud' affect.  On pcb's where we have
>this condition, all other components have soldered fine with good fillets
>and wetting.  Checks of the oven profile indicate a good profile for the
>paste we're using (Kester R598, water soluble).  Currently we've only found
>this on components from TI, so I don't know if it's only their components or
>the plating in general.
>
>Question: Are there any recommendations for profile, paste, process, etc.
>that differ from 'standards' when working with these types of components?
>
>Thanks.
>
>                Rick Thompson
>                Ventura Electronics Assembly
>                2665A Park Center Dr.
>                Simi Valley, CA 93065
>
>            [log in to unmask]
>
>                (805) 584-9858 voice
>                (805) 584-1529 fax
>
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