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Mon, 5 Oct 1998 06:41:09 -0600 |
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I saw the same thing with TI palladium leads using that paste. Hint:
try other brands of water soluble paste. I found it was not related to
profiles or aging of components.
>-----Original Message-----
>From: Rick Thompson [SMTP:[log in to unmask]]
>Sent: Friday, October 02, 1998 8:39 AM
>To: [log in to unmask]
>Subject: [TN] Soldering Palladium plated leads
>
>Hi,
>
>With all the current discussion of solderability issues, I'm hoping some of
>you may be able to apply your expertise and give me some insight into a
>problem we seem to consistently have. When soldering components with
>palladium plated leads, we do not seem to get any wetting on the leads. It
>kind of looks like the 'footprint in mud' affect. On pcb's where we have
>this condition, all other components have soldered fine with good fillets
>and wetting. Checks of the oven profile indicate a good profile for the
>paste we're using (Kester R598, water soluble). Currently we've only found
>this on components from TI, so I don't know if it's only their components or
>the plating in general.
>
>Question: Are there any recommendations for profile, paste, process, etc.
>that differ from 'standards' when working with these types of components?
>
>Thanks.
>
> Rick Thompson
> Ventura Electronics Assembly
> 2665A Park Center Dr.
> Simi Valley, CA 93065
>
> [log in to unmask]
>
> (805) 584-9858 voice
> (805) 584-1529 fax
>
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