"John Sater" <[log in to unmask]> Wrote: | | Hello Techneters | | I wonder what are the advantages of DSTF which make this | type of | copper finish gaining so much popularity? | | Thanks, | | JS | John, the theoretical advantages are increased adhesion of dry film to the plated topography which is usually the side applied to the B stage to make laminate, lower profile for etch at the copper-laminate interface, and possibly reduced cleaning costs. Polyclad, Nelco, AlliedSignal, etc. can provide technical literature discussing DSTF or RTF. It is not necessarily a drop in product. Precleaning is different, lamination can be different, hold times, rework, and possibly oxide are processes that need to be optimized. Jana Carraway Maxtek -- the Maxim/Tektronix Multichip Module facility tel 503.627.2063, fax 503.627.4651 email [log in to unmask], www.maxtek.com ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################