Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Wed, 14 Jan 1998 11:57:07 -0800 |
Content-Type: | text/plain |
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Try print, then dispense glue, p/p and
reflow. Glue will freeze components prior reflow. If this is too
much hassle for you, tinker with your temp profile. A slower
heat absorption rate provides a better heat distribution and
equilibrium, so tombstoning phenomenon will be reduced.
M. Park
>>> <[log in to unmask]> January 14, 1998
8:12 am >>>
We have been experiencing problems with tombstoning of
1210 caps. I
have not been able to find any information about parts this
large
tombstoning. Is there any way to fix this problem while
we are
waiting for a design change to the pad layout?
Any help on this subject will be greatly appreciated.
Sean Gearin
[log in to unmask]
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