Try print, then dispense glue, p/p and
reflow.  Glue will freeze components prior reflow.  If this is too
much hassle for you, tinker with your temp profile.  A slower
heat absorption rate provides a better heat distribution and
equilibrium, so tombstoning phenomenon will be reduced.

M. Park

>>> <[log in to unmask]> January 14, 1998
8:12 am >>>
     We have been experiencing problems with tombstoning of
1210 caps.  I
     have not been able to find any information about parts this
large
     tombstoning.  Is there any way to fix this problem while
we are
     waiting for a design change to the pad layout?

     Any help on this subject will be greatly appreciated.

     Sean Gearin
     [log in to unmask]

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