I saw the same thing with TI palladium leads using that paste. Hint: try other brands of water soluble paste. I found it was not related to profiles or aging of components. >-----Original Message----- >From: Rick Thompson [SMTP:[log in to unmask]] >Sent: Friday, October 02, 1998 8:39 AM >To: [log in to unmask] >Subject: [TN] Soldering Palladium plated leads > >Hi, > >With all the current discussion of solderability issues, I'm hoping some of >you may be able to apply your expertise and give me some insight into a >problem we seem to consistently have. When soldering components with >palladium plated leads, we do not seem to get any wetting on the leads. It >kind of looks like the 'footprint in mud' affect. On pcb's where we have >this condition, all other components have soldered fine with good fillets >and wetting. Checks of the oven profile indicate a good profile for the >paste we're using (Kester R598, water soluble). Currently we've only found >this on components from TI, so I don't know if it's only their components or >the plating in general. > >Question: Are there any recommendations for profile, paste, process, etc. >that differ from 'standards' when working with these types of components? > >Thanks. > > Rick Thompson > Ventura Electronics Assembly > 2665A Park Center Dr. > Simi Valley, CA 93065 > > [log in to unmask] > > (805) 584-9858 voice > (805) 584-1529 fax > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following >text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section >for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or >847-509-9700 ext.312 >################################################################ > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################