"John Sater" <[log in to unmask]> Wrote:
|
| Hello Techneters
|
| I wonder what are the advantages of DSTF which make this
| type of
| copper finish gaining so much popularity?
|
| Thanks,
|
| JS
|


John, the theoretical advantages are increased adhesion of dry film to the
plated topography which is usually the side applied to the B stage to make
laminate, lower profile for etch at the copper-laminate interface, and
possibly reduced cleaning costs.  Polyclad, Nelco, AlliedSignal, etc. can
provide technical literature discussing DSTF or RTF.  It is not necessarily a
drop in product.  Precleaning is different, lamination can be different, hold
times, rework, and possibly oxide are  processes that need to be optimized.


Jana Carraway
Maxtek -- the Maxim/Tektronix Multichip Module facility
tel 503.627.2063, fax 503.627.4651
email [log in to unmask],  www.maxtek.com

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